Tapered Differential Multibit Through Glass Vias for Three-Dimensional Integrated Circuits

We present an electrical model of tapered differential-multibit through glass vias (DM-TGVs) for high density three-dimensional (3-D) integration. Analytical equations are developed to compute the impedance parasitics of tapered DM-TGVs. Simulations using the 3-D field solver with parameter modifications, such as slope angle of the TGV, type of filler material are used to confirm the scalability of the proposed model. We examine the electrical behavior of tapered TGVs in the frequency domain using the proposed model. Eye-diagram measurements are also used to verify the frequency dependent loss of capacitive-resistive TGV in the time domain.