hat
X-ray enspeksyon, paralèl nan eleman yo nan 360 ° tout-wonn obsèvasyon an, pou detèmine estrikti entèn la nan eleman ki sou tès ak estati koneksyon pake, ou ka wè yon gwo kantite echantiyon anba tès yo se menm bagay la, oswa yon melanj (Melanje-Up) pwoblèm yo leve; nan adisyon yo genyen ak espesifikasyon yo (Datasheet) youn ak lòt pase yo konprann kòrèkteman nan echantiyon an anba tès la. Koneksyon estati nan pake a tès, yo aprann sou koneksyon an chip ak pake ant broch se nòmal, eskli kle a ak louvri-fil kout-sere.
eng
X-ray inspection, the traversal of the components within the 360 ° all-round observation, to determine the internal structure of components under test and package connection status, you can see a large number of samples under test are the same, or a mixture (Mixed-Up ) the problems arise; in addition they have with the specifications (Datasheet) each other than to understand the correctness of the sample under test. Connection status of the test package, to learn about the chip and package connectivity between pins is normal, to exclude the key and open-wire short-circuited.