Molecular dynamics simulation of lead nanodroplets spreading on copper surface
Using molecular dynamics method and tight-binding potential the spreading of melt lead nanodroplets on copper (100) face was investigated. Kinetic data for the radii of four lower monolayers was obtained. In contrast to other authors (Webb III E. et al. // Phys. Rev. Lett., 2003. V. 91. No 23. P.236102), where the copper spreading was simulated using molecular dynamics and embedded atom method, our results demonstrate phenomenon of pseudopartial wetting during the lead spreading on the above copper face. At the same time, our results agree with available experimental data on the lead wetting of the copper surface by lead melt in macroscopic systems (G. L. J. Balley, H. C. Watkins. // Proc. Phys. Soc. 1950. V. B 63. P.350) and with our estimates of the equilibrium contact angle using the Young equation.