A Critical Review on Geometric Improvements for Heat Transfer Augmentation of Microchannels

With the application of microdevices in the building engineering, aerospace industry, electronic devices, nuclear energy, and so on, the dissipation of high heat flux has become an urgent problem to be solved. Microchannel heat sinks have become an effective means of thermal management for microdevices and enhancements for equipment due to their higher heat transfer and small scale. However, because of the increasing requirements of microdevices for thermal load and temperature control and energy savings, high efficiency heat exchangers, especially microchannels are receiving more and more attention. To further improve the performance of microchannels, optimizing the channel geometry has become a very important passive technology to effectively enhance the heat transfer of the microchannel heat sink. Therefore, in this paper, the microchannel geometry characteristics of previous studies are reviewed, classified and summarized. The review is mainly focused on microchannel geometry features and structural design to strengthen the effect of heat transfer and pressure drop. In addition, the correlation between boiling heat transfer and geometric characteristics of microchannel flow is also presented, and the future research direction of microchannel geometry design is discussed.