Investigation of the bond between the greasy layer and the surface of the diamond circle after grinding the tungsten free hard alloys using the double etching method
Plates of tungsten free hard alloys are more difficult to process material in comparison with carbide-tipped plates of titanium-cobalt and tungsten-cobalt groups. As methods of processing for these materials, it is recommended to use electric diamond grinding by the method of double etching. In the process of processing, circles on metal bonds become salted and lose their working capacity. We have researched the study of the bond between the greasy layer and the surface of the diamond circle during the treatment of tungsten free hard alloys using the double etching method. During the investigation, a foreign layer was found on the surface of the circle, the contact of which with the body of the circle is very tight. Even with an increase of about 2000, it is almost impossible to determine the interface between the newly formed layer and the bundle of the circle. To confirm the presence and composition of the greasy layer, spectrograms were taken from two sample sections. They showed that: this layer consists of titanium, copper, molybdenum and tin. On the basis of the data obtained, it can be concluded that the formation of a greasy layer occurs under the influence of various physicochemical processes occurring at the contact boundary and has a diffusion-adhesive character.