Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels


 High integration of modern microwave circuits and systems puts forward higher requirements for multi-function and electromagnetic compatibility (EMC) performance of transmission channels. In this paper, we design a multi-functional spoof surface plasmon polariton (SSPP) channel which can realize continuous phase modulations more than 180° in X-band and continuous amplitude modulations from -1dB to -40dB in Ku-band. Based on the multi-functional SSPP channel, we propose two EMC technologies, including the substrate integrated packaging (SIP) method and the tunable wavenumber mismatching (TWM) method. The SIP method can effectively isolate the inside and outside of the package to avoid mutual interference with easy fabrication and compact size (0.13 λ0 × 0.043 λ0). Meanwhile, simulated and measured results demonstrate that the coupling coefficient of the packaged SSPP channels is about 8-10dB lower than that without packaging, and 13-15dB lower than that of traditional microstrip channels in the whole X-band and Ku-band. The TWM method is realized by designing the wavenumber difference between two channels. Simulated and measured results demonstrate that the coupling coefficient of two adjacent channels with a distance of 1/30 λ0 can be reduced to around -30dB in varied frequency bands. Therefore, the two proposed EMC technologies have application potentials of highly integrated microwave circuits and systems to achieve multiple functions and good EMC performance.