Influence of Minor Nd Addition on Microstructure of Sn-6.5Zn Alloy and Interface Properties of Solder/Cu Joints
The effects of minor Nd additions on the microstructure and characteristics of intermetallic compound(IMC) of Sn-6.5Zn-xNd(x=0,0.1,0.5) solder/Cu joints were investigated.The results indicate that the microstructure in Sn-Zn-Nd solder alloy is refined by the addition of minor Nd.The IMC layer at the interface of solder/Cu becomes uniform and fine.A 0.1wt% Nd addition in Sn-6.5Zn can promote the uniformity of the interfacial reaction and the component distribution of solder/Cu joint.