Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Heat removal and por delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-vias (T-TSVs) and micro-fluidic channel (MFC) based liquid cooling. In case of por delivery, a highly complex por distribution network is required to deliver currents reliably to all parts of the 3D stacked IC while suppressing the por supply noise to an acceptable level. Hover, these thermal and por networks pose major challenges in signal routability and congestion. This is because the signal, por, and thermal interconnects are all competing for routing space. ,  present a co-optimization methodology for the signal, por, and thermal interconnects for 3D stacked ICs based on design of experiments (DOE) and response surface method (RSM). The goal is to improve performance, thermal, noise, and congestion metrics with our holistic approach.  also provide in-depth comparison beten T-TSV and MFC based cooling method and discuss how to employ DOE and RSM to best co-optimize the multi-functional interconnects simultaneously. Categories and Subject Descriptors B.7.2 [Hardware]: Integrated Circuits-Design Aids General Terms Design, Reliability
['Young-Joon Lee', 'Rohan Goel', 'Sung Kyu Lim']
I am writing a research paper on a idea Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
[{"from": "human", "value": "I am writing a research paper on a idea Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Heat removal and por delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-vias (T-TSVs) and micro-fluidic channel (MFC) based liquid cooling. In case of por delivery, a highly complex por distribution network is required to deliver currents reliably to all parts of the 3D stacked IC while suppressing the por supply noise to an acceptable level. Hover, these thermal and por networks pose major challenges in signal routability and congestion. This is because the signal, por, and thermal interconnects are all competing for routing space. ,  present a co-optimization methodology for the signal, por, and thermal interconnects for 3D stacked ICs based on design of experiments (DOE) and response surface method (RSM). The goal is to improve performance, thermal, noise, and congestion metrics with our holistic approach.  also provide in-depth comparison beten T-TSV and MFC based cooling method and discuss how to employ DOE and RSM to best co-optimize the multi-functional interconnects simultaneously. Categories and Subject Descriptors B.7.2 [Hardware]: Integrated Circuits-Design Aids General Terms Design, Reliability"}]