Influence of Temperature and Flow Ratio on the Morphology and Uniformity of 4H-SiC Epitaxial Layers Growth on 150 mm 4° Off-Axis Substrates

The homoepitaxial growth of 4H-SiC films was conducted on 4H-SiC 150 mm 4° off-axis substrates by using a home-made hot-wall chemical vapor deposition (CVD) reactor. Special attention was paid to the influence of the growth temperature on the surface morphology, growth rate, doping efficiency, and structural uniformity of the films. Among the above factors, growth temperature and flow ratio were shown to be the essential parameters to produce high-quality homoepitaxial layers. Furthermore, a two-side flow tunnel was introduced to control the growth temperature nonuniformity in the reactor. The influence of flow ratio on the epitaxial layer uniformity was also studied. It was found that the surface roughness increased with the increasing temperature, achieving its minimum value of 0.183 nm at 1610 °C. Besides that, the film growth rate decreased with the increase in growth temperature, whereas the degrees of thickness non-uniformity, N2 doping non-uniformity, and doping efficiency increased. Meanwhile, both the thickness and doping uniformity can be improved by adjusting H2 and N2 flow ratios, respectively. In particular, the use of the H2 ratio of 1.63 and N2 ratio of 0.92 enabled one to increase the degree of uniformity of thickness and doping by 0.79% (standard deviation/mean value) and 3.56% (standard deviation/mean value), respectively, at the growth temperature of 1630 °C.