Microstructure, physical and soldering properties of Tin-Zinc-Bismuth alloy
The aim of present work was to improve physical and soldering properties of tin- zinc alloy and produce new Sn-Zn-Bi alloy with superior soldering properties for electronic applications. To verify this aims microstructure, electrical resistivity, elastic modulus, internal friction, thermal diffusivity, melting pointand wetting behavior of Sn96-xZn4Bix (x=0, 6, 12, 18, 24 and 30) alloys have been investigated. Melting point, elastic modulus and thermal diffusivity values of Sn96 Zn4 alloy decreased but electrical resistivity and internal friction values increased after adding bismuth content. Wetting behavior,contact angle, of Sn96Zn4 alloyvaried after adding bismuth content. The Sn72Zn4Bi24lead free solder alloy has the beast soldering properties for electronic application compared to commercial Pb- Sn alloy.