Study on Bonding Pressure of Transient Liquid Phase Diffusion Welding
The bonding pressure was reduced because the transient liquid phase(TLP) was formed during TLP bonding process,but applying a compressive load during TLP bonding was very boneficial to the quality and properties of the bonded joints,and the decrease of the bonding time,the effects of the pressure on the bonding process to exclude the oxide film and reduce the isothermal solidification time were summed,and the choose principles and control process were discussed.