Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: A W-band direct-detection-based receiver front-end for millimeter-wave passive imaging in a 0.18-μm BiCMOS process is presented. The proposed system is comprised of a direct-detection front-end architecture employing a balanced LNA with an embedded Dicke switch, por detector, and baseband circuitry. The use of a balanced LNA with an embedded Dicke switch minimizes front-end noise figure, resulting in a great imaging resolution. The receiver chip achieves a measured responsivity of 20-43 MV/W with a front-end 3-dB bandwidth of 26 GHz, while consuming 200 mW. The calculated NETD of the SiGe receiver chip is 0.4 K with a 30 ms integration time. This work demonstrates the possibility of silicon-based system-on-chip solutions as lor cost alternatives to compound semiconductor multi-chip imaging modules.
['Leland Gilreath', 'Vipul Jain', 'Payam Heydari']
I am writing a research paper on a idea Design and Analysis of a W-Band SiGe Direct-Detection-Based Passive Imaging Receiver
[{"from": "human", "value": "I am writing a research paper on a idea Design and Analysis of a W-Band SiGe Direct-Detection-Based Passive Imaging Receiver"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: A W-band direct-detection-based receiver front-end for millimeter-wave passive imaging in a 0.18-\u03bcm BiCMOS process is presented. The proposed system is comprised of a direct-detection front-end architecture employing a balanced LNA with an embedded Dicke switch, por detector, and baseband circuitry. The use of a balanced LNA with an embedded Dicke switch minimizes front-end noise figure, resulting in a great imaging resolution. The receiver chip achieves a measured responsivity of 20-43 MV/W with a front-end 3-dB bandwidth of 26 GHz, while consuming 200 mW. The calculated NETD of the SiGe receiver chip is 0.4 K with a 30 ms integration time. This work demonstrates the possibility of silicon-based system-on-chip solutions as lor cost alternatives to compound semiconductor multi-chip imaging modules."}]