THE SYNTHESIS OF THE THERMAL MODEL BASED ON THE PRINCIPLE OF SUPERPOSITION OF TEMPERATURE FIELDS FOR MICROBLOCK BOARD ELECTRONICS
The paper proposes a method for the synthesis of the thermal model, implementing the principle of superposition of temperature fields for the card installed in the microscopic blocks of electronic equipment. This model is interesting for optimization problems of thermal regime by rational distribution of integrated circuits, which are sources of heat, as it reflects their mutual influence on each other explicitly. This influence is determined by the thermal coefficients which characterize the degree of influence on the temperature of each landing position of each integrated circuit from the heat source mounted on the board at the positions provided for in its design. These factors, according to reasonable assumptions, do not depend on the temperature, or the power of the heat source, and depend solely on the version of the board. The proposed method for determining the influence coefficient is based on the carrying amount of an optimal thermal calculations with only one heat source moved sequentially in the necessary position. The resulting thermal model is convenient for the solution of the problem of optimal placement of heat sources by the method of branches and borders.