particular embodiments of the present disclosure will be described below with reference to the accompanying drawings . in the following description , well - known functions or constructions are not described in detail to avoid obscuring the present disclosure in unnecessary detail . those skilled in the art will understand that embodiments of the present disclosure may be adapted for use with any electrosurgical system , generator , and / or instrument . it should also be appreciated that different electrical and mechanical connections and other considerations may apply to each particular type of instrument . briefly , an overlapping shield assembly according to the present disclosure is described below with respect to shielding planar magnetic devices in an electrosurgical generator . although the present disclosure is described with respect to an electrosurgical generator , it is envisioned that the overlapping shield assembly may be utilized with any planar magnetic device in any electronic device in which emi protection is desired . the electrosurgical generator according to the present disclosure may be used in monopolar and / or bipolar electrosurgical procedures , including , for example , cutting , coagulation , ablation , and vessel sealing procedures . the generator may include a plurality of outputs for interfacing with various electrosurgical instruments ( e . g ., monopolar instruments , return electrode pads , bipolar electrosurgical forceps , footswitches , etc .). further , the generator may include electronic circuitry configured to generate radio frequency energy specifically suited for powering electrosurgical devices operating in various electrosurgical modes ( e . g ., cut , blend , coagulate , division with hemostasis , fulgurate , spray , etc .) and procedures ( e . g ., monopolar , bipolar , vessel sealing ). referring to fig1 , an electrosurgical system 10 according to the present disclosure includes one or more monopolar electrosurgical instruments 20 having one or more active electrodes 23 ( e . g ., electrosurgical cutting probe , ablation electrode ( s ), etc .) for treating tissue of a patient . electrosurgical alternating rf current is supplied to the instrument 20 by a generator 200 via a supply line 24 that is connected to an active terminal 350 ( fig3 ) of the generator 200 , allowing the instrument 20 to cut , coagulate , and / or otherwise treat tissue . the rf current is returned to the generator 200 through a return electrode pad 26 via a return line 28 at a return terminal 352 ( fig3 ) of the generator 200 . for monopolar operation , the system 10 may include a plurality of return electrode pads 26 that , in use , are disposed on a patient to minimize the chances of tissue damage by maximizing the overall contact area with the patient . in addition , the generator 200 and the return electrode pads 26 may be configured for monitoring tissue - to - patient contact to ensure that sufficient contact exists therebetween . the system 10 may also include one or more bipolar electrosurgical instruments , for example , a bipolar electrosurgical forceps 30 having one or more electrodes for treating tissue of a patient . the electrosurgical forceps 30 includes a housing 31 and opposing jaw members 33 and 35 disposed at a distal end of a shaft 32 . the jaw members 33 and 35 have one or more active electrodes 34 and a return electrode 36 disposed therein , respectively . the active electrode 34 and the return electrode 36 are connected to the generator 200 through cable 38 that includes the supply and return lines 24 , 28 , which may be coupled to the active and return terminals 350 , 352 , respectively ( fig3 ). the electrosurgical forceps 30 is coupled to the generator 200 at a port having connections to the active and return terminals 350 and 352 ( e . g ., pins ) via a plug ( not shown ) disposed at the end of the cable 38 , wherein the plug includes contacts from the supply and return lines 24 , 28 as described in more detail below . with reference to fig2 , a front face 240 of the generator 200 is shown . the generator 200 may include a plurality of ports 250 - 262 to accommodate various types of electrosurgical instruments ( e . g ., monopolar electrosurgical instrument 20 , electrosurgical forceps 30 , etc .). the generator 200 includes a user interface 241 having one or more display screens 242 , 244 , 246 for providing the user with variety of output information ( e . g ., intensity settings , treatment complete indicators , etc .). each of the screens 242 , 244 , 246 is associated with a corresponding port 250 - 262 . the generator 200 includes suitable input controls ( e . g ., buttons , activators , switches , touch screen , etc .) for controlling the generator 200 . the screens 242 , 244 , 246 are also configured as touch screens that display a corresponding menu for the instruments ( e . g ., electrosurgical forceps 30 , etc .). the user can adjust inputs by simply touching corresponding menu options . screen 242 controls monopolar output and the devices connected to the ports 250 and 252 . port 250 is configured to couple to a monopolar electrosurgical instrument ( e . g ., electrosurgical instrument 20 ) and port 252 is configured to couple to a foot switch ( not shown ). the foot switch provides for additional inputs ( e . g ., replicating inputs of the generator 200 ). the port 254 is configured to couple to the return electrode pad 26 . screen 244 controls monopolar and bipolar output and the devices connected to the ports 256 and 258 . port 256 is configured to couple to other monopolar instruments . port 258 is configured to couple to a bipolar instrument ( e . g ., electrosurgical forceps 30 ). screen 246 controls the electrosurgical forceps 30 that may be plugged into one of the ports 260 and 262 , respectively . the generator 200 outputs energy through the ports 260 and 262 suitable for sealing tissue grasped by the electrosurgical forceps 30 . in particular , screen 246 outputs a user interface that allows the user to input a user - defined intensity setting for