Tower semiconductor and Cadence expand collaboration to accelerate automotive IC development
Cadence Design Systems (NASDAQ:CDNS) and Tower Semiconductor (NASDAQ:TSEM) collaborates to advance automotive and mobile IC development. 
Through the collaboration, the companies are developing a new, comprehensive automotive reference design flow using the Cadence Virtuoso Design Platform and Spectre Simulation Platform to provide customers with a faster design cycle, maintaining comprehensive design verification for advanced automotive IC product development.

The unique design challenges and analysis characteristics of automotive ICs require a carefully crafted combination of technologies and methodologies in order to satisfy the demanding ISO 26262 specification
The collaboration is aimed at enabling mutual customers to design differentiated ICs optimized for cost and performance.
âOur long-term partnership and collaboration with Cadence has enabled us to continuously provide our customers with leading-edge design tools that allow the development of innovative analog ICs that have been co-optimized with the package they reside in,â said Russell Ellwanger, Tower Semiconductor CEO. 
 âThe mutual work weâre doing on the automotive reference flow focuses on enabling customers to develop critical automotive ICs, leveraging an integrated workflow using an all-Cadence toolset and a Tower reference design to develop compelling products faster.â said Dr. Anirudh Devgan, president and CEO of Cadence.