THERMAL FLAW DETECTION OF JOINTS ON ADHESIVES
To perform non destructive quality control of compounds on adhesives, a thermal method is proposed, which is based on the effect of the relationship of thermal properties (thermal conductivity coefficient) with internal stresses that occur in the adhesive seams during the glue polymerization process. The method allows us to predict the formation of internal stresses, which are the main suppliers of macrodefects in the adhesive seams, by determining the coefficient of thermal conductivity of the adhesive layer. Using the proposed method makes it possible to obtain kinetic data on the development of internal stresses.