Manufacturing of Pure Copper with Electron Beam Melting and the Effect of Thermal and Abrasive Post-Processing on Microstructure and Electric Conductivity

Due to the increasing demand for electrification in the automotive sector, the interest in the manufacturing and processing of pure Copper (Cu; purity 99.99%) is also increasing. Laser-based technologies have proven to be challenging due to Cu’s high optical reflectivity. Processing pure Cu with Electron Beam Melting (EBM) is a promising manufacturing route, allowing for high design freedom. The highest priority is to achieve outstanding thermal and electric conductivity in manufactured Cu components. Chemical contamination or manufacturing defects, such as porosity, significantly reduce the thermal and electric conductivity. The literature on post-processing (thermal and abrasive) of additively manufactured Cu is scarce. Therefore, this study discusses the correlation between as built and heat treated microstructure, as well as surface roughness on the EBM electric conductivity. EBSD analysis is performed to analyze the effect of microstructure on electric conductivity. The effect of sandblasting and vibratory finishing on surface roughness and electric conductivity is investigated. Additionally, the samples are mechanically tested in terms of hardness.