Multi-site testing is a popular and effective way to increase test throughput and reduce test costs. We present a test throughput model, in which we focus on wafer testing, and consider parameters like test time, index time, abort-on-fail, and contact yield. Conventional multi-site testing requires sufficient ATE resources, such as ATE channels, to allow the test of multiple SOCs in parallel. In this paper, we design and optimize on-chip DfT in order to maximize the test throughput for a given SOC and ATE. The onchip DfT consists of an E-RPCT wrapper, and, for modular SOCs, module wrappers and TAMs. We present experimental results for a Philips SOC and several ITC'02 SOC test benchmarks.
['Sandeep Kumar Goel', 'Erik Jan Marinissen']
On-Chip Test Infrastructure Design for Optimal Multi-Site Testing of System Chips