A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, intellectual properties (IPs) are developed, and interconnection networks which can make the use of IPs are proposed and evaluated based on the real chip implementation. The new proposed elevator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control is less than 3%-4%.
['Akio Nomura', 'Hiroki Matsutani', 'Tadahiro Kuroda', 'Junichiro Kadomoto', 'Yusuke Matsushita', 'Hideharu Amano']
Vertical Packet Switching Elevator Network Using Inductive Coupling ThruChip Interface