Intel unveils new glass material for data center, AI
Justin Sullivan

Intel (NASDAQ:INTC) unveiled on Monday a new glass substrate material to be used for advanced packaging, which it said will allow for the "continued scaling" of transistors and push Moore's Law for data-centric applications, including artificial intelligence.
The glass substrate allows for additional flatness and better thermal stability, resulting in a higher interconnect density. It will allow companies to create more high-density and higher performance chip packages, important, considering the power needs for AI workloads.

"We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come," Intel senior vice president and general manager of Assembly and Test Development Babak Sabi said in a statement.
Santa Clara, California-based Intel said it is on track to deliver the glass substrates to the market in the second half of the decade and keep pushing Moore's Law beyond 2030.
Intel (INTC) shares fell roughly 0.7% in pre-market trading on Monday.


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