Microstructure changes in Sn-3.5Ag solder alloy during creep
Experimental data on behavior of the Sn-3.5Ag solder alloy microstructure during tensile creep deformation and subsequent failure is described. Depending upon applied stress, the nucleation and further development of grain boundary defects that start at an earlier stage in the deformation process was revealed. A discussion is presented on possible micromechanisms of the crack formation process.