Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)
We present an original imaging method to measure the three components of the surface displacement of working power devices with a nanometric resolution. The method takes advantage of the speckle structure of the analysed object recorded on a CCD camera. This method is complementary of IR thermography and provides interesting information concerning stress and reliability in power devices. (C) 1998 Elsevier Science Ltd. All rights reserved.