Study on Process Parameters of Low-power Semiconductor Laser Stripping PTFE Insulating Layer of Aviation Wire

Faced with the increasingly high-quality requirements for the insulation layer stripping at the end of aviation wires, laser wire stripping technology is becoming more and more popular due to its good processing quality and production efficiency. Traditional laser wire strippers generally have problems of bulky size and high control cost and are not suitable for the decentralized processing of large wire harness products. This work explores the feasibility of using a low-power semiconductor laser to strip the PTFE insulating layer of aviation wires. The influence of the parameter changes of each processing factor on the cut morphology of the insulating layer was studied separately. It was found that higher laser power removed more insulating layers per unit of time, but reduced the cutting quality. High laser scanning speed can obtain good insulation cutting quality, but too large or too small scanning speed will reduce the stripping efficiency. Simultaneous improvements in insulation cutting quality and efficiency depend on the right mix of power and scanning speed.