the present invention provides an electrotransport reservoir housing having a conductive element integrally molded within the insulated housing . this integral molding enables placing the drug reservoir and electrode in electrical communication with the power source without the need for an opening in the reservoir housing . because the molding process is performed at high heat and pressure , there is very tight , liquid and moisture impermeable bond between the material forming the reservoir housing and the conductive element . this results in a reservoir housing that is essentially a single integral component with no openings or other passages through the housing which would require subsequent sealing . by having a conductive element molded into the housing during manufacture , it eliminates problems of water and / or moisture from the drug reservoir contained within the interior of the reservoir housing leaking through or otherwise coming in contact with the electrical and / or mechanical components . in addition , the molded design allows electrical and / or mechanical connections to be formed as an integral part of the reservoir . a better understanding of the present invention as well as other objects and advantages thereof will become apparent upon consideration of the following detailed description especially when taken with the accompanying drawings , wherein like numerals designate like parts throughout , and wherein : fig1 is an exploded view of a prior art electrotransport device ; fig2 is a perspective view of a generic embodiment of the invention including an electrode molded into the housing ; fig3 is a perspective view of a specific implementation of the invention ; fig4 is a perspective view of an embodiment similar to fig2 which also includes an overmold applied to the housing ; fig5 is a perspective view of a additional embodiment using conductive adhesive ; and fig6 is a perspective view of another embodiment , which includes both a conductive element in the housing and an conductive pin which is optionally conductive on the printed circuit board , as well as an optional overmold applied to the housing . reference is now made to drawings of an embodiment of the present invention , in particular fig2 . reservoir housing assembly 100 is shown in perspective view . the bulk of the reservoir housing assembly 100 is made up of insulated housing 114 . the drug reservoir , not shown , would be placed within reservoir cavity 111 formed by insulated housing 114 . in the middle of insulated housing 114 is conductive element 112 . conductive element 112 is thicker than and extends beyond the surface of insulated housing 114 . this provides an easily accessible contact pad or attachment point that can be used to electrically connect to an electrically conductive portion of a circuit board , battery , power source ( not shown ) or other electrical component . reservoir housing assembly 100 may be produced by a multi - shot injection molding process which forms insulated housing 114 around conductive element 112 . multi - shot injection molding is a known process in the art . it is a molding process that injects multiple materials into a single mold . in this case , the conductive plastic which is used to form the conductive element 112 is injected first into the mold and at the proper time ( typically immediately or shortly afterwards ), the non - conductive plastic used to form insulated housing 114 is then injected into the mold and around the already existing conductive element 112 . it is possible to alter the order of injection and to first form insulated housing 114 and then inject the conductive plastic needed to from conductive element 112 . the particulars of mold design and mold fabrication and the actual multi - shot injection molding process are well known or easily determined by one skilled in the art . inner surface 113 of conductive element 112 is exposed within reservoir cavity 111 . outer surface 115 of conductive element 112 is exposed on the outside of insulated housing 114 . this embodiment shows electrode 116 after having been incorporated into the reservoir housing assembly 100 by using an insert molding technique which is now described . this process requires placing electrode 116 into the mold at the start of the molding process . the plastics that are injected during the subsequent injection molding steps flow around electrode 116 and cause it to be secured in the bottom of reservoir cavity 111 and sealed within at seal 118 a . the conductive plastic flows behind the exposed surface of electrode 16 making simultaneous contact with both electrode 116 and insulated housing 114 and thus forming conductive element 112 . this results in an electrical and mechanical bond between electrode 116 and conductive element 112 . because insulated housing 114 was injection molded around conductive element 112 and electrode 116 , seal 118 a and 118 b were formed by the interaction of the plastics and / or the geometry of the plastics . seals 118 a and 118 b prevent leakage of water and / or water vapor from the drug reservoir , which is often an aqueous solution or aqueous gel and which is placed within reservoir cavity 111 sometime prior to use by the