Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely:  presents a simple yet effective method to analyze process variations using statistics on manufacturing in-line data without assuming any explicit underlying model for process variations. Our method is based on a variant of principal component analysis and is able to reveal systematic variation patterns existing on a die-to-die and wafer-to-wafer level individually. The separation of die variation from wafer variation can enhance the understanding of a nature of the process uncertainty. Our case study based on the proposed decomposition method shows that the dominating die-to-die variation and wafer-to-wafer variation represent 31% and 25% of the total variance of a large set of in-line parameters in 65nm SOI CMOS technology
['Choongyeun Cho', 'Daeik Kim', 'Jonghae Kim', 'Jean-Olivier Plouchart', 'Daihyun Lim', 'Sangyeun Cho', 'Robert Trzcinski']
I am writing a research paper on a idea A Data-Driven Statistical Approach to Analyzing Process Variation in 65nm SOI Technology
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