Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures

The integrated fan-out (InFO) wafer-level chip-scale package (WLCSP) is introduced for modern system-in-package designs with larger I/O counts, higher interconnection density, and small form factors. A redistribution layer (RDL) in an InFO package is an extra metal layer for interchip connections, and RDL routing is crucial for achieving desired interchip connections. In a high-density InFO package, multiple RDLs with flexible vias are often adopted. To integrate chips of different technology nodes into one package, irregular pad structures need to be considered; however, no published RDL routing work considers flexible vias or irregular pad structures. This article formulates a new RDL routing problem with unified-assigned pad pairs on a via-based multilayer multichip InFO package with irregular pad structures and presents the first algorithm for this problem. The algorithm consists of a preprocessing stage, three routing stages, and a layout optimization stage. The preprocessing stage analyzes routing resources and potential routing congestion. The first routing stage performs layer assignment based on a weighted maximum planar subset of chords algorithm to route interchip nets concurrently. The second routing stage constructs a 3-D routing graph based on partitioned octagonal tiles to handle the irregular layout structure and applies A*-search to route remaining interchip nets. The third routing stage transforms a routing graph into a network-flow model to perform concurrent routing for chip-to-board nets by applying the minimum-cost maximum-flow algorithm. Finally, we develop an efficient linear-programming-based layout optimization algorithm to find desired solutions. Experimental results show that our router can achieve 100% routablility for all benchmarks under limited RDLs, while the previous state-of-the-art work cannot.