Preparation of 3DPSL-1 Type Photosensitive Resin and Study on Its Properties
3DPSL-1(3D printing stereolithography No.1) type photosensitive resin was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (ERL-4221), bisphenol A type epoxy diacrylate (DH-306), tripropylene glycol diacrylate (TPGDA), Diglycidyl 4,5-epoxycyclohexane-1,2-dicarboxylate(TDE-85), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30 ℃ was 355mPa.S, the glass transition temperature (Tg) of the UV-cured specimen was 52 ℃, and the weight loss of the UV-cured specimen at 200 ℃ was less than 4%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).