Proposal for a Council Decision concerning the elimination of duties on information technology products
COMMISSION OF THE EUROPEAN COMMUNITIES Brussels, 05. 03. 1997 COM(97)96 final 97/0082 (ACC) 97/0083 (ACC) Proposal for a COUNCIL DECISION concerning the elimination of duties on information technology products Proposal for a COUNCIL DECISION concerning elimination of duties on certain spirituous beverages (presented by the Commission) EXPLANATORY MEMORANDUM At its special meeting on 13 December 1996 in Singapore, Council approved (1) a Ministerial Declaration on trade in Information Technology Products and (2) welcomed the ad referendum bilateral agreement reached with the US on the acceleration of the Uruguay Round zero rates on "Brown" spirits and for zero rates on other spirituous beverages. With respect to the Information Technology Agreement, Council will recall that on 3 December 1995, in the context of the EU/US summit in Madrid, the EU and US established a New Transatlantic Agenda which, inter alia, states "In view of the importance of the information society, we are launching a specific exercise in order to attempt to conclude an information technology agreement. " The parallel and associated industry forum, the Trans Atlantic Business Dialogue, added weight to this political undertaking, by stating that "it is the view of the overwhelming majority that the ITA package should include a commitment to eliminate all tariffs by January 2000, or sooner". On 22 October 1996, as a result of exploratory consultations with a number of third countries and discussions within the special committee provided for under Article 113 of the Treaty, the Commission proposed to the Council to take a Decision to open negotiations with third countries with a view to concluding an Information Technology Agreement. The decision to do so was taken by the Council on 15 November 1996. Plurilateral negotiations led to a Declaration being made by Ministers from 15 WTO members or accession candidates (Australia, Canada, Chinese Taipei, EU, Hong Kong, Iceland, Indonesia, Japan, Korea, Liechtenstein, Norway, Singapore, Switzerland, Turkey, United States) at Singapore on 13 December 199,5. The declaration set out the objective of tariff elimination by the year 2000 (and prescribes reductions in four equal steps) for IT products listed in detail, in attachments. Attention is drawn, in particular to paragraph 4 of the modalities to the Declaration: in that participants the Declaration provided "Participants shall meet as soon as practicable and in any case no later than 1 April 1997 to review the state of acceptances received and to assess the conclusions to be drawn therefrom. Participants win implement the actions foreseen representing approximately 90 per cent of world trade1 in information technology products have by then notified their acceptance, and provided that the staging has been In assessing whether to implement agreed to the participants' satisfaction. actions foreseen trade if the percentage of world in the Declaration, represented by participants falls somewhat short of 90 per cent of world trade in information technology products, participants may take into account the extent of territories the participation cf States or separate customs representing for them the substantial bulk of their own trade in such products. At this meeting the participants will establish whether these criteria have been met. " 'This percentage shall be calculated by the WTO Secretariat on the basis of the most recent data available at the time of the meeting. 1 On 31 January 1997, plurilateral technical discussions called for under the Ministerial Declaration, were completed. Product coverage was discussed but the original attachment to the Ministerial Declaration was not modified. Agreement was reached that the first set of consultations on additional product coverage would begin 1 October 1997 and ad referendum agreement was reached on the "extended staging" requests of some original signatories. These included: Indonesia, Korea and Chinese Taipei. New Zealand, without requesting "extra staging" and Costa Rica, subsequent to agreement with the other participants on its "extra staging" request, became participants. The Council decided at a special meeting held on 13 December 1996 at Singapore that a further Council decision would be required, prior to the review scheduled to take place before 1 April 1997, to give a definitive acceptance of the agreement. This would be necessary in order to bind the Community with respect to its undertakings. Such a decision, however, is dependent upon the critical mass provisions and agreement on "staging". To prepare the ground, the draft decision attached is made on the basis that both of these criteria are met. If, as the end of March approaches, these criteria are not met, the matter would have to be reviewed. With respect to spirituous beverages, the Commission considers that the agreement reached