Cadence Design expands partnership with Samsung Foundry on 3D-IC design
Cadence Design Systems (NASDAQ:CDNS) has expanded its collaboration with Samsung Foundry to accelerate 3D-IC design. 
TheÂ reference flow featuring the Cadence Integrity 3D-IC Platform is enabled for die-on-die 3D-IC stacking.
The Integrity 3D-IC platform supports the companyâs Intelligent System DesignÂ strategy, enabling SoC design excellence.
The move focuses on providing customers with optimal TSV placement in stacked die designs.
TheÂ users can devise an optimal 3D structure placement on a die, reducing area and wirelength penalties, while optimizing PPA for each die.