A universal reliability prediction model for SMD integrated circuits based on field failures
Abstract This paper makes a review of integrated circuit field failures on three types of environment respectively, Ground Benign (GB), Ground Fixed (GF), and Airborne Inhabited Cargo (AIC). It appears that for permanent working GB, there was no package related failures and 2 3 of the failures had EOS origin. For GF and AIC most of the failures were open balls bonds and open solder joints. A universal predicting reliability model is therefore proposed for the die part and for the package part. This study has been carried out in the frame of a working group, to update the French standard UTEC 80810 (ex RDF93 from CNET), and is an alternative guide to the obsolete MIL-HDBK-217F for predicting reliability calculations.