Preparation and Properties of Polyimide Pl/SiC Composite Thin Film
Polyimide dielectric composite used for electron packaging is prepared by chemical synthesis, and the microstructure and structure of polyimide composite is characterized by TEM and infrared spectrometer. The results show that polyimide matrix composite is actually a copolymer, which belongs to molecule miscellaneous composite, and the nanometer SiC monomer is uniformly dispersed into polymer with big molecule., The dielectric constant is low, its average value is 2.3, the minimum can be to 2.0, and the water absorption is low as well.