Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: The performance of most digital systems today is limited by the interconnect latency beten logic and memory, rather than by the performance of logic or memory itself. Three-dimensional (3-D) integration using through-silicon-vias (TSVs) may provide a solution to overcome the scaling limitations by stacking multiple memory dies on top of a many-core die. ,  propose a Mesh-of-Trees (MoT) network to support high-throughput and low-latency communication beten processing cores and 3-D stacked multi-banked shared L2 data memory. Compared to conventional MoT network [5] that is straightforwardly adapted to 3-D integration, the experimental results show that the proposed network significantly improves the number of operations per second.  also investigate the architecture parameters of 3-D memory stacking (e.g., number of tiers to be stacked, TSV sharing, etc.) that affect the interconnection network as ll as the system performance and fabrication cost, which permits to explore trade-offs among different 3-D memory stacking architectures.
['Kyungsu Kang', 'Luca Benini', 'Giovanni De Micheli']
I am writing a research paper on a idea A high-throughput and low-latency interconnection network for multi-core Clusters with 3-D stacked L2 tightly-coupled data memory
[{"from": "human", "value": "I am writing a research paper on a idea A high-throughput and low-latency interconnection network for multi-core Clusters with 3-D stacked L2 tightly-coupled data memory"}, {"from": "gpt", "value": "Thats a unique idea.You should consider the following idea to enhance your idea so that it would impact uniquely: The performance of most digital systems today is limited by the interconnect latency beten logic and memory, rather than by the performance of logic or memory itself. Three-dimensional (3-D) integration using through-silicon-vias (TSVs) may provide a solution to overcome the scaling limitations by stacking multiple memory dies on top of a many-core die. ,  propose a Mesh-of-Trees (MoT) network to support high-throughput and low-latency communication beten processing cores and 3-D stacked multi-banked shared L2 data memory. Compared to conventional MoT network [5] that is straightforwardly adapted to 3-D integration, the experimental results show that the proposed network significantly improves the number of operations per second.  also investigate the architecture parameters of 3-D memory stacking (e.g., number of tiers to be stacked, TSV sharing, etc.) that affect the interconnection network as ll as the system performance and fabrication cost, which permits to explore trade-offs among different 3-D memory stacking architectures."}]