Simulation analysis of a specification package for high density and high voltage power module

A novel packaging designing for high density and high voltage power module, namely TPak was proposed. It uses flip-chip welding technology and through-hole technology to avoid the parasitic parameters introduced by wire bonding in traditional electrical interconnection, so that the proposed efficiency of the entire high-voltage module is close to 100%, parasitics are reduced by an order of magnitude, and module manufacturing is simplified and the module mechanical stress capability is improved. The finite element simulation anakysis of heat and force are carried out by means of simulation software, and the problems existing in the current Tpak packaging are analyzed from the perspective of materials, and improvement methods are proposed to optimize performance and improve its reliability.