OBTAINING HIGH THERMAL CONDUCTIVITY ADHESIVE JOINTS BY COMBINED EFFECT OF THE ELECTRIC AND VIBRATION FIELDS
The problem of increasing the thermophysical characteristics of materials based on adhesive compounds is considered. When operating heat-stressed units of technical systems, including glued joints, an increased thermal conductivity of the adhesive layers is required. To solve this problem, a method for increasing the thermal conductivity of glued interlayers of compounds based on the effect of combined action of electric and vibro-wave fields on adhesive layers formed on the basis of epoxy glue with a metal filler is proposed and tested experimentally. When magnetic or electric fields are applied to glued interlayers, the increase in their thermal conductivity is explained by the formation of heat-conducting chain structures from metal filler particles. However, according to the results of X-ray diffraction analysis, in this case the packing density of the filler particles is imperfect. This circumstance shows the need to investigate the complex effect of heterogeneous physical fields on the thermal conductivity of interlayers of adhesive joints. As a result, it was shown that the thermal conductivity of the adhesive composition is influenced by the nature of the filler and its concentration, the electric field strength and the frequency of mechanical vibrations. Moreover, the greatest effect is observed when the electric field intensity is varied