NXP Semiconductors team up with Foxconn on next generation vehicle platforms
NXP Semiconductors (NASDAQ:NXPI) said Wednesday it signed a memorandum of understanding with Hon Hai Technology (Foxconn) to jointly develop platforms for a new generation of smart connected vehicles.
The move will leverage NXPâs portfolio of automotive technologies and enable its architectural innovation and platforms for electrification, connectivity and safe automated driving.

The expanded collaboration is aimed at Foxconnâs efforts in electrical vehicle platforms, leveraging NXPâs system expertise and comprehensive electrification portfolio, from NXP S32 processors to analog-front-end, drivers, networking and power products.
NXP will also offer hardware and software support and will leverage the expertise of its well-rounded 3rd-party ecosystem in the areas of electrification, connectivity and automation.