Microgrippers based on electrothermal actuation were designed and fabricated using the deep reactive ion etching (DRIE) process with 100mum thick silicon on insulator (SOI) wafer. The design requirements are restricted to basic manipulation tasks such as pick and place, and nonprehensile manipulation. This paper explores several electrothermal end-effectors which have been fabricated for serial and parallel microassembly. The end-effectors include three main building blocks: 1) Integrated and symmetrical actuators of V and U shapes. The symmetrical expansions on Chevron and hot arms allow combination of forward translations that amplify angular motion at the tips of a gripper. 2) A joule heating element based on a resistive V-shape electrothermal actuator. In 3D microassembly, the joining of a micropart is essentially performed by providing an integrated microheater device. 3) A force or position feedback sensing block based on self-straining or electrostatic principle. The integrated sensor can be calibrated for both position and force measurements. Serial heterogeneous assembly of meso and micro-scale objects is demonstrated using a 3D microassembly station. Black-box dynamical models for microgrippers are derived using experimentally obtained data, and performance variations due to the way the microgrippers are mounted onto the robot are discussed.
['Mohammad Mayyas', 'Ping Zhang', 'Woo Ho Lee', 'Panos S. Shiakolas', 'Dan O. Popa']
Design Tradeoffs for Electrothermal Microgrippers