Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely:   study the impact of low thermal budget process on design quality in monolithic 3D ICs (M3D). Specifically,  quantify how much the tier-to-tier transistor performance difference affects full-chip por and performance metrics in a foundry 14nm FinFET technology. Our study first shows that 5%, 10%, and 15% top-tier device degradation in a wire-dominated, timing-closed monolithic 3D IC design leads to 7%, 12%, and 18% full-chip timing violation, respectively. Next,  address this impact with our CAD solution named Tier-Aware M3D (TA-M3D) flow that identifies potential timing-critical paths and partitions them into the faster (bottom) tier to minimize the top-tier degradation impact. One unique challenge in timing closure in this case, is how to conduct buffering and sizing on the paths that lie entirely in the top or bottom-tier as ll as those that span both tiers. Our approach handles all 3 types of paths carefully and closes timing under the given top-tier degradation assumption, while minimizing the total por consumption. Our enhanced monolithic 3D IC designs, even with 5%, 10%, and 15% slor transistors in the top-tier, still offers 26%, 24%, and 5% por savings over 2D IC, respectively. Our study also covers other types of circuits.
['Sandeep Kumar Samal', 'Deepak Nayak', 'Motoi lchihashi', 'Srinivasa Banna', 'Sung Kyu Lim']
I am writing a research paper on a idea How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions
[{"from": "human", "value": "I am writing a research paper on a idea How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely:   study the impact of low thermal budget process on design quality in monolithic 3D ICs (M3D). Specifically,  quantify how much the tier-to-tier transistor performance difference affects full-chip por and performance metrics in a foundry 14nm FinFET technology. Our study first shows that 5%, 10%, and 15% top-tier device degradation in a wire-dominated, timing-closed monolithic 3D IC design leads to 7%, 12%, and 18% full-chip timing violation, respectively. Next,  address this impact with our CAD solution named Tier-Aware M3D (TA-M3D) flow that identifies potential timing-critical paths and partitions them into the faster (bottom) tier to minimize the top-tier degradation impact. One unique challenge in timing closure in this case, is how to conduct buffering and sizing on the paths that lie entirely in the top or bottom-tier as ll as those that span both tiers. Our approach handles all 3 types of paths carefully and closes timing under the given top-tier degradation assumption, while minimizing the total por consumption. Our enhanced monolithic 3D IC designs, even with 5%, 10%, and 15% slor transistors in the top-tier, still offers 26%, 24%, and 5% por savings over 2D IC, respectively. Our study also covers other types of circuits."}]