A Cu-Ni-Si-based copper alloy strip and its manufacturing method for an electronic material
A good balance of strength and electrical conductivity, moreover, provides a Cu-Si-Co alloy strip which hanging curl is suppressed. A Co: 0.5 to 2.5 wt%, Si: 0.1 to 0.7 containing mass%, the balance being a copper alloy strips for electronic material composed of Cu and unavoidable impurities, rolling surface with results obtained by X-ray diffraction pole figure measurement relative to the copper alloy strip satisfies the following a (a): (a) {200} of the diffraction peak intensity of β scanning in the alpha = 25 ° in the pole figure , the peak height of β angle 120 ° is more than 10 times relative to that of standard copper powder. .BACKGROUND