In modern integrated systems, interconnect and thermal management technologies have become two major limitations to system performance. In this paper, a number of technologies are presented to address these challenges. First, low-loss polymer-embedded vias are demonstrated in thick wafers compatible with microfluidics. Next, fluidic I/Os for delivery of fluid to microfluidic heat sinks are demonstrated in assembled 2.5D and 3D stacks. Then thermal coupling between dice in 2.5D and 3D systems is explored. Lastly, the utility of microfluidic cooling is demonstrated through an FPGA, built in a 28nm process, with a monolithically integrated microfluidic heat sink.
['Thomas E. Sarvey', 'Yang Zhang', 'Li Zheng', 'Paragkumar A. Thadesar', 'Ravi Gutala', 'Colman Cheung', 'Arifur Rahman', 'Muhannad S. Bakir']
Embedded cooling technologies for densely integrated electronic systems