Intel said to boost advanced chip packaging capacity four-fold by 2025
Justin Sullivan

Intel (NASDAQ:INTC) is reportedly going to increase its advanced advanced chip packaging capacity by at least four times by 2025, thanks to an increased global footprint.
The Santa Clara, California-based chip giant is using its new facility built in Penang, Malaysia to produce advanced 3D chip packaging, Nikkei reported.

Customers that will use the advanced chip packaging include Amazon (AMZN), Cisco Systems (CSCO) and the U.S. government, the news outlet added.
Speaking to reporters, Intel (INTC) corporate vice president for manufacturing supply chain and operations Robin Martin said Malaysia will eventually become the company's largest area for 3D chip packaging. No firm production date was given for the plant, however.
New forms of chip packaging have become increasingly important as power demands for chips increase, due in part to the rise of artificial intelligence.
Intel (INTC) shares rose around 1% in mid-day trading on Tuesday.


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