hat
epandeuz chalè ak plak baz te fè soti nan MOLYBDENUM, tengstèn, MoCu, WCu, Cu-MoCu ak Cu-MoCu-Cu LAMINATES fiable gaye chalè a pwodwi nan eleman elektrik. Sa a tou de anpeche surchof a nan aparèy elektrik ak ogmante vi pwodwi. epandeuz chalè nou ede kenbe yon anviwònman fre, pou egzanp, nan modil IGBT, pakè RF oswa bato dirije. Nou devlope yon trè espesyal MoCu konpoze materyèl pou plak yo konpayi asirans nan bato dirije. Sa a gen yon koyefisyan nan ekspansyon tèmik menm jan ak sa yo ki an safi ak seramik.
eng
Heat spreaders and base plates made from molybdenum, tungsten, MoCu, WCu, Cu-Mo-Cu and Cu-MoCu-Cu laminates reliably dissipate the heat generated in electrical components. This both prevents the overheating of electrical devices and increases product lifetimes. Our heat spreaders help maintain a cool environment, for example, in IGBT modules, RF packages or LED chips. We have developed a very special MoCu composite material for the carrier plates in LED chips. This has a coefficient of thermal expansion similar to that of sapphire and ceramics.