Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Interconnection structures in FPGAs increasingly contribute more to the delay and por consumption. Three-dimensional (3-D) chip stacking is touted as the silver bullet technology that can keep Moore's momentum and fuel the next wave of consumer electronics products. Hover, the benefits of such a technology have not been sufficiently explored yet.  introduces a novel 3-D FPGA, where logic, memory and I/O resources are assigned to different layers. Experimental results prove the efficiency of our architecture for a wide range of application domains, since  achieve average performance improvement and por saving of 30% and 10%, respectively.
['Harry Sidiropoulos', 'Kostas Siozios', 'Dimitrios Soudris']
I am writing a research paper on a idea A framework for architecture-level exploration of 3-D FPGA platforms
[{"from": "human", "value": "I am writing a research paper on a idea A framework for architecture-level exploration of 3-D FPGA platforms"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Interconnection structures in FPGAs increasingly contribute more to the delay and por consumption. Three-dimensional (3-D) chip stacking is touted as the silver bullet technology that can keep Moore's momentum and fuel the next wave of consumer electronics products. Hover, the benefits of such a technology have not been sufficiently explored yet.  introduces a novel 3-D FPGA, where logic, memory and I/O resources are assigned to different layers. Experimental results prove the efficiency of our architecture for a wide range of application domains, since  achieve average performance improvement and por saving of 30% and 10%, respectively."}]