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In this research , the underlying creep deformation mechanism of AM processed IN738LC is investigated using the serial sectioning technique , electron backscatter diffraction ( EBSD ) , transmission electron microscopy ( TEM ) .
 concept or principle: research; concept or principle: creep deformation mechanism; manufacturing process: AM; material: IN738LC; enabling technology: serial sectioning; process characterization: electron backscatter diffraction; process characterization: EBSD; process characterization: transmission electron microscopy; process characterization: TEM
Please list all entity words in the text that fit the category.Output format is "type1: word1; type2: word2". 
Option: manufacturing standard, machanical property, manufacturing process, material, engineering feature, process parameter, machine or equipment, application, process characterization, enabling technology, biomedical, concept or principle 
Text: {0} 
Answer:
 concept or principle: research; concept or principle: creep deformation mechanism; manufacturing process: AM; material: IN738LC; enabling technology: serial sectioning; process characterization: electron backscatter diffraction; process characterization: EBSD; process characterization: transmission electron microscopy; process characterization: TEM