INFLUENCE OF ELECTRIC – VIBRATION FIELD ON THE THERMAL CONDUCTIVITY OF GLUE LAYERS IN ADHESIVE JOINT
The effect of the combined, electric-vibrating field on the formation of the particles of metallic filler of chain structures in adhesive interlayers of compounds on filled adhesives in the uncured state is examined. It is shown that at influence on the uncured adhesive layer by electric-vibrating field due to the formation of chains from filler particles the thermal conductivity of the interlayer increases. Increasing the electric field stress, frequency of mechanical oscillations, the filler concentration and its dispersion results in increase of given thermal conductivity of adhesive layers. Due to the increased mass of the individual filler particles their strength under the influence of the interaction of the electric field increases, which leads to an increase in thermal conductivity of filled adhesive layer. Exposure to by electric-vibrating field of on the adhesive layer of dispersed-filled adhesive also increases the strength of adhesive joints. The proposed technology can be used in high-tech fields of modern technology.