hat
koyefisyan an nan ekspansyon tèmik se yon lòt faktè enpòtan pou tout smikondukteur. Si semi-conducteurs a ak materyèl la plak baz elaji ak kontra nan yon to diferan lè ekspoze a chanjman ki fèt nan tanperati Lè sa a, ensiste mekanik leve. Sa yo ka fè dega nan semi-conducteurs a oswa afekte koneksyon ki genyen ant chip la ak epandeuz nan chalè. Sepandan, ak materyèl nou an, ou konnen ou se nan men san danje. materyèl nou yo gen koyefisyan ki pi gwo nan ekspansyon tèmik pou rantre nan smikondukteur ak seramik.
eng
The coefficient of thermal expansion is another critical factor for all semiconductors. If the semiconductor and the base plate material expand and contract at different rates when exposed to changes in temperature then mechanical stresses arise. These may damage the semiconductor or impair the connection between the chip and the heat spreader. However, with our materials, you know you are in safe hands. Our materials have the optimum coefficient of thermal expansion for joining semiconductors and ceramics.