Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely:  propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform smoothness (2) 3D numerical solution with improved spectral formulation (3) 3D nonlinear pre-conditioner for convergence acceleration (4) interleaved 2D-3D placement for efficiency enhancement. Our placer outperforms the leading work mPL6-3D and NTUplace3-3D with 6.44% and 37.15% shorter wirelength, 9.11% and 10.27% fer 3D vertical interconnects (VI) on average of IBM-PLACE circuits. Validation on the large-scale modern mixed-size (MMS) 3D circuits shows high performance and scalability.
['Jingwei Lu', 'Hao Zhuang', 'Ilgweon Kang', 'Pengwen Chen', 'Chung-Kuan Cheng']
I am writing a research paper on a idea ePlace-3D: Electrostatics based Placement for 3D-ICs
[{"from": "human", "value": "I am writing a research paper on a idea ePlace-3D: Electrostatics based Placement for 3D-ICs"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely:  propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform smoothness (2) 3D numerical solution with improved spectral formulation (3) 3D nonlinear pre-conditioner for convergence acceleration (4) interleaved 2D-3D placement for efficiency enhancement. Our placer outperforms the leading work mPL6-3D and NTUplace3-3D with 6.44% and 37.15% shorter wirelength, 9.11% and 10.27% fer 3D vertical interconnects (VI) on average of IBM-PLACE circuits. Validation on the large-scale modern mixed-size (MMS) 3D circuits shows high performance and scalability."}]