with the United States in the form of a Memorandum of Understanding would considerably improve the EU's export potential. The Commission will continue its efforts to bring other parties into this agreement. The Commission therefore hereby submits to the Council two proposals for Council Decisions. * t Proposal for a Council Decision concerning the elimination of duties on information technology products 97/0082 (ACC) THE COUNCIL OF THE EUROPEAN UNION Having regard to the Treaty establishing the European Community, and in particular Articles 113, in conjunction with Article 228(2) first sentence, thereof, Having regard to the proposal from the Commission, Whereas in the new Transatlantic Agenda adopted at the EU-US summit in Madrid of 13 December 1995, it was decided to attempt to conclude an Information Technology Agreement; Whereas, following reports from the Commission of its exploratory consultations with third countries, on 16 November 1996 Council decided to open negotiations with third countries with a view to concluding an Information Technology Agreement; Whereas at Singapore on 13 December 1996, the European Community approved the declaration on trade in Information Technology Products; whereas this declaration sets out certain preconditions for the implementation of the elimination of tariffs for information technology products, whereas these preconditions have been met. HAS DECIDED AS FOLLOWS: Article 1 The agreement in the form of a declaration of 13 December 1996 made by Ministers at Singapore on trade in information technology products is hereby approved on behalf of the Community. The text of the Agreement is attached to this Decision, Article 2 As called for under paragraph 4 of the Annex to the Declaration, the Council: (i) takes note that participants representing approximately 90 per cent of world trade in information technology products have notified their acceptance; and (ii) approves, on behalf of the Community, the staging requests of some participants in the ITA. Article 3 The Council authorises the Commission to submit to the World Trade Organisation the attached modifications to the schedule of the European Community so as to bind and eliminate customs duties, as appropriate, in accordance with the Declaration. Article 4 The President of the Council is hereby authorised to designate the person empowered to sign the Agreement/Protocol in order to bind the Community. Done at Brussels For the Council The President WORLD TRADE ORGANIZATION MINISTERIAL CONFERENCE Singapore, 9-13 December 1996 13 December 1996 MINISTERIAL DECLARATION ON TRADE IN INFORMATION TECHNOLOGY PRODUCTS SINGAPORE, 13 DECEMBER 1996 Ministers, Representing the following Members of the World Trade Organization ("WTO"), and States or separate customs territories in the process of acceding to the WTO, which have agreed in Singapore on the expansion of world trade in information technology products and which account for well over 80 per cent of world trade in these products ("parties"): Australia Canada European Communities Hong Kong Iceland Indonesia Japan Korea Norway Separate Customs Territory of Taiwan, Penghu, Kinmen and Matsu Singapore Switzerland1 Turkey United States Considering the key role of trade in information technology products in the development of information industries and in the dynamic expansion of the world economy, Recognizing the goals of raising standards of living and expanding the production of and trade in goods; Desiring to achieve maximum freedom of world trade in information technology products; Desiring to encourage the continued technological development of the information technology industry on a world-wide basis; Mindful of the positive contribution information technology makes to global economic growth and welfare; 'On behalf of the customs union Switzerland and Liechtenstein. _, 5 Page 2 Having agreed to put into effect the results of these negotiations which involve concessions additional to those included in the Schedules attached to the Marrakesh Protocol to the General Agreement on Tariffs and Trade 1994, and Recognizing that the results of these negotiations also involve some concessions offered in negotiations leading to the establishment of Schedules annexed to the Marrakesh Protocol, Declare as follows: Each party's trade regime should evolve in a manner that enhances market access opportunities 1. for information technology products. 2. Pursuant to the modalities set forth in the Annex to this Declaration, each party shall bind and eliminate customs duties and other duties and charges of any kind, within the meaning of Article II: 1(b) of the General Agreement on Tariffs and Trade 1994, with respect to the following: (a) (b) all products classified (or classifiable) with Harmonized System ( 1996) (" HS ") headings listed in Attachment A to the Annex to this Declaration; and all products specified in Attachment B to the Annex to this Declaration, whether or not they are included in Attachment A; through equal rate reductions of customs duties beginning in 1997 and concluding in 2000, recognizing that extended staging of reductions and, before implementation, expansion of product coverage may be necessary in limited circumstances. 