UMC and Cadence join hands on 3D-IC hybrid bonding reference flow
United Microelectronics (NYSE:UMC) and Cadence Design Systems (NASDAQ:CDNS) collaborate on the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, certified for UMCâs chip stacking technologies.
Using UMCâs 40nm low power process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and intelligent bump creation with Cadenceâs Integrity 3D-IC platform.

The platform offers design planning, implementation and analysis of full 3D designs within a single, unified cockpit.
The reference flow also enables system-level layout versus schematic checking to connectivity accuracy, electric rule-checking for coverage and alignment checking, and thermal analysis for heat distribution in a 3D stacked-die design structure.
Shares of UMC are down 1.60% after-hours on Tuesday.