Taiwan Semiconductor reportedly moves up packaging orders for AI demand
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Taiwan Semiconductor (NYSE:TSM) has reportedly moved up its orders for advanced packaging in an effort to fulfill the demand for processors geared towards artificial intelligence.
The company has increased orders for chip-on-wafer-on-substrate, or CoWoS, packaging to build GPUs for companies such as Nvidia (NVDA) and AMD (AMD), Taiwan Economic Daily reported.

The global foundry has had a difficult time keeping up with demand, especially for CoWos packaging due to production issues at its facilities, the news outlet added, pointing out that increase in CoWoS is on the order of some 30%.
The installation of the additional packaging is expected to occur near the end of the year, which could result in Taiwan Semiconductor (TSM) producing up to 30,000 wagers per month, or more than double its current production.
Taiwan Semiconductor (TSM) did not immediately respond to a request for comment from Seeking Alpha.
Taiwan Semiconductor (TSM) shares rose fractionally in late day trading on Monday.


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