High performance communications applications have made technology choices more important than ever. Silicon Germanium (SiGe) BiCMOS has enabled the widespread introduction of many these applications by providing superior cost and integration capability, compared to III-V solutions and, relative to RFCMOS, one can attain better time to market. BiCMOS integration approaches for high performance and cost performance NPN modules and state of the art passive elements are discussed as well as future technology directions.
['James S. Dunn', 'David L. Harame', 'Alvin J. Joseph', 'Stephen A. St. Onge', 'Natalie B. Feilchenfeld', 'Louis D. Lanzerotti', 'Bradley A. Orner', 'Ephrem G. Gebreselasie', 'Jeffrey B. Johnson', 'Douglas D. Coolbaugh', 'Richard J. Rassel', 'Marwan H. Khater']
SiGe BiCMOS Trends - Today and Tomorrow