A methodology for an accurate modeling of a die-to-board transition using one-port measurements is presented in this paper. This methodology aims to build a valid model from DC to 110 GHz, applicable to any package transition and regardless of the technology used for the die. The package transition model is extracted using an Open-Short-Load (OSL) based algorithm and ElectroMagnetic simulations corrected from specific measurements. This methodology is used for the Fan-out Wafer-Level Package (WLP) modeling of an encapsulated 77 GHz automotive radar transceiver. The experimental characterization of this transceiver confirms the package model accuracy up to 110 GHz.
['Charaf-eddine Souria', 'Thierry Parra', 'Gilles Montoriol', 'Christophe Landez']
Accurate package model extraction up to 110 GHz using one-port measurements. Application to a 77 GHz radar transceiver