Design Optimization By Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies


 A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using ‘virtual prototyping’. Here, a virtual flip chip ball grid array (FC-BGA) is examined in compari-son to a reference chip scale package (CSP). The com-parison is performed using finite element (FE) simula-tion. A combined measurement-simulation technique is used to calibrate the finite element simulations on a reference object. The adjustment is based on the in-plane deformation field obtained by both simulation and opti-cal measurement. For the latter, an optical sensor is used for in-plane deformation and strain field analysis based on the gray-scale correlation method. The obtained find-ings can be extrapolated to alternative package types with different but similar design to evaluate their suita-bility for the desired application before physical fabrication.