STUDY OF THE PROCESS OF GALVANIC COPPER PLATING OF THROUGH HOLES OF PRINTED CIRCUIT BOARDS
This article is devoted to the process of galvanic copper plating through holes of printed circuit boards, which is one of the most difficult stages in the production of printed circuit boards. A brief review of the literature on the effect of the nature of the additives, their composition and concentration on the scattering capacity of the electrolyte is presented. The possibility of using the studied additives in domestic electrolytes of copper electrodeposition in the holes of printed circuit boards is considered.