Disclosed is a composition for formation of a mold, which is used in a method for producing a nanostructure by removing a portion of a thin film formed on the surface of a mold, and removing the mold, the composition including an organic compound, which has a hydrophilic group and has a molecular weight of 500 or more.
몰드 표면에 형성된 박막의 일부를 제거하고, 몰드를 제거하여 나노구조체를 제조하는 방법에 사용되는 몰드 형성용 조성물로서, 친수성기이고 분자량이 500 이상이다.