Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: With technology scaling of semiconductor devices and further growth of the integrated circuit (IC)1 design and function complexity, the package size has shrank down proportionally too. Hence, flip-chip solder bump mounting is the current semiconductor devices trend to replace the wire bonding technology.#R##N##R##N#When come to PFA2 on the flip-chip devices with solder bump, t etch for solder bump removal is an essential method. Upon using t etch methodology; it is very dependent on etching timing and the chemical aggressiveness to get a good removal result for the solder bump. If there is an excessive period in etching or chemical reacts too aggressively, chemical over-etched on bond pad will occur. It is very unfavorable for FA3 engineer to perform subsequent reverse engineering on the bond pad over-etched device.#R##N##R##N#, the application of laser deprocessing technique is proposed to solve the bond pad over-etched issue. This proposed technique is a quick and reversal way in deprocessing technique for defect identification in PFA.
['H. H. Yap', 'Pik Kee Tan', 'Lei Zhu', 'H. Feng', 'Y. Z. Zhao', 'R. He', 'H. Tan', 'B. Liu', 'Y. M. Huang', 'D. D. Wang', 'J. Lam', 'Z. H. Mai']
I am writing a research paper on a idea Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue
[{"from": "human", "value": "I am writing a research paper on a idea Application of laser deprocessing technique in PFA on chemical over-etched on bond-pad issue"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: With technology scaling of semiconductor devices and further growth of the integrated circuit (IC)1 design and function complexity, the package size has shrank down proportionally too. Hence, flip-chip solder bump mounting is the current semiconductor devices trend to replace the wire bonding technology.#R##N##R##N#When come to PFA2 on the flip-chip devices with solder bump, t etch for solder bump removal is an essential method. Upon using t etch methodology; it is very dependent on etching timing and the chemical aggressiveness to get a good removal result for the solder bump. If there is an excessive period in etching or chemical reacts too aggressively, chemical over-etched on bond pad will occur. It is very unfavorable for FA3 engineer to perform subsequent reverse engineering on the bond pad over-etched device.#R##N##R##N#, the application of laser deprocessing technique is proposed to solve the bond pad over-etched issue. This proposed technique is a quick and reversal way in deprocessing technique for defect identification in PFA."}]