ASML CEO says first pilot EUV chipmaking tool to launch this year
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ASML Holding (NASDAQ:ASML) CEO Peter Wennink said the Dutch semiconductor equipment company would launch the first pilot of its upcoming tool this year as originally planned, amid concerns about supplier snafus.
"A few suppliers had some difficulties in actually ramping up and also giving us the right level of technological quality, so that led to some delay," Wennink said in an interview with Reuters.

The tool, which is nearly the size of a truck and costs more than 300M Euros, or $321M, uses extreme ultraviolet, or EUV, lithography technology and creates wafers significantly faster while also at a smaller scale.
Additionally, Wennink said that the company will generate more sales in dollar terms of its previous tool than the EUV machine this year, but that is expected to reverse next year as more EUV tools come online.
Chipmakers Taiwan Semiconductor (TSM), Intel (INTC) and Samsung (OTCPK:SSNLF) already use the previous version of ASML's (ASML) EUV tools.
ASML Holding (ASML) shares were up around 0.4% in mid-day trading on Tuesday.


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