INVESTIGATION OF SEALANT ADHESIVE PROPERTIES FOR ELECTRONIC STRUCTURES
This paper presents a setup to measure the level of sealant adhesion to a test material for single or small-scale production. The installation made it possible to measure adhesion indicators of polypropylene, fiberglass, glass-filled polyamide and different grades of phenoplast, and to evaluate the effect of primers on the adhesive properties. The relevance of the work is provided by the data obtained using the described installation for a more effective selection of structural materials for various products.