Taiwan Semiconductor inaugurates new R&D hub at home for next-gen semiconductors
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Taiwan Semiconductor Manufacturing (NYSE:TSM) inaugurated a global research and development (R&D) center in Hsinchu, Taiwan, to bring the next generations of semiconductor technology into reality.
The R&D Center â which has a floor space of 300K square meters â will serve as the new home for TSM's R&D organization, including researchers who will develop process technology at the 2-nanometer generation and beyond, plus research into novel materials and transistor structures.
The company noted that R&D employees are already relocating to their workplaces in the new building, and it will be ready for the full staff of over 7,000 by September.
Companies around the world have been trying to bolster or make their presence in the chip manufacturing arena following supply chain woes since the pandemic. Earlier this month, TSM noted that it plans to invest about T$90B ($2.87B) in an advanced packaging facility in northern Taiwan, as demand for AI heats up.
Chip rivals Advanced Micro Devices (AMD) and Intel (INTC) have also laid out plans to strengthen their semiconductor portfolio.
Intel intends to spend more than â¬30B, or roughly $33B, in Germany to build two semiconductor facilities as part of a larger â¬90B manufacturing expansion plan in Europe. Meanwhile, AMD CEO Lisa Su aims to consider other foundries besides TSM to improve its supply chain. Earlier today, the company announced its plans to invest approximately $400M in India over the next five years.
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