3. Ministers express satisfaction about the large product coverage outlined in the Attachments to the Annex to this Declaration. They instruct their respective officials to make good faith efforts to finalize plurilateral technical discussions in Geneva on the basis of these modalities, and instruct these officials to complete this work by 31 January 1997, so as to ensure the implementation of this Declaration by the largest number of participants. 4. Ministers invite the Ministers of other Members of the WTO, and States or separate customs territories in the process of acceding to the WTO, to provide similar instructions to their respective officials, so that they may participate in the technical discussions referred to in paragraph 3 above and participate fully in the expansion of world trade in information technology products. Annex: Modalities and Product Coverage Attachment A: list of HS headings Attachment B: list of products r> Page 3 ANNEX Modalities and Product Coverage Any Member of the World Trade Organization, or State or separate customs territory in the process of acceding to the WTO, may participate in the expansion of world trade in information technology products in accordance with the following modalities: 1. Each participant shall incorporate the measures described in paragraph 2 of the Declaration into its schedule to the General Agreement on Tariffs and Trade 1994, and, in addition, at either its own tariff line level or the Harmonized System (1996) ("HS") 6-digit level in either its official tariff or any other published versions of the tariff schedule, whichever is ordinarily used by importers and exporters. Each participant that is not a Member of the WTO shall implement these measures on an autonomous basis, pending completion of its WTO accession, and shall incorporate these measures into its WTO market access schedule for goods. 2. To this end, as early as possible and no later than 1 March 1997 each participant shall provide all other participants a document containing (a) the details concerning how the appropriate duty treatment will be provided in its WTO schedule of concessions, and (b) a list of the detailed HS headings involved for products specified in Attachment B. These documents will be reviewed and approved on a consensus basis and this review process shall be completed no later than 1 April 1997. As soon as this review process has been completed for any such document, that document shall be submitted as a modification to the Schedule of the participant concerned, in accordance With the Decision of 26 March 1980 on Procedures for Modification and Rectification of Schedules of Tariff Concessions (BISD 27S/25). (a) The concessions to be proposed by each participant as modifications to its Schedule shall bind and eliminate all customs duties and other duties and charges of any kind on information technology products as follows: (i) elimination of such customs duties shall take place through rate reductions in equal steps, except as may be otherwise agreed by the participants. Unless otherwise agreed by the participants, each participant shall bind all tariffs on items listed in the Attachments no later than 1 July 1997, and shall make the first such rate reduction effective no later than 1 July 1997, the second such rate reduction no later than 1 January 1998, and the third such rate reduction no later than 1 January 1999, and the elimination of customs duties shall be completed effective no later than 1 January 2000. The participants agree to encourage autonomous elimination of customs duties prior to these dates. The reduced rate should in each stage be rounded off to the first decimal; and (ii) elimination of such other duties and charges of any kind, within the meaning of Article II: 1(b) of the General Agreement, shall be completed by 1 July 1997, except as may be otherwise specified in the participant's document provided to other participants for review. (b) The modifications to its Schedule to be proposed by a participant in order to implement its binding and elimination of customs duties on information technology products shall achieve this result: (i) in the case of the HS headings listed in Attachment A, by creating, where appropriate, sub-divisions in its Schedule at the national tariff line level; and 7 Page 4 (ii) in the case of the products specified in Attachment B, by attaching an annex to its Schedule including all products in Attachment B, which is to specify the detailed HS headings for those products at either the national tariff line level or the HS 6-digit level. Each participant shall promptly modify its national tariff schedule to reflect the modifications it has proposed, as soon as they have entered into effect. 