In high volume manufacturing, conventional approach to deal with inverse-temperature dependence (ITD) and aging is to add a postsilicon flat voltage guard band to all dies based on testing a small random sample of dies. Although this scheme guarantees error-free operation, it significantly degrades energy efficiency, as it penalize all dies for the maximum delay degradation due to ITD and aging as seen by the worst case die, while also assuming maximum aging condition. In this paper, a graphics execution core implemented in 22 nm trigate process uses per-die tunable replica circuit (TRC) to monitor delay degradation due to ITD and actual aging conditions. TRC triggers adaptive voltage scaling to dynamically adjust    $V_{\mathrm {CC}}$    as needed during run time to maintain correct operation at minimum additional voltage. Measured data show up to 33% (14%) energy savings at 0.4 V (0.8 V) compared with baseline scheme. The TRC is also utilized in a dynamic power gating (DPG) scheme to lower energy overhead due to fast droop guard band. DPG introduces a load line effect during normal operation, thus saving energy, while deactivating this load line upon droop detection by the TRC to maintain ISO performance as baseline. Silicon data show that DPG can improve energy efficiency by 14.5% (7%) at 0.8 V (0.6 V).
['Minki Cho', 'Stephen T. Kim', 'Carlos Tokunaga', 'Charles Augustine', 'Jaydeep P. Kulkarni', 'Krishnan Ravichandran', 'James W. Tschanz', 'Muhammad M. Khellah', 'Vivek De']
Postsilicon Voltage Guard-Band Reduction in a 22 nm Graphics Execution Core Using Adaptive Voltage Scaling and Dynamic Power Gating