The radiation and surface wave losses may give rise to electromagnetic interference (EMI) problems in high speed VLSI interconnects. Over and above this there will be dielectric and conductor losses. These losses have been evaluated for multilevel interconnects by finite difference time domain (FDTD) technique. The crosstalk between lines in the same level as well as in different levels and propagation delays are also found.
['P. K. Datta', 'Subrata Sanyal', 'D. Bhattacharya']
Losses in Multilevel Crossover in VLSI Interconnects