Qualcomm takes wraps off world's first advanced-ready 5G modem-RF chip
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On Wednesday, Qualcomm (NASDAQ:QCOM) unveiled the semiconductor industry's first advanced-ready 5G modem-RF chip that can be used not only in smartphones, but mixed reality headsets, 5G networks and other areas.
Led by CEO Cristiano Amon, Qualcomm (QCOM) said the Snapdragon X75 5G Modem-RF chip utilizes artificial intelligence thats two-and-a-half times faster than previous AI used and better software to bring faster connections to devices, while also allowing them to get better signal strength, data speed and coverage.
Qualcomm (QCOM) added that the chips can also be used in vehicles, an increasing component of the company's business, as well as PCs, factories and fixed wireless access networks. 
"Snapdragon X75 Modem-RF System demonstrates the full breadth of our global 5G leadership, with innovations such as hardware accelerated AI and the support for upcoming 5G Advanced capabilities, which unlock a whole new level of 5G performance and a new phase in cellular communications," said Qualcomm (QCOM) senior vice president Durga Malladi in a statement.
Qualcomm (QCOM) also showed off the Snapdragon X72 5G Modem-RF chip, to be used for mobile broadband applications and help boost download and upload speeds.
San Diego, California-based Qualcomm (QCOM) said the Snapdragon X75 is expected to be in commercial devices by the second-half of 2023.
On Tuesday, investment firm KeyBanc Capital Markets said Qualcomm (QCOM) was among the beneficiaries from increased Apple iPhone 14 supply.