Conventional single-die microelectronic packages on a printed circuit board have been with us for a long time. These electronic packages provide a means of interconnecting, powering, cooling, and protecting integrated circuit chips. Today, system-in-package (SiP) provides a variety of packaging requirements for computer, consumer, aerospace, military, and medical electronic applications by stacking individual IC chips to form 3D circuits. This packaging technology offers reduced form factor to enhance high performance and reliability. The guest editors discuss some of the obstacles SiP technology must overcome for wider use and how this special issue addresses those obstacles.
['Bruce C. Kim', 'Yervant Zorian']
Guest Editors' Introduction: Big Innovations in Small Packages