Quantitative adhesion data for two energetic physical vapor-deposition processes
This paper provides quantitative ring shear adhesion data for copper plated on titanium (Ti-6Al-4V) by the hot hollow cathode physical vapor deposition process and copper plated on 304 stainless steel by magnetron ion plating. These are the first known published data of these types for physically vapor deposited coatings and they show that adhesion on difficult to plate substrates was quite good and compares favorably with data for electrodeposited coatings on similar substrates.