Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Self-heating and high-operating temperature are major concerns in 3-D-chip integration. ,  leverage a 3-D test chip (WideIO dynamic random access memory on top of a logic die) equipped with temperature sensors and heaters to explore thermal effects and to develop advanced thermal modeling strategies suitable for complex 3-D-stacked circuits.  correlate temperature measurements with the por dissipated by the heaters using model learning techniques. Moreover,  defined a thermal basis function obtained using por and thermal data available from the on-chip sensors. This function can be used to predict temperatures at chip locations far from the temperature sensors and to infer the por dissipation at any location of the chip. In addition, the same thermal basic function can be used jointly with formal interpolation frameworks like radial basis function methods to effectively estimate the full-chip thermal map. Results show that this methodology outperforms existing interpolation approaches for sparse integrated sensors.
['Francesco Beneventi', 'Andrea Bartolini', 'Pascal Vivet', 'Luca Benini']
I am writing a research paper on a idea Thermal Analysis and Interpolation Techniques for a Logic + WideIO Stacked DRAM Test Chip
[{"from": "human", "value": "I am writing a research paper on a idea Thermal Analysis and Interpolation Techniques for a Logic + WideIO Stacked DRAM Test Chip"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Self-heating and high-operating temperature are major concerns in 3-D-chip integration. ,  leverage a 3-D test chip (WideIO dynamic random access memory on top of a logic die) equipped with temperature sensors and heaters to explore thermal effects and to develop advanced thermal modeling strategies suitable for complex 3-D-stacked circuits.  correlate temperature measurements with the por dissipated by the heaters using model learning techniques. Moreover,  defined a thermal basis function obtained using por and thermal data available from the on-chip sensors. This function can be used to predict temperatures at chip locations far from the temperature sensors and to infer the por dissipation at any location of the chip. In addition, the same thermal basic function can be used jointly with formal interpolation frameworks like radial basis function methods to effectively estimate the full-chip thermal map. Results show that this methodology outperforms existing interpolation approaches for sparse integrated sensors."}]