Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Computing modules in typical datacenter nodes or server racks consist of several multicore chips either on a board or in a System-in-Package (SiP) environment. State-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the destination chip over a wireline interconnect fabric. This multihop communication increases energy consumption while decreasing data bandwidth in a multichip system. Also, traditional I/O does not scale ll with technology generations due to limitations of pitch. Moreover, intra-chip and inter-chip communication protocol within such a multichip system is often decoupled to facilitate design flexibility. Hover, a seamless interconnection beten on-chip and off-chip data transfer can improve the communication efficiency significantly. Here,  propose the design of a seamless hybrid wired and wireless interconnection network for multichip systems with dimensions spanning up to tens of centimeters with on-chip wireless transceivers.  demonstrate with cycle accurate simulations that such a design increases the bandwidth and reduces the energy consumption in comparison to state-of-the-art wireline I/O based multichip communication.
['Shahriar Shamim', 'Naseef Mansoor', 'Rounak Singh Narde', 'Vignesh Kothandapani', 'Amlan Ganguly', 'Jayanti Venkataraman']
I am writing a research paper on a idea A Wireless Interconnection Framework for Seamless Inter and Intra-Chip Communication in Multichip Systems
[{"from": "human", "value": "I am writing a research paper on a idea A Wireless Interconnection Framework for Seamless Inter and Intra-Chip Communication in Multichip Systems"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Computing modules in typical datacenter nodes or server racks consist of several multicore chips either on a board or in a System-in-Package (SiP) environment. State-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the destination chip over a wireline interconnect fabric. This multihop communication increases energy consumption while decreasing data bandwidth in a multichip system. Also, traditional I/O does not scale ll with technology generations due to limitations of pitch. Moreover, intra-chip and inter-chip communication protocol within such a multichip system is often decoupled to facilitate design flexibility. Hover, a seamless interconnection beten on-chip and off-chip data transfer can improve the communication efficiency significantly. Here,  propose the design of a seamless hybrid wired and wireless interconnection network for multichip systems with dimensions spanning up to tens of centimeters with on-chip wireless transceivers.  demonstrate with cycle accurate simulations that such a design increases the bandwidth and reduces the energy consumption in comparison to state-of-the-art wireline I/O based multichip communication."}]