Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: In this work the effect of different bonding temperatures on the thermal stability of anisotropic conductive films (ACFs) was investigated. A thermogravimetric analyzer (TGA) was utilized to determine the thermal decomposition temperature of ACF. The experimental results shod that the temperature for maximum decomposition rate of ACF, Tm decreased with increasing bonding temperature. The results obtained from Fourier transform infrared spectroscopy (FTIR), which was used to examine the curing degree and also chemical changes in the ACF, shod some networks scissoring happened on C–N bond during the bonding process. This was the main reason why the ACF bonded at high temperature 225.0 C, gave relatively low thermal stability. Four point probe was used to measure the contact resistance performance before and after thermal aging at 260 and 300 C. The contact resistance results suggested that ACF bonded with 10 s at 205.0 C, yielding a curing degree of 85.0% was the best bonding parameter to obtain a low contact resistance after thermal aging. FTIR results shod there was a significant increase in the absorbance peak of carbonyl group after thermal aging. Thermal oxidation reactions which re taken place at high bonding and aging temperature had broken the polymer networks in the ACF and caused electrical failure. 2003 Elsevier Ltd. All rights reserved.
['S. C. Tan', 'Y. C. Chan', 'Y. W. Chiu', 'Chee Wei Tan']
I am writing a research paper on a idea Thermal stability performance of anisotropic conductive film at different bonding temperatures
[{"from": "human", "value": "I am writing a research paper on a idea Thermal stability performance of anisotropic conductive film at different bonding temperatures"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: In this work the effect of different bonding temperatures on the thermal stability of anisotropic conductive films (ACFs) was investigated. A thermogravimetric analyzer (TGA) was utilized to determine the thermal decomposition temperature of ACF. The experimental results shod that the temperature for maximum decomposition rate of ACF, Tm decreased with increasing bonding temperature. The results obtained from Fourier transform infrared spectroscopy (FTIR), which was used to examine the curing degree and also chemical changes in the ACF, shod some networks scissoring happened on C\u2013N bond during the bonding process. This was the main reason why the ACF bonded at high temperature 225.0 C, gave relatively low thermal stability. Four point probe was used to measure the contact resistance performance before and after thermal aging at 260 and 300 C. The contact resistance results suggested that ACF bonded with 10 s at 205.0 C, yielding a curing degree of 85.0% was the best bonding parameter to obtain a low contact resistance after thermal aging. FTIR results shod there was a significant increase in the absorbance peak of carbonyl group after thermal aging. Thermal oxidation reactions which re taken place at high bonding and aging temperature had broken the polymer networks in the ACF and caused electrical failure. 2003 Elsevier Ltd. All rights reserved."}]