Wafer Surface Defect Detection Based on Feature Enhancement and Predicted Box Aggregation

For wafer surface defect detection, a new method based on improved Faster RCNN is proposed here to solve the problems of missing detection due to small objects and multiple boxes detection due to discontinuous objects. First, focusing on the problem of small objects missing detection, a feature enhancement module (FEM) based on dynamic convolution is proposed to extract high-frequency image features, enrich the semantic information of shallow feature maps, and improve detection performance for small-scale defects. Second, for the multiple boxes detection caused by discontinuous objects, a predicted box aggregation method is proposed to aggregate redundant predicted boxes and fine-tune real predicted boxes to further improve positioning accuracy. Experimental results show that the mean average precision of the proposed method, when validated on a self-developed dataset, reached 87.5%, and the detection speed was 0.26 s per image. The proposed method has a certain engineering application value.