Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: , the multi-walled carbon nanotube bundle (MWCNTB) based shielded through-silicon via (S-TSV) is proposed and the compact expression for the equivalent conductivity of MWCNTB ( σ  MWCNTB ) is deduced to calculate the resistance of MWCNTB based S-TSV (MS-TSV). Then, the electrical characteristics including the  S  parameters, attenuation constant and time delay are investigated. The results indicate that | S  21 | of MS-TSV increases with the increase of the outermost diameter of MWCNT and decrease of the thickness of the shielding layer. Compared with the copper filled S-TSV (CuS-TSV), the MS-TSV has a larger | S  21 |, smaller attenuation and shorter time delay. Finally, the impact of the geometrical parameters on the conductivity of MS-TSV is analyzed. Also, the minimum packing density of MWCNTB satisfying  σ  MWCNTB ≥ σ  Cu  has been deduced. The results show that the outermost diameter of MWCNT has the most significant impact on the conductivity of MS-TSV, and thicker MWCNT is helpful to increase the conductivity of MS-TSV, decrease the packing density of MWCNTB and reduce manufacturing difficulty.
['Jinrong Su', 'Runbo Ma', 'Xinwei Chen', 'Liping Han', 'Rongcao Yang', 'Wenmei Zhang']
I am writing a research paper on a idea Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle
[{"from": "human", "value": "I am writing a research paper on a idea Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: , the multi-walled carbon nanotube bundle (MWCNTB) based shielded through-silicon via (S-TSV) is proposed and the compact expression for the equivalent conductivity of MWCNTB ( \u03c3  MWCNTB ) is deduced to calculate the resistance of MWCNTB based S-TSV (MS-TSV). Then, the electrical characteristics including the  S  parameters, attenuation constant and time delay are investigated. The results indicate that | S  21 | of MS-TSV increases with the increase of the outermost diameter of MWCNT and decrease of the thickness of the shielding layer. Compared with the copper filled S-TSV (CuS-TSV), the MS-TSV has a larger | S  21 |, smaller attenuation and shorter time delay. Finally, the impact of the geometrical parameters on the conductivity of MS-TSV is analyzed. Also, the minimum packing density of MWCNTB satisfying  \u03c3  MWCNTB \u2265 \u03c3  Cu  has been deduced. The results show that the outermost diameter of MWCNT has the most significant impact on the conductivity of MS-TSV, and thicker MWCNT is helpful to increase the conductivity of MS-TSV, decrease the packing density of MWCNTB and reduce manufacturing difficulty."}]