Improving the radiation burn-out susceptibility of N-channel power MOSFETs
Computer simulation was used to calculate the dose-rate thresholds of several different power MOSFET structures. Computational results indicate that significant improvements in radiation tolerance and burnout of the device are possible by reducing the lateral size of the power MOSFET unit cell or by using a lower emitter injection efficiency for the bipolar structure. Modification of some other factors, such as the base minority carrier lifetime or the epi/substrate interface shape, shows some minor improvements in device radiation tolerance. >