Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: As transistor dimensions are shrinking into regions of only a few atomic layers, designers are faced with various problems including increased reliability and por issues. Since these problems are amplified by higher circuit temperatures, this paper proposes an approach for the fine-grained modeling of temperature distribution in many-core systems based on Networks-on-Chip. With this model, algorithms can be developed that consider the significant impact of temperature ─ e.g. on performance, por or reliability. To simulate the dynamic nature of temperature, the thermal properties of according integrated systems are modeled through the instantiation of equivalent RC-circuits. This approach exploits the dualism beten electrical and thermal flows of energy. Finally, an application with system control for task mapping and por management exemplifies the proposed simulation methodology.
['Andreas Tockhorn', 'Claas Cornelius', 'Hagen Saemrow', 'Dirk Timmermann']
I am writing a research paper on a idea Modeling temperature distribution in Networks-on-Chip using RC-circuits
[{"from": "human", "value": "I am writing a research paper on a idea Modeling temperature distribution in Networks-on-Chip using RC-circuits"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: As transistor dimensions are shrinking into regions of only a few atomic layers, designers are faced with various problems including increased reliability and por issues. Since these problems are amplified by higher circuit temperatures, this paper proposes an approach for the fine-grained modeling of temperature distribution in many-core systems based on Networks-on-Chip. With this model, algorithms can be developed that consider the significant impact of temperature \u2500 e.g. on performance, por or reliability. To simulate the dynamic nature of temperature, the thermal properties of according integrated systems are modeled through the instantiation of equivalent RC-circuits. This approach exploits the dualism beten electrical and thermal flows of energy. Finally, an application with system control for task mapping and por management exemplifies the proposed simulation methodology."}]