Mathematical modeling of temperature ields considering kinetics of thick-walled iberglass plate curing
In this research we identiied the kinetic parameters of the curing adhesive VSK-14-2m. Based on the kinetic parameters the heat power according to selected curing mode in the range of temperatures from 100 to 200 °C has been calculated. A mathematical model of heat transfer in the thick iberglass boards has been proposed. The diference between the temperature of the outer and mid layers of the plate and temperature gradients on the plate thickness has been revealed. It observed a large diference in temperature of the surface and the middle layers of a plate (30 °C) and temperature gradients in layers (more than 7 K/mm), resulting in reduction of mechanical characteristics. Comparison of theoretical and experimental data on the temperature distribution of the plate thickness has been performed, the correlation is 99.5 %.