Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Ubiquitous connectivity within devices ranging from miniature sensors to racks for cloud datacenters is critical to enabling the “Internet of Everything”. Industry predictions suggest that the number of IoE devices may reach 200 billion by 2020, further increasing the demands placed on high-speed networks. Por-efficient short-reach interconnect solutions will be required to support everything from sensor interfaces to mobile platforms to core computation. Furthermore, high-density chip-to-chip solutions will be required to support communication and computation associated with massively scaled data traffic, demanding the use of emerging technologies such as 2.5D/3D heterogeneous integration, and new high bandwidth memories. The combination of all of these requirements will demand new circuit and system architectures in the electrical, optical, and contactless arenas. This forum will explore advances in such emerging interconnect solutions for the Internet of Everything.
['Ichiro Fujimori', 'Martin Brox', 'Elad Alon', 'Pavan Kumar Hanumolu', 'Gerritt den Besten', 'Hideyuki Nosaka']
I am writing a research paper on a idea F4: Emerging short-reach and high-density interconnect solutions for internet of everything
[{"from": "human", "value": "I am writing a research paper on a idea F4: Emerging short-reach and high-density interconnect solutions for internet of everything"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: Ubiquitous connectivity within devices ranging from miniature sensors to racks for cloud datacenters is critical to enabling the \u201cInternet of Everything\u201d. Industry predictions suggest that the number of IoE devices may reach 200 billion by 2020, further increasing the demands placed on high-speed networks. Por-efficient short-reach interconnect solutions will be required to support everything from sensor interfaces to mobile platforms to core computation. Furthermore, high-density chip-to-chip solutions will be required to support communication and computation associated with massively scaled data traffic, demanding the use of emerging technologies such as 2.5D/3D heterogeneous integration, and new high bandwidth memories. The combination of all of these requirements will demand new circuit and system architectures in the electrical, optical, and contactless arenas. This forum will explore advances in such emerging interconnect solutions for the Internet of Everything."}]