each of the ports 260 and 262 . the user - defined setting may be any setting that allows the user to adjust one or more energy delivery parameters , such as power , current , voltage , energy , etc . or sealing parameters , such as energy rate limiters , sealing duration , etc . the user - defined setting is transmitted to a controller 324 ( fig3 ) where the setting may be saved in a memory ( not shown ). in embodiments , the intensity setting may be a number scale , such as for example , from one to ten or one to five . in embodiments , the intensity setting may be associated with an output curve of the generator 200 . the intensity settings may be specific for each electrosurgical forceps 30 being utilized , such that various instruments provide the user with a specific intensity scale corresponding to the electrosurgical forceps 30 . the active and return terminals 350 and 352 ( fig3 ) may be coupled to any of the desired ports 250 - 262 . with reference to fig3 , the generator 200 also includes a controller 324 , a power supply 326 , and a power converter 332 . the power supply 326 may be a high voltage , dc power supply connected to an ac source ( e . g ., line voltage ) and provides high voltage , dc power to the power converter 332 , which then converts high voltage , dc power into rf energy and delivers the energy to the active terminal 350 . ( fig2 ) the energy is returned thereto via the return terminal 352 . in particular , electrosurgical energy for energizing the monopolar electrosurgical instrument 20 and / or electrosurgical forceps 30 is delivered through the active and return terminals 350 and 352 . the active and return terminals 350 and 352 are coupled to the power converter 332 through an isolation transformer 340 . more specifically , the isolation transformer 340 includes a primary winding 340 a coupled to the power converter 332 and a secondary winding 340 b having an active lead 342 coupled to the active terminal 350 and a return lead 344 coupled to the return terminal 352 . the output of power converter 332 transmits current through the isolation transformer 340 to the load “ z ”, e . g ., tissue being treated . the power converter 332 is configured to operate in a plurality of modes , during which the generator 200 outputs corresponding waveforms having specific duty cycles , peak voltages , crest factors , etc . it is envisioned that in other embodiments , the generator 200 may be based on other types of suitable power supply topologies . power converter 332 may be a resonant rf amplifier or a non - resonant rf amplifier . a non - resonant rf amplifier , as used herein , denotes an amplifier lacking any tuning components , e . g ., inductors , capacitors , etc ., disposed between the power converter and the load “ z ” intended to establish a fixed operating frequency . the controller 324 includes a processor ( not shown ) operably connected to a memory ( not shown ), which may include one or more of volatile , non - volatile , magnetic , optical , or electrical media , such as read - only memory ( rom ), random access memory ( ram ), electrically - erasable programmable rom ( eeprom ), non - volatile ram ( nvram ), or flash memory . the processor may be any suitable processor ( e . g ., control circuit ) adapted to perform the operations , calculations , and / or set of instructions described in the present disclosure including , but not limited to , a hardware processor , a field programmable gate array ( fpga ), a digital signal processor ( dsp ), a central processing unit ( cpu ), a microprocessor , and combinations thereof . those skilled in the art will appreciate that the processor may be substituted for by using any logic processor ( e . g ., control circuit ) adapted to perform the calculations and / or set of instructions described herein . the controller 324 includes output ports that are operably connected to the power supply 326 and / or the power converter 332 allowing the controller 324 to control the output of the generator 200 according to either open and / or closed control loop schemes . a closed loop control scheme is a feedback control loop , in which a plurality of sensors measure a variety of tissue and energy properties ( e . g ., tissue impedance , tissue temperature , output power , current and / or voltage , etc . ), and provide feedback to the controller 324 . the controller 324 then controls the power supply 326 and / or the power converter 332 , which adjusts power delivered to and / or from the power converter 332 , respectively . the controller 324 also receives input signals from the input controls of the generator 200 , the electrosurgical instrument 20 and / or electrosurgical forceps 30 . the controller 324 utilizes the input signals to adjust power outputted by the generator 200 and / or performs other control functions thereon . the controller 324 may perform various mathematical computations in order to control the power supply 326 and / or the power converter 332 to generate an rf waveform having a desired shape and energy content . examples of computations performed by the controller 324 include , but are not limited to , calculating instantaneous and / or root mean square power levels , amount of energy delivered on a cycle by cycle basis , load impedance , etc . the generator 200 according to the present disclosure may also include a plurality of sensors , namely , a voltage sensor 336 and a current sensor 338 . the voltage sensor 336 is coupled to the active and return leads 342 , 344 and measure rf voltage supplied to the active and return terminals 350 , 352 . the current sensor 338 is coupled to the active and / or return leads 342 , 344 and measures rf current supplied to the active and return terminals 350 , 352 . in embodiments , the generator 200 may also include additional sensors ( not shown ) coupled to the power supply 326 . with reference to fig4 and 5 , the current sensor 338 includes a planar magnetic device 460 , e . g ., a current sense coil , which is disposed on a printed circuit board (“ pcb ”) 400 . the pcb 400 may be a