Taiwan Semi to start construction on new Japan fab in April: report
Taiwan Semiconductor (NYSE:TSM) is slated to start construction on its new wafer fab plant in Kumamoto, Japan in April, DIGITIMES reported.
The plant, which was announced in November 2021, is slated to begin production by the end of 2024 and will use the 22-nanometer and 28-nanometer processes.

It is expected that it will produce roughly 45,000 12-inch wafers, as the company looks to increase production amid a global shortage of semiconductors.
Taiwan Semi shares fell slightly more than 1% to $108.46 in early Thursday trading.
The news comes after it was reported last month that construction on its U.S.-based advanced chip plant was behind schedule, citing delays linked to the pandemic and an ongoing labor crunch.
Last month, Morgan Stanley upgraded Taiwan Semiconductor to overweight, citing several factors, including bigger opportunities from Apple (NASDAQ:AAPL), Intel (NASDAQ:INTC) and Sony (NYSE:SONY).