Strain- and temperature-induced effects in AlGaN/GaN high electron mobility transistors
This paper presents a physics-based model for computing the combined effect of applied strain and temperature on the device characteristics of aluminium gallium nitride (AlGaN/GaN) high electron mobility transistors (HEMTs). More specifically, the electrical response of the HEMT is predicted under applied biaxial strain from ±1% over a wide range of temperatures (300–500 K). In addition, the interface state densities at the Schottky-AlGaN interface are introduced in the model. This physics-based model calculates the charge due to applied, thermal and lattice mismatch strain and temperature effects at the two-dimensional electron gas (2DEG) interface of the HEMT. Coupled with a model for the 2DEG mobility that includes strain and temperature effects, current–voltage characteristics for the HEMT are derived above the threshold voltage. Regimes with large strain sensitivity and temperature compensation are identified and vice-versa. The analysis from the model clarifies the large range of strain response variations observed in the experimentally measured characteristics of HEMTs in literature. Furthermore, the developed model is a useful tool for predicting the response of HEMTs used in sensing and under the influence of packaging in extreme environments, especially when temperature fluctuation and strain coupling is of concern.