Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: State-of-the-art integral-equation-based solvers rely on techniques that can perform a matrix-vector multiplication in  O ( N ) complexity. In this work, a fast inverse of linear complexity was developed to solve a dense system of linear equations directly for the capacitance extraction of any arbitrary shaped 3D structure. The proposed direct solver has demonstrated clear advantages over state-of-the-art solvers such as FastCap and HiCap; with fast CPU time and modest memory consumption, and without sacrificing accuracy. It successfully inverts a dense matrix that involves more than one million unknowns associated with a large-scale on-chip 3D interconnect embedded in inhomogeneous materials. Moreover,  have successfully applied the proposed solver to full-wave extraction.
['Wenwen Chai', 'Dan Jiao', 'Cheng-Kok Koh']
I am writing a research paper on a idea A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction
[{"from": "human", "value": "I am writing a research paper on a idea A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: State-of-the-art integral-equation-based solvers rely on techniques that can perform a matrix-vector multiplication in  O ( N ) complexity. In this work, a fast inverse of linear complexity was developed to solve a dense system of linear equations directly for the capacitance extraction of any arbitrary shaped 3D structure. The proposed direct solver has demonstrated clear advantages over state-of-the-art solvers such as FastCap and HiCap; with fast CPU time and modest memory consumption, and without sacrificing accuracy. It successfully inverts a dense matrix that involves more than one million unknowns associated with a large-scale on-chip 3D interconnect embedded in inhomogeneous materials. Moreover,  have successfully applied the proposed solver to full-wave extraction."}]