referring to fig1 , a percutaneous connector 10 is screwed into the skull 1 and is connected , by way of a multi - conductor microcable 20 , to a brain probe 24 that passes through an aperture 2 in the skull , through the dura 4 ( and into the brain 6 ), for measuring brain activity at a specific set of points . referring to fig2 , 3 and 3 a a percutaneous connector 10 according to the present invention includes a male - half 12 , a female - half bracket 14 and a female - half flex circuit ( or flexible polymer ) connective assembly 16 bearing a set of contacts 17 and conductive traces 19 . a multi - conductor microcable 20 forms a portion of assembly 16 and is threaded through an aperture 22 in bracket 14 . the microcable 20 attaches to and extends traces 19 to brain probe 24 . as shown in fig3 a in an alternative embodiment , a connective assembly 16 ′ includes a microcable 20 ′ that includes a brain probe 24 ′ as a unitary part of its construction . the male - half includes a resilient clip portion 28 , the exterior of which is covered with a flex - circuit 34 bearing a set of contacts 36 ( matching the arrangement of contacts 19 ) and conductive traces 38 . a first prong 40 and a second prong 42 , which is physically coincident with an op - amp housing , partially defines clip portion 28 . a user can grasp male - half 12 by the first and second prongs 40 and 42 to squeeze these prongs 40 and 42 together . the male - half 12 can then be inserted into the female - half 14 , without exerting pressure against female - half 14 , which could cause pain or tissue trauma to the patient or test subject . finally , the user releases prongs 40 and 42 so that the resiliency of clip 28 will force each exterior side of clip 28 , and therefore contacts 36 , to touch the contacts 17 in female - half 14 . referring to fig4 and 5 a – 5 g , contacts 17 and traces 19 are made of conductive material , such as a metal ( copper , gold or sliver ) or a conductive polymer that has been deposited and etched on top of a laminate having a layer of dielectric substrate 50 and a base layer silicone 70 or some other biocompatible , compliant material . semicircular isolation cuts 48 through the layers 50 and 70 ( in an alternative preferred embodiment only layer 50 is cut through by the laser ) positionally decouple a first contact 17 a from neighboring contacts 17 b , 17 c and 17 d , permitting contact 17 a to be depressed into the spongy layer of silicone 70 without pulling down the neighboring contacts 17 b , 17 c and 17 d . this independent depressability causes the protrusional misalignment of contacts 17 and 36 to be forgiven . the miniature scale that is made possible by the use of photolithography and flex circuit technology , as described above , facilitates a further advantage that may be realized as part of the present invention . this is the placement of op amps in extremely close proximity to contacts 36 . for connectors in which the contacts are spread apart from each other , it is necessary to gather together conductive paths from all the different contacts prior to sending them all to a set of op amps . because contacts 36 are all so close together , traces 38 are routed to a set of op amps 44 , that are about 0 . 5 cm away and are housed in the second prong 42 , which doubles as an op amp housing . as a result , signal line noise and cross talk are minimized . referring to fig5 a – 5 g , the photolithography process for making the brain probe 24 and the contacts of the percutaneous probe contact structure 30 are quite similar , except that different materials may be used and the percutaneous probe contact structure 30 includes a base layer of silicone 70 , that is only shown in fig5 g , for the sake of simplicity . referring specifically to fig5 a , the photolithography process begins with a layer of dielectric substrate 50 , the composition of which is discussed below , that is coated with a base layer of conductive material 52 , such as a titanium - gold - titanium sandwich . fig5 b shows the structure of fig5 a , which at this point has been covered with a layer of photo resist material 54 , typically applied by spin - coating . fig5 c shows the effect of exposing the photo resist material to a pattern of light and washing off the exposed ( or not exposed if a negative process is used ) material with a developing agent . next , as shown in fig5 d , additional conductive material ( typically copper ) is built up on the exposed base layer 52 , typically through electrolysis . as shown in fig5 e , the remaining photo resist material 54 is washed off with a solvent and a layer of dielectric ( and permanent ) photo resist 58 is applied and patterned , via exposure to a pattern of light and subsequent washing with a developing agent or solvent . then , additional electrolytic plating is performed ( fig5 f ) to create a contact 60 and the substrate is cut with an nd : yag laser to form a kerf or cut 62 . when the process shown in fig5 a – 5 g is for producing connector 10 , cut 62 is the same as isolation cut 48 . when the process shown in fig5 a – 5 g is for producing a brain probe 24 , cut 62 separates a first brain probe 24 from a wafer or thin plastic film upon which several brain probes have been etched . in contrast to the situation with respect to silicon , which may be separated by etching , it appears that no etching process has been developed for cutting the materials used for substrate 50 , which are discussed below . the dielectric substrate 50 that is used for the brain probe 24 is preferably a polymer material having a high glass transition temperature , high tensile strength and low elasticity . more specifically , substrate 50 may be made of polyether sulfone , polyimide or other material having the desired characteristics . if polyimide is used , it should be coated or treated so that it does not dissolve in the body &# 39 ; s interstitial fluid , or used for a probe that is not to be implanted for long enough for the polyimide to dissolve . photo resist material 54 may be a photosensitive acrylate , polyether or polyurethane , preferably having a high molecular weight . permanent photo resist 58 may be a permanent polyimide , a type of material that is widely available from well - known photo resist companies . these companies typically sell a wet etch agent specifically designed to etch each permanent polyimide photo resist that they sell . brain probe 24 includes three prongs 72 . each prong 72 is on the order of 15 mm long , 3 mm wide and 0 . 3 mm thick . during the manufacturing process each prong 72 is sharpened so that it may more easily be driven through the brain tissue . it is desirable that a brain probe , if it is to be implanted for a period of time on the order of weeks , be very pliable , so that it may conform to the brain tissue surrounding it and not cause further damage by pressing against the delicate brain tissue . if the brain probe is to be installed by being driven through brain tissue , however , it must be fairly rigid , requiring a strength layer , such as layer of steel or some other resilient material , laminated beneath layer 70 , typically before the production process begins . referring to fig6 and 7 , in one preferred embodiment a brain probe 80 is constructed to be very pliable . in brain probe 80 only a single point 90 is provided , in order to facilitate the placement process , which is complicated by the three - pointed ( or pronged ) embodiment shown in fig3 . fig6 shows brain probe 80 in tandem with a placement tool 84 , which engages brain probe 80 at aperture 86 . placement tool 84 is used to push the point of probe 80 through brain tissue 6 ( fig1 ), to the point at which contact with brain tissue 6 is desired . for chronically implanted brain probes , the quality of being pliable may be very important , to avoid the damage that a rigid brain probe could inflict with patient movement . the brain moves about in the skull with patient head movement , and colliding with a rigid probe could easily damage the soft brain tissue . in the embodiment of fig6 , electrodes 17 are from 12 . 56 square microns to 300 microns in surface area . in one preferred embodiment electrodes 17 are 176 have a surface area of 176 square microns . the probe 80 , itself is at least 5 mm long , and no more than 5 mm wide and 1 mm thick . in the preferred embodiment shown , cuts 48 are through - cuts and permit tissue ingrowth , which along with the tissue ingrowth at aperture 86 helps to anchor brain probe 90 , in the brain tissue . in an alternative preferred embodiment , cuts 48 are not present . referring to fig8 , 9 and 10 , the method of construction shown in fig5 a – 5 g is used for the production of nerve cuffs 100 , 110 and 120 . a nerve cuff is a device that is adapted to be wrapped around a nerve 130 and used to electrically stimulate the nerve 130 . in nerve cuff 110 a set of twelve contacts 112 have been created through photolithography . in nerve cuff 120 four complex contacts 122 , designed for circumferentially contacting a nerve have been created by way of photolithography . the terms and expressions which have been employed in the foregoing specification are used as terms of description and not of limitation , and there is no intention , in the use of such terms and expressions , of excluding equivalents of the features shown and described or portions thereof , it being recognized that the scope of the invention is defined and limited only by the claims which follow .
a method of producing an electrode brain probe assembly , using a flexible substrate comprising a polymeric layer bearing a conductive material coating . photolithography and electroplating are used to form a set of contacts and conductors on the polymeric layer of the flexible substrate . also , the flexible substrate is shaped to have a distal end and to be at least 5 mm long , but less than 5 mm wide and less than 1 mm thick .