Investigation of temperature sensitivity of a MEMS gravimeter based on
 geometric anti-spring

This paper describes a technique for temperature sensitivity or thermal sag measurements of a geometric anti-spring based microelectromechanical system (MEMS) gravimeter (Wee-g). The Wee-g MEMS gravimeter is currently fabricated on a (100) silicon wafer using standard micro-nano fabrication techniques. The thermal behavior of silicon indicates that the Young’s modulus of silicon decreases with increase in temperature (∼64 ppm/K). This leads to a softening of the silicon material, resulting in the proof mass displacing (or sagging) under the influence of increasing temperature. It results in a change in the measured gravity, which is expressed as temperature sensitivity in terms of change in gravity per degree temperature. The temperature sensitivity for the silicon based MEMS gravimeter is found to be 60.14–64.87, 61.76, and 62.76 µGal/mK for experimental, finite element analysis (FEA) simulation, and analytical calculations, respectively. It suggests that the gravimeter's temperature sensitivity is dependent on the material properties used to fabricate the MEMS devices. In this paper, the experimental measurements of thermal sag are presented along with analytical calculations and simulations of the effect using FEA. The bespoke optical measurement system to quantify the thermal sag is also described. The results presented are an essential step toward the development of temperature insensitive MEMS gravimeters.