fig1 illustrates a preferred embodiment of a medical diagnostic imaging system 100 used in accordance with the present invention . the medical diagnostic imaging system 100 includes a plurality of subsystems . for the purposes of illustration only , the medical diagnostic imaging system is described as an x - ray system . the medical diagnostic imaging system 100 includes subsystems , such as an x - ray detector 110 , an x - ray detector scan area 115 , an x - ray source 120 , and a patient 130 . the medical diagnostic imaging system 100 also includes an image acquisition module 140 and an image adjustment module 150 . the patient 130 is positioned in the medical diagnostic imaging system 100 . in one exemplary system , an x - ray source 120 is positioned above the patient 130 . the x - ray detector 110 is positioned below the patient 130 . x - rays are transmitted from the x - ray source 120 through the patient 130 to the x - ray detector 110 and the x - ray detector scan area 115 . fig4 illustrates a preferred embodiment of a solid state x - ray detector scan area 115 within an x - ray detector 110 . the x - ray detector scan area 115 is comprised of cells 410 corresponding to pixels in an x - ray image . each cell 410 typically comprises a photodiode and a field effect transistor ( fet ). the cells 410 may be arranged in columns ( data lines ) 420 and rows ( scan lines ) 430 . the cells 410 are activated by row 430 and by column 420 . one or more cells 410 are uniquely mapped to one or more pixels in an x - ray image . the pixels are activated to produce the desired digital x - ray image of the patient 130 . fig7 illustrates a lower - level view of a preferred embodiment of a solid state x - ray detector scan area 115 within an x - ray detector 110 . the x - ray detector scan area 115 is comprised of cells 710 comprising a photodiode 720 and a field effect transistor ( fet ) 730 . leads 740 connect the cells 710 to the image acquisition module 140 . the image acquisition module 140 acquires an x - ray image from the x - ray detector scan area 115 . in a preferred embodiment , the image acquisition module 140 may acquire an image from an area , an exposed detector section , larger than the normal patient subsection of the x - ray detector scan area 115 . in a preferred embodiment , shown in fig5 the x - ray detector scan area 115 may be enlarged by scanning additional rows 510 before the beginning of the x - ray detector scan area 115 or scanning additional rows 510 after the end of the x - ray detector scan area 115 to form an enlarged x - ray detector scan area 115 . the number of rows 510 may vary . also , the rows 510 may be located along one of both sides of the x - ray detector scan area 115 , in addition to or in place of being located before and after the x - ray detector scan area 115 . the image acquisition module 140 may acquire the image from the enlarged x - ray detector scan area 115 . in another preferred embodiment , shown in fig6 the x - ray detector scan area 115 may be reduced by one or more rows 610 at the beginning of the x - ray detector scan area 115 and one or more rows 610 at the end of the x - ray detector scan area 115 and / or one or more rows along either side of the x - ray detector scan area 115 . the rows dedicated in the normal x - ray detector scan area 115 may be used for offset correction in place of the additional rows 510 added in another preferred embodiment . the image acquisition module 140 may acquire an x - ray image from the x - ray detector scan area 115 . the image acquisition module 140 may acquire an x - ray image from the x - ray detector scan area 115 by receiving a signal from the leads 740 from the cells 410 , 710 in the x - ray detector scan area 115 . the signal from the leads 740 may be generated by charge stored in the photodiodes 720 . the charge stored in the photodiodes 720 may result from absorption of x - ray energy by the photodiodes 720 . the fets 730 allow the charge stored in the photodiodes 720 to travel as a signal through the leads 740 . the fets 730 may be actuated by the image acquisition module 140 . the signal received by the image acquisition module 140 through the leads 740 may include an offset produced by the charge retention characteristics and photo - conductive effects of the fets 730 . the image adjustment module 150 receives the acquired image from the image acquisition module 140 . the image adjustment module 150 corrects the offset induced in the image by the x - ray detector 110 . the offset in the x - ray image may be induced by the photo - conductive and / or charge retention properties of the fets ( field effect transistors ) 730 in the x - ray detector 110 . in a preferred embodiment , the charge retention offset from the fets 730 may be eliminated using a “ dark ” image containing the charge leakage caused by charge retention in the fets . in a preferred embodiment , the additional rows scanned at the beginning and end of the x - ray detector scan area 115 are utilized by the image adjustment module 150 to correct the offset induced by fet photo - conductive effects in the x - ray image . in an alternative preferred embodiment , the rows dedicated at the beginning and end of the normal x - ray detector scan area 115 are utilized by the image adjustment module 150 to correct the offset induced by fet photo - conductive effects in the x - ray image . turning now to fig2 the figure illustrates a flow diagram 200 for a preferred embodiment for correcting the offset induced in a medical diagnostic imaging system according to the present invention . in step 210 , the image acquisition module 140 acquires a “ dark ” image from the x - ray detector scan area 115 . a “ dark ” image is obtained from a reading done without an x - ray exposure . a scan for a “ dark ” image activates the fets 730 in the x - ray detector scan area 115 and measures retained charge leakage from the fets 730 . thus , a “ dark ” image may be used to determine the charge retention offset produced by the fets 730 activated to read the x - ray detector scan area 115 . in step 220 , the image acquisition module 140 acquires an x - ray image from the x - ray detector scan area 115 . the image is offset by excess charge from sources such as the photo - conductive effects and charge retention characteristics of fets 730 comprising the solid state x - ray detector 110 . the x - ray image is read row by row by the image acquisition module 140 from the x - ray detector scan area 115 using leads 740 from cells 710 in the x - ray detector scan area 115 . in a preferred embodiment of the present invention , the image acquisition module 140 acquires two additional rows 510 at the beginning of the image scan and also acquires two additional rows 510 at the end of the image scan . the additional rows 510 do not represent the object being scanned . the additional rows 510 indicate the offset charge “ signal ” that is induced by fet photo - conductive effects . in another preferred embodiment of the present invention , the image acquisition module 140 dedicates two rows 610 at the beginning of the x - ray detector scan area 115 and two rows 610 at the end of the x - ray detector scan area 115 to photo - conductivity measurement , thus reducing the overall size of the acquired image . during operation , the image acquisition module 140 performs consecutive or successive scans ( read operations ) of each row 430 of cells 410 , 710 in the x - ray detector scan area 115 . first , the image acquisition module 140 scans one or more rows 510 , 610 outside ( e . g ., before ) the scanned image area of the x - ray detector scan area 115 . the image acquisition module 140 acquires photo - conductive offset data from the rows 510 , 610 scanned outside the scanned image area of the x - ray detector scan area 115 . the image acquisition module 140 then performs a row by row scan of each row 430 in the scanned image area of the x - ray detector scan area 115 . during the row by row scan of each row 430 in the scanned image area of the x - ray detector scan area 115 , the image acquisition module 140 obtains exposure data for each cell 410 , 710 in the x - ray detector scan area 115 . the image acquisition module 140 then may scan one or more other rows 510 , 610 outside ( e . g ., after ) the scanned image area of the x - ray detector scan area 115 . the image acquisition module 140 acquires photo - conductive offset data from the rows 510 , 610 scanned outside the scanned image area of the x - ray detector scan area 115 . in step 230 , the image adjustment module 150 receives x - ray image data from the image acquisition module 140 . the image includes the additional rows dedicated to offset correction at the beginning and end of the image scan . the image adjustment module 150 analyzes the image on a pixel by pixel basis , according to row and column . in step 240 , the image adjustment module 150 calculates the image data value for a pixel 410 in the image . for each pixel , the image data value ( id ) is equal to the exposure data value ( ed ) from the image minus the charge retention offset data value ( cr ) from the “ dark ” image minus the calculated photoconductive offset data value ( pc ) from the offset correction rows 510 , 610 ( or id ij = ed ij − cr ij − pc ij ). in the calculation , i represents the row 430 index into the image and j represents the column 420 index into the image . the calculated photoconductive offset data value for each pixel 410 i in a given column 420 j is (( r n − r i )/ r n )* ½ (( r − 2 ) e +( r − 1 ) e −( r n + 1 ) e −( r n + 2 ) e −( r − 2 ) o +( r n + 1 ) o +( r n + 2 ) o ), where ( r − 2 ) e represents the signal measured in the expose frame for pixel (− 2 , j ), and r n and r i are row numbers . the subscript “ e ” refers to the expose frame , and the subscript “ o ” refers to the offset frame , as depicted in fig3 . the resulting image data values for each pixel in the image may be used to generate a digital display . thus , the present invention provides a fairly simple solution to what has become a serious degradation issue for solid state x - ray detectors . the method and apparatus for measuring and correcting the offset induced by photo - conductive fets in a solid state x - ray detector may improve the design of new medical diagnostic imaging systems and may preserve existing medical diagnostic imaging systems through offset correction . the present invention may be easily implemented and does not necessarily require a change to existing hardware . while the invention has been described with reference to a preferred embodiment , it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention . in addition , many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope . therefore , it is intended that the invention not be limited to the particular embodiment disclosed , but that the invention will include all embodiments falling within the scope of the appended claims .
a method and apparatus for correcting the offset induced by field effect transistor photo - conductive effects in solid state x - ray detectors includes dedicating rows at the beginning and end of an x - ray detector scan . the dedicated rows may be used to measure the “ signal ” induced by the photo - conductivity of fet switches in solid state x - ray detectors . since the signal induced by fet photo - conductivity decays over time , the measurements taken at the beginning and end of a detector scan may be used to predict by interpolation the amount of signal contributed by photo - conductive induced offset for each row of the detector scan on a column by column basis .