Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modules
A new class of organic dielectrics, benzocyclobutenes, 1, are described and their application to the fabrication of thin film multichip modules is detailed. Key properties for3, a siloxy containing BCB derivative include low dielectric constant (2.7), low loss (0.008 at 1 MHz), low water absorption (0.25% after 24 h water boil) and high degree of planarization (>90% from one layer coverage). All other properties meet the requirements necessary for fabrication of thin film MCM structures.