This paper presents a review of the solutions proposed for chip-to-chip communication based on capacitive coupling. Circuit designs, assembly options and various different test cases are presented in this work. It is shown that this 3D technology is capable of transferring digital data between two dies at high-speed with low power consumption, and likewise analog signals without the need for any extra-wafer processing. The results presented highlight the key features of capacitive coupling when compared to other 3D interconnections and justify the effort to overcome some open issues and make it a marketable technology.
['Roberto Cardu', 'Mauro Scandiuzzo', 'Salvatore Valerio Cani', 'Luca Perugini', 'Eleonora Franchi', 'Roberto Canegallo', 'Roberto Guerrieri']
Chip-to-chip communication based on capacitive coupling