multilayer pcb formed from any suitable dielectric material , including , but not limited to composite materials composed of woven fiberglass cloth with an epoxy resin binder such as fr - 4 grade as designated by the national electrical manufacturers association . the pcb 400 defines an opening 402 therethrough for passage of the active lead 342 . the planar magnetic device 460 includes an outer coil 470 and an inner conductor 472 . the outer coil 470 is formed by a plurality of upper and lower conductive traces 470 a and 470 b interconnected by a plurality of inner conductive vias 470 c and outer conductive vias 470 d . the upper and lower conductive traces 470 a and 470 b may be printed on respective upper and lower surfaces 400 a , 400 b ( fig5 ) of the pcb 400 . the inner conductor 472 is disposed in between the upper and lower conductive traces 470 a and 470 b and is embedded within the pcb 400 ( fig5 ). fig6 shows an overlapping shield assembly 500 disposed over the upper surface 400 a of the pcb 400 . the overlapping shield assembly 500 includes a first layer 502 and a second layer 504 , which are separated by one or more dielectric layers 400 c , 400 d , . . . 400 n of the pcb 400 . in embodiments , the overlapping shield assembly 500 may also be disposed on the bottom surface 400 b of the pcb 400 . in other embodiments , the overlapping shield assembly 500 may be disposed internally , i . e ., within the planar magnetic device 460 , namely , between the upper conductive traces 470 a and lower conductive traces 470 b . this configuration provides significant internal device e - field shielding and isolation and is suitable to control crosstalk and leakage currents . in further embodiments , the first layer 502 may be disposed on the upper surface 400 a of the pcb 400 and the second layer 504 may be disposed on the lower surface 400 b of the pcb 400 . a single layer of shielding ( e . g ., the first layer 502 or the second layer 504 ) may be on each surface 400 a , 400 b of the pcb 400 and may provide sufficient e - field shielding and may be adequate for many applications . in additional embodiments , a pair of overlapping shield assemblies 500 may be disposed on the pcb 400 , one on each surface 400 a , 400 b , respectively , to provide an additional order of magnitude of shielding . with reference to fig6 - 9 , the first and second layers 502 and 504 may be formed as conductive traces on their corresponding dielectric layers 400 c and 400 d ( fig6 ) of the pcb 400 . thus , the first layer 502 is disposed in a first plane “ a - a ” and the second layer 504 is disposed in a second plane “ b - b ” ( fig6 ). each of the layers 502 and 504 includes a plurality of strips 506 and 508 , respectively . the strips 506 and 508 are arranged in parallel with periodic gaps 510 and 512 that are defined therebetween . as shown in fig7 , the strips 506 of the first layer 502 have a strip width s 1 and the gaps 510 have a gap width w 1 . similarly , the strips 508 of the second layer 504 have a strip width s 2 and the gaps 512 have a gap width w 2 . the strip width s 1 of the strips 506 is substantially equal to the gap width w 2 of the gaps 512 of the second layer 504 and conversely , strip width s 2 of the strips 508 is substantially equal to the gap width w 1 of the gaps 510 of the first layer 502 . this configuration allows for the strips 506 , 508 and the gaps of 510 , 512 to overlap , respectively , thus forming an emi shield . strip widths s 1 or s 2 may be from about 0 . 1 millimeters ( mm ) to about 10 mm , in embodiments from about 1 mm to about 5 mm . since gap widths w 1 and w 2 are related to the strip widths s 1 and s 2 , gap widths w 1 and w 2 may also have the same dimensions . in further embodiments , the strip width s 1 or s 2 of each of the strips 506 and 508 may be different , i . e ., have a non - uniform width . each of the first layer 502 and the second layer 504 also includes a perimeter conductor 514 and 516 , respectively . the perimeter conductor 514 is coupled to each of the strips 506 of the first layer and the perimeter conductor 516 is coupled to each of the strips 508 of the second layer 504 . in addition , the first and second layers 502 and 504 are interconnected by one or more conductors 518 to form the emi shield . because the strips 506 and 508 are spaced apart , i . e ., do not form a continuous conductive surface across one plane “ a - a ” or “ b - b ,” respectively , and are open ended , they do not form a complete circuit for stray current to flow therethrough . furthermore , because the strips 506 and 508 are relatively narrow , eddy currents , also known as foucalt currents , do not have a significant impact . however , because the first and second layers 502 and 504 are separated by one or more pcb layers of the pcb 400 , the height between the layers is comparatively small , thereby forming a continuous surface when viewed along an axis “ c - c ,” which is transverse with respect to each of the planes “ a - a ” and “ b - b ” ( fig6 ). put differently , the first and second layers 502 and 504 complement each other to form , i . e ., complete , the overlapping shield assembly 500 . while several embodiments of the disclosure have been shown in the drawings and / or described herein , it is not intended that the disclosure be limited thereto , as it is intended that the disclosure be as broad in scope as the art will allow and that the specification be read likewise . therefore , the above description should not be construed as limiting , but merely as exemplifications of particular embodiments . those skilled in the art will envision other modifications within the scope of the claims appended hereto .
an electronic device includes : a multilayered dielectric substrate including a plurality of dielectric layers ; a planar magnetic device disposed on at least one internal dielectric layer of the plurality of dielectric layers ; and an overlapping shield assembly including a first shield layer and a second shield layer separated by at least one of the plurality of dielectric layers .