Comparison of contact metals evaporated onto monolayer molybdenum disulfide

Understanding and improving the contact resistance of two-dimensional materials for the fabrication of next-generation devices is of vital importance to be able to fully utilize the new physics available in these materials. In this work, eight different contact metals (Ag, Au, Cr, Cu, In, Mo, Ni, and Ti) have been investigated using the same sample of monolayer MoS2. Through the fabrication and testing of multiple, identically sized field-effect transistor devices per contact metal, we compensate for large variability in electrical properties of as-grown chemical vapor deposition MoS2 and deduce the relative performance of each metal. The general trend of lower work function metals having lower contact resistance holds with In, Ag, and Ti performing the best of the metals tested. Our results are compatible with recent research suggesting that the contact resistance in undoped, monolayer MoS2 is dominated by a lateral junction resistance, and we provide context for how this manifests in device-to-device variation. Multiple orders of magnitude differences in contact resistance are observed between metals and can be explained by this lateral barrier operating in the thermionic-field emission regime.