hat
- 3M ofri solisyon inovatè nan endistri elektwonik e li se yon manifakti dirijan nan solisyon interconnect pou tablo-a-tablo, fil-a-tablo, backplane ak aplikasyon pou D '/ pwodiksyon (I / O). Sa yo gen ladan yo 3M ™ Koneksyon Wotasyon Move Dantèl (IDC), Mini Delta Ribbon (MDR) Sistèm I / O, Mini-Clamp Discrete Fil System, MetPak ™ High Speed ​​Hard Metric (HSHM) ak nouvo Ultra Hard Metric (UHM) Backplane a Konektè yo. Sèvi ak kapasite dirijan endistri nan CAD - tankou modèl NX ™ ak SLA - enjenyè ki gen eksperyans 3M yo vire lide nan solisyon mond reyèl.
eng
- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.