patient . a release liner ( not shown ), not only protects the drug reservoir but further acts as a seal to keep the reservoir gel hydrated between the time of manufacture and actual use by the patient . the release liner would be removed just prior to application of the electrotransport device to the skin of the patient . for purposes of clarity , the remaining figures do not show the electrode 16 molded in the housing . however , it is within the scope of this invention that all embodiments shown in fig3 - 6 , could easily be modified to include an electrode molded into the reservoir . if electrode 116 is not molded in the housing , then the electrode can be appliqued into the bottom of reservoir cavity 111 by standard techniques such as those which use electrically conductive adhesive tape ( ecat ). the conductive element can be any material which can be compounded with carbon black and subsequently co - extruded and thermoformed . such materials include without limitation such polymers as polyvinyl chloride ( pvc ), polyethylene terephthalate glycol ( petg ), polyethylene ( pe ), polypropylene ( pp ), polycarbonate ( pc ), acrylics , and similar materials . the range of resistivity suitable for the conductive material is less than about 10 , 000 ohms - cm , which can be achieved by compounding the polymer with at least 3 vol . % of various carbon blacks . the actual volume percent of carbon black used depends upon both the grade of the carbon black and target resistivity of the particular material being produced . the insulated housing should be composed of a material having a resistivity of 10 9 ohms - cm or greater . fig3 shows reservoir housing assembly 130 having a different configuration of the conductive element 132 . in a manner similar to that already described , insulated housing 134 is multi - shot injection molded around conductive element 132 which forms a water and water vapor tight interface at seal 138 . conductive element 132 is shown with the outer surface 135 of the element tapered and having a slot 143 molded into conductive element 132 . in addition , conductive element 132 is molded from a semi - rigid or flexible material , which can be deformed and yet spring back and assume its original shape . this deformation is aided by the presence of slot 143 . the tapered profile , choice of materials , and slot permit printed circuit board 140 to be electrically and / or mechanically attached to the insulated housing 134 by forcing the conductive element 132 through opening 142 in the printed circuit board 140 . conductive element 132 can be compressed and / or deformed so that it can fit through the opening 142 in printed circuit board 140 . then it expands back to its original shape so that it extends over and retains printed circuit board 140 in mechanical contact with insulated housing 134 . in addition , electrical contact is made between trace 139 on printed circuit board 140 and the conductive element 132 . as a consequence , printed circuit board 140 is placed in electrical communication with inner surface 133 of conductive element 132 and further in electrical communication with an electrode and drug reservoir ( not shown ) that would usually be placed into the bottom of reservoir cavity 131 and thus in contact with inner surface 133 . fig4 shows an embodiment similar to that of fig3 . the only difference is that conductive element 152 has been enlarged and now includes a peripheral portion that extends radially outwards and then extends downwards over insulated housing 154 to form overmold 161 . this overmold may provide additional structural support for insulated housing 154 . though conductive element 152 and overmold 161 are shown in the drawing as a single element , the overmold 161 could be fabricated from a different plastic and could even be non - conductive . because overmold 161 serves a different purpose than conductive element 152 , its physical properties can chosen in order to satisfy separate design requirements . because both surfaces of printed circuit board 160 make contact with conductive element 152 and / or overmold 161 , conductive element 152 and / or overmold 161 , if made of conductive material , can be in electrical communication with trace 159 and / or trace 159 a which are positioned on opposite sides of printed circuit board 160 . in the same manner as that shown in fig3 , conductive element 152 can be deformed , aided by the presence of slot 153 , and inserted through opening 162 in printed circuit board 160 , thus retaining circuit board 160 mechanically and electrically . fig5 shows a simpler embodiment . conductive element 172 is approximately the same thickness as insulated housing 174 . when reservoir housing assembly 170 is fabricated , insulated housing 174 is injection molded around conductive element 172 forming seal 178 . electrical communication and / or mechanical connection is established between inner surface 173 and trace 179 on printed circuit board 180 by attaching printed circuit board 180 to outer surface 175 by using electrically conductive adhesive 184 , which could includes , but is not limited to silver epoxy and / or ecat . fig6 shows a perspective view of another embodiment of the