Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: With the latest gaming systems such as X-box, Playstation 3, PSP, IPTV, and H264 requiring more bandwidth, packaged in smaller devices, and providing higher quality, in return they evacuate more heat and consume more por, thus making por consumption and thermal dissipation a major issue for chip designers in the nanometer era.Thermal effects on the chip and package is the next wave. First, there was signal integrity. Then por integrity and now, there is a new first-order effect in the horizon for IC and system designers called thermal integrity. And the traditional design methodology of using uniform temperature across the chip is becoming woefully inadequate and provides insufficient data to the package and system designers, unable to meet the requirement and demands of the consumer. To better understand the impact of temperature variation on chip's performance, both por distribution and package characteristics must be considered in the design and analysis flow. Likewise, a realistic view of the heat distribution across the chip is becoming essential for package and system designers. What makes the analysis of signal, por, and thermal integrity effects challenging is that they must all be considered concurrently across the entire chip, which requires novel approaches to mitigate the issue.The panel will discuss how urgent is the impact of thermal integrity on system designs and is this a real concern or are  making it up?When and under what condition will it become urgent, and is it related to process nodes, low por applications, type of packaging used, etc.? Is there specific design techniques used for more specific multimedia processing? Can you separate the IC design from package and system designs with some assumptions or is co-design the only way? How accurate is the industry's understanding of the physics of the chip (device), interconnect, and package? Is thermal integrity a first order or second order effect?Given the other variations from nominal, how important is this.The moderator will conclude with a summary of the panelist comments and be able to make a forward-looking statement about the future of por and heat and their impact on system design.
['D. Nadamudi', 'M. Clancy', 'A. Yang', 'J. Dela Cruz', 'R. Chandra', 'Srividya Santhanam', 'S. Burke', 'Uming Ko']
I am writing a research paper on a idea Entering the hot zone: can you handle the heat and be cool?
[{"from": "human", "value": "I am writing a research paper on a idea Entering the hot zone: can you handle the heat and be cool?"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: With the latest gaming systems such as X-box, Playstation 3, PSP, IPTV, and H264 requiring more bandwidth, packaged in smaller devices, and providing higher quality, in return they evacuate more heat and consume more por, thus making por consumption and thermal dissipation a major issue for chip designers in the nanometer era.Thermal effects on the chip and package is the next wave. First, there was signal integrity. Then por integrity and now, there is a new first-order effect in the horizon for IC and system designers called thermal integrity. And the traditional design methodology of using uniform temperature across the chip is becoming woefully inadequate and provides insufficient data to the package and system designers, unable to meet the requirement and demands of the consumer. To better understand the impact of temperature variation on chip's performance, both por distribution and package characteristics must be considered in the design and analysis flow. Likewise, a realistic view of the heat distribution across the chip is becoming essential for package and system designers. What makes the analysis of signal, por, and thermal integrity effects challenging is that they must all be considered concurrently across the entire chip, which requires novel approaches to mitigate the issue.The panel will discuss how urgent is the impact of thermal integrity on system designs and is this a real concern or are  making it up?When and under what condition will it become urgent, and is it related to process nodes, low por applications, type of packaging used, etc.? Is there specific design techniques used for more specific multimedia processing? Can you separate the IC design from package and system designs with some assumptions or is co-design the only way? How accurate is the industry's understanding of the physics of the chip (device), interconnect, and package? Is thermal integrity a first order or second order effect?Given the other variations from nominal, how important is this.The moderator will conclude with a summary of the panelist comments and be able to make a forward-looking statement about the future of por and heat and their impact on system design."}]