Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding
Short nickel filaments of diam 0.4 μm and containing 94 vol% Ni and 6 vol% C were fabricated by electroplating with nickel 0.1 μm diam catalytically grown carbon filaments. The use of these filaments in polyether sulfone in amounts of 3, 7,13, and 19 vol% gave composites with electromagnetic interference shielding effectiveness at 1–2 GHz of 42,87,84, and 92 dB, respectively, compared to a value of 90 dB for solid copper. Less shielding was attained when 0.1 μm diam carbon filaments or 2 or 20 μm diam nickel fibers were used instead.