3. Participants shall meet periodically under the auspices of the Council on Trade in Goods to review the product coverage specified in the Attachments, with a view to agreeing, by consensus, whether in the light of technological developments, experience in applying the tariff concessions, or changes to the HS nomenclature, the Attachments should be modified to incorporate additional products, and to consult on non-tariff barriers to trade in information technology products. Such consultations shall be without prejudice to rights and obligations under the WTO Agreement. 4. Participants shall meet as soon as practicable and in any case no later than 1 April 1997 to review the state of acceptances received and to assess the conclusions to be drawn therefrom. Participants will implement the actions foreseen in the Declaration provided that participants representing approximately 90 per cent of world trade2 in information technology products have by then notified their acceptance, and provided that the staging has been agreed to the participants' satisfaction. In assessing whether to implement actions foreseen in the Declaration, if the percentage of world trade represented by participants falls somewhat short of 90 per cent of world trade in information technology products, participants may take into account the extent of the participation of States or separate customs territories representing for them the substantial bulk of their own trade in such products. At this meeting the participants will establish whether these criteria have been met. 5. Participants shall meet as often as necessary and no later than 30 September 1997 to consider any divergence among them inclassifying information technology products, beginning with the products specified in Attachment B. Participants agree on the common objective of achieving, where appropriate, a common classification for these products within existing HS nomenclature, giving consideration to interpretations and rulings of the Customs Co-operation Council (also known as the World Customs Organization or "WCO"). In any instance in which a divergence in classification remains, participants will consider whether a joint suggestion could be made to the WCO with regard to updating existing HS nomenclature or resolving divergence in interpretation of the HS nomenclature. 6. The participants understand that Article XXUI of the General Agreement will address nullification or impairment of benefits accruing directly or indirectly to a WTO Member participant through the implementation of this Declaration as a result of the application by another WTO Member participant of any measure, whether or not that measure conflicts with the provisions of the General Agreement. Each participant shall afford sympathetic consideration to any request for consultation from 7. any other participant concerning the undertakings set out above. Such consultations shall be without prejudice to rights and obligations under the WTO Agreement. Participants acting under the auspices of the Council for Trade in Goods shall inform other 8. Members of the WTO and States or separate customs territories in the process of acceding to the WTO of these modalities and initiate consultations with a view to facilitate their participation in the expansion of trade in information technology products on the basis of the Declaration. 2This percentage shall be calculated by the WTO Secretariat on the basis of the most recent data available at the time of the meeting. 8 Page 5 9. As used in these modalities, the term "participant" shall mean those Members of the WTO, or States or separate customs territories in the process of acceding to the WTO, that provide the document described in paragraph 2 no later than 1 March 1997. 10. This Annex shall be open for acceptance by all Members of the WTO and any State or any separate customs territory in the process of acceding to the WTO. Acceptances shall be notified in writing to the Director-General who shall communicate them to all participants. 9 Page 6 There are two attachments to the Annex. Attachment A lists the HS headings or parts thereof to be covered. Attachment B lists specific products to be covered by an ITA wherever they are classified in the HS. HS96 3818 8469 8470 Attachment A, Section 1 HS description Chemical elements doped for use in electronics, in form of discs, wafers or similar forms; chemical compounds doped for use in electronics 11 Word processing machines Calculating machines and pocket-size data recording, reproducing and displaying machines with a calculating function; accounting machines, postage franking machines, ticket-issuing machines and similar machines, incorporating a calculating devices; cash registers: 8470 10 Electronic calculators capable of operating without an external source of electric power and pocket size data recording, reproducing and displaying machines with calculating functions 2! 29 30 40 50 90 8470 8470 8470 8470 8470 8470 8471 8471 8471 10 30 8471 41 847; 8471 49 50 847) 8471 8471 8471 8472 8473 60 70 80 90 90 21 ex Other electronic calculating machines incorporating a printing device Other •• Other calculating machines Accounting machines Cash registers Other Automatic data processing machines and units thereof; magnetic or optical readers, for machines for processing such data, not elsewhere specified or included: transcribing data onto data media form and machines in coded Analogue or hybrid automatic data processing machines Portable digital automatic data processing machines, weighing no more than 10 kg, consisting of at least a central processing unit, a keyboard and a display Other digital automatic data processing machines comprising in the same housing at least a central processing unit and an input and output unit, whether or not combined Oiher digital automatic data processing machines presented in the form of systems Digital processing units other than those of subheading 8471 41 and 8471 49, whether or not in the same housing one or two of the following types of units : storage units, input units, output units Input or output units, whether or not containing storage units in the same housing Storage units, including central storage units, optical disk storage units, hard disk drives and magnetic tape storage units Other units of automatic data processing machines Other Automatic teller machines Parts and accessories of the machines of heading No 8470 of the electronic calculating machines of subheading 8470 10, 8470 21 and 8470 29 8473 29 Parts and accessories of the machines of heading No 8470 other than the electronic calculating machines of subheading 8470 10, 8470 21 and 8470 29 8473 30 Parts and accessories of the machines of heading No 8471 Page 7 8473 50 Parts and accessories equally suitable for use with machinés of two or more of the headings Nos. 8469 to 8472 ex 8504 40 ex 8504 50 Static converters for automatic data processing machines and units thereof, and telecommunication apparatus Other inductors for power supplies for automatic data processing machines and units thereof, and telecommunication apparatus 8517 8517 8517 8517 8517 8517 8517 8517 8517 8518 8518 8518 8520 8523 8523 8523 8523 8523 8524 8524 8524 8524 8424 8525 8525 8525 8527 8529 11 19 21 22 30 50 80 90 10 30 29 20 11 12 13 20 90 31 39 40 91 99 10 20 40 90 10 ex ex ex ex ex ex ex ex ex Electrical apparatus for line telephony or line telegraphy, including line telephone sets line with cordless handsets and systems or for digital lin'î systems; videophones: telecommunication apparatus for carrier-current Line telephone sets with cordless handsets Other telephone sets and videophones Facsimile machines Teleprinters Telephonic or telegraphic switching apparatus Other apparatus, for earner-current line systems or for digital line systems Other apparatus including entry-phone systems Parts of apparatus of heading 8517 Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use Line telephone handsets Loudspeakers, without housing, having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 50 mm, for telecommunication use Telephone answering machines Magnetic tapes of a width not exceeding 4 mm Magnetic tapes of a width exceeding 4 mm but not exceeding 6,5 mm Magnetic tapes of a width exceeding 6,5 mm Magnetic discs Other Discs for laser reading systems for reproducing phenomena other than sound or image Other : - for reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine Magnetic tapes for reproducing phenomena other than sound or image Media for reproducing phenomena other than sound or image Other : - for reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine Transmission apparatus other than apparatus for radio-broadcasting or television Transmission apparatus incorporating reception apparatus Digital still image video cameras Portable receivers for calling, alerting or paging Aerials or antennae of a kind used with apparatus for radio-telephony and radio-telegraphy 11 Page 8 ex 8 5 2 9 [ 90 ex 8531 20 8531 8532 8532 90 10 Parts of: transmission apparatus other than apparatus for radio-broadcasting or television transmission apparatus incorporating reception apparatus digital still image video cameras, portable receivers for calling, alerting or paging * Indicator panels incorporating liquid crystal devices (LCD) or light emitting diodes (LED) Parts of apparatus of subheading 8531 20 Electrical capacitors, fixed, variable or adjustable (pre-set): Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive power handling capacity of not less than 0,5 kvar (power capacitors) Tantalum fixed capacitors 22 IT 24 25 29 1ÏÏ" 90 Aluminium electrolytic fixed capacitors Ceramic dielectric, single layer fixed capacitors Ceramic dielectric, multilayer fixed capacitors Dielectric fixed capacitors of paper or plastics Other fixed capacitors Variable DT adjustable (pre-set) capacitors Parts resistors (including Electrