Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile
Abstract Package warpage is an important factor to the effect of yield of board assembly, delamination, solder joint fatigue reliability and other thermal stress issues. Reduction of warpage is always the ultimate purpose for enhancing the service life. HFBCGA equipped only peripheral stiffener ring is selected to investigate the effect of heating rate, with and without ball mounted, moisture sensitivity level, white-coated paint on package and glass gratings to the warpage subjected to a reflow soldering-liked profile. Releasing viscoelasticity at processing temperature, maintaining structural rigidity of the residual solder, certain moisture resistivity at MSL 3, and light white paint help on reducing the warpage along the reflow soldering-liked profile.