Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: 3D technologies offer significant potential to improve total performance and performance per unit of por. After exploiting TSV technologies for cost reduction and increasing memory bandwidth, the next frontier is to create sophisticated logic on logic solutions that promise further increases in performance/por beyond those attributable to memory interfaces alone. These include heterogeneous integration for computing and exploitation of the high amounts of 3D interconnect available to reduce total interconnect por. Challenges include access for prototype quantities and the design of sophisticated static and dynamic thermal management methods and technologies, as ll as test.
['Paul D. Franzon', 'Eric Rotenberg', 'James Tuck', 'W. Rhett Davis', 'Huiyang Zhou', 'Joshua Schabel', 'Zhenqian Zhang', 'J. Brandon Dwiel', 'Elliott Forbes', 'Joonmoo Huh', 'Steve Lipa']
I am writing a research paper on a idea Computing in 3D
[{"from": "human", "value": "I am writing a research paper on a idea Computing in 3D"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: 3D technologies offer significant potential to improve total performance and performance per unit of por. After exploiting TSV technologies for cost reduction and increasing memory bandwidth, the next frontier is to create sophisticated logic on logic solutions that promise further increases in performance/por beyond those attributable to memory interfaces alone. These include heterogeneous integration for computing and exploitation of the high amounts of 3D interconnect available to reduce total interconnect por. Challenges include access for prototype quantities and the design of sophisticated static and dynamic thermal management methods and technologies, as ll as test."}]