Wafer-level LED-SiP based mobile flash module and characterization
Abstract In this paper, we have developed and revealed the wafer-level LED system-in-packaging (WL-LED-SiP) design and process platform. This platform provided an LED system solution with high packaging density, high performance, high reliability and cost effectiveness. Camera phone flash module was adopted as a test vehicle for demonstrating LED-SiP platform technologies, including wafer-level (WL) process integration with micro electromechanical system (MEMS) reflector, cavity-based lithography and through silicon via (TSV) filling. Meanwhile, LED flash module performance, including correlated color temperature (CCT), color rendering index (CRI), light energy and distribution, was characterized. The delivered LED-SiP flash module showed wide-view angle design of 80° × 50° and light energy of 5.7 lx s @ 1/30 s. The volume of the module is 8 × 11 × 4 mm3.