A Guide to Microsoft Excel for Scientists and Engineers
non-members This volume in the series on electronic packaging materials science is based on papers presented at the December 1996 MRS meeting, with a special focus on technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. Many of the papers are of interest to readers of IEEE Electrical Itzsulatiolz, as follows. There are several papers on conducting adhesives, including silver-filled, nickel-filled, and conducting polymer-filled systems discussing the role of particle shape and formation of conducting pathways by curing in an electric field. Thermal and mechanical properties of polymer dielectric films used in various devices and as encapsulants are also discussed in this book. These papers describe new characterization techniques uniquely suited for working with thin films as opposed to bulk samples. Several papers describe failure mechanisms in polymer-based electronic packages and strategies for improving adhesion at metal-polymer interfaces in these systems. There are a few papers related to metal deposition on printed wiring boards, but that is not the main focus for this volume. Thus, the book would be most useful to those involved in conductive adhesive, encapsulants, polymer thin films, or polymer-based electronic packages. -K. E Schoch A Guide to Microsoft Excel for Scientists and Engineers by Bernard V Liengme John Wiley & Sons, Inc. 605 Third Ave. New York, NY 10158-0012