invention , which is represented by reservoir housing assembly 190 . the bulk of reservoir housing assembly 190 is made up of insulated housing 194 which is injected molded around conductive element 192 forming seal 198 . conductive element 192 contains pin receiving cavity 206 molded into the outer surface 195 . conductive element 192 as shown includes an optional peripheral portion that extends radially outwards and then extends downwards over insulated housing 194 to form overmold 201 . this overmold provides additional structural support for insulated housing 194 . though shown in the drawing as a single element , the overmold portion could be fabricated from a different plastic and could even be non - conductive . because overmold 201 serves a different purpose than conductive element 192 , its physical properties could be chosen in order to satisfy separate design requirements . printed circuit board 200 is mechanically and electrically attached to conductive element 192 and mechanically attached to insulated housing 194 by insertion of pin 207 through opening 202 in printed circuit board 200 and into pin receiving cavity 206 . because pin 207 is typically constructed of conductive material , there is electrical communication between pin 207 and trace 199 located on one surface of printed circuit board 200 and trace 199 a located on the other side of printed circuit board 200 . in addition , there is electrical communication between pin 207 and conductive element 192 . trace 199 and trace 199 a are in electrical communication with other electrical elements and other traces that are part of printed circuit board 200 . therefore , there is electrical communication between the electrical components on printed circuit board 200 , trace 199 and / or trace 199 a , conductive element 192 , and inner surface 193 . as a consequence , if an electrode ( not shown ) is applied to the inside of reservoir cavity 191 it would be placed in electrical communication with printed circuit board 200 . likewise , if a reservoir is placed in reservoir cavity 191 , then the reservoir would be in electrical communication with the electrode , if present , and inner surface 193 , conductive element 192 , overmold 201 ( if conductive ), traces 199 and 199 a , conductive pin pin 207 and circuit board 200 and its electrical components . pin 207 is designed so that it forms a mechanical connection with pin receiving cavity 206 . pin 207 can be a forced friction fit with pin receiving cavity 206 . both pin 207 and pin receiving cavity 206 can be configured with mating parts to lock pin 207 into pin receiving cavity 206 when pin 207 has been inserted a certain depth into pin receiving cavity 206 . both pin 207 and pin receiving cavity 206 can be matingly threaded , with pin receiving cavity 206 being sized and configured to receive the threads on pin 207 . pin 207 could be a standard rivet that is mushroomed to retain it in the pin receiving cavity 206 . further , pin 207 can be physically separate from printed circuit board 200 or it can be an integral part of printed circuit board 200 . any number of other well - known means can be used to electrically and / or mechanically attach pin 207 to conductive element 192 . pin 207 could be made of conductive material so that a trace on the outside surface of printed circuit board 200 could be placed in electrical communication with such a conductive pin 207 . for example , if pin 207 were conductive , then trace 199 a , on the outside surface of printed circuit board 200 , would be in electrical communication with pin 207 , conductive element 192 , inner surface 193 and any electrode or drug reservoir normally positioned in reservoir cavity 191 . if pin 207 were non - conductive , then only trace 199 would be placed in electrical communication with conductive element 192 when pin 207 was mechanically attached to pin receiving cavity 206 . though conductive insert 112 , 132 , 152 , 172 and 192 are shown as a single integral component , it is within the scope of this invention that these elements may be comprised of a plurality of conductive and non - conductive subcomponents . though reservoir housing 114 , 134 , 154 , 174 , and 194 are shown as an integrated component comprising the conductive insert , it is within the scope of this invention that the reservoir housing may be comprised of a plurality of subcomponents in addition to the conductive insert . the above - described exemplary embodiments are intended to be illustrative in all respects , rather than restrictive , of the present invention . thus , the present invention is capable of implementation in many variations and modifications that can be derived from the description herein by a person skilled in the art . all such variations and modifications are considered to be within the scope and spirit of the present invention as defined by the following claims .
this invention relates to an electrotransport device , which incorporates a conductive element within the reservoir housing of the device , which permits electrical communication from within the housing to outside of the housing without the use of opening , which require various methods of sealing the openings against leaks and moisture .