Principles of software construction for electronic system thermal design
The paper considers conceptual issues on developing a multifunctional software package for thermal design of complex electronic systems. The software package is intended to carry out mathematical and computer analysis of the nonlinear unsteady-state stochastic and determine thermal processes and temperature distributions in electronic systems of any structural complexity and the impact of destabilizing factors. A multifunctional software package should provide a graphical representation of both source data and computer modeling results in the form of tables, graphs, diagrams, etc. Computational algorithms that implement mathematical models should be written and optimized both for personal computers and supercomputer systems through their paralleling using Message Passing Interface (MPI) or Open Multi-Processing (OpenMP). The basic programming language for developing the developed software package is C#. It provides a cross-platform, development speed and convenience, support for selective optimization in C++ and C. An integrated development environment is Microsoft Visual Studio that runs only Microsoft Windows platform. It is possible to run development programs in Linux or Mac OS X using non-Microsoft.NET implementations like Mono. The authors consider the architecture of the developed software package divided into three levels. They are: a presentation level, a business logical level, and a database level that allows effective optimizing the software package, extending its functionality and supporting several platforms like Mac OS X or Linux.