USB 2.0 High-Speed Inter-Chip (HSIC) is a chip-to-chip variant of USB 2.0 that eliminates the conventional analog transceivers found in normal USB. It was adopted as a standard by the USB Implementers Forum in 2007. The HSIC physical layer uses about 50% less power and 75% less board area compared to traditional USB 2.0. HSIC uses two signals at 1.2 V and has a throughput of 480 Mbit/s. Maximum PCB trace length for HSIC is 10 cm. It does not have low enough latency to support RAM memory sharing between two chips.
యుఎస్బి 2.0 హై-స్పీడ్ ఇంటర్-చిప్ను యుఎస్బి ఇంప్లిమెంటెర్స్ ఫోరమ్ ప్రామాణికంగా ఎప్పుడు స్వీకరించింది?
2007