Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: A physical model for the design of the por distribution networks in three-dimensional integrated circuits is proposed. The tradeoffs among the different design parameters are specified and analyzed. Different case studies are explored, indicating that smaller and denser TSVs can deliver por more efficiently as compared to larger and coarsely distributed TSVs. The interplay beten the TSV count and the intra-plane por distribution network in reducing the por supply noise is also shown.
['Ioannis Tsioutsios', 'Vasilis F. Pavlidis', 'Giovanni De Micheli']
I am writing a research paper on a idea Physical design tradeoffs in power distribution networks for 3-D ICs
[{"from": "human", "value": "I am writing a research paper on a idea Physical design tradeoffs in power distribution networks for 3-D ICs"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: A physical model for the design of the por distribution networks in three-dimensional integrated circuits is proposed. The tradeoffs among the different design parameters are specified and analyzed. Different case studies are explored, indicating that smaller and denser TSVs can deliver por more efficiently as compared to larger and coarsely distributed TSVs. The interplay beten the TSV count and the intra-plane por distribution network in reducing the por supply noise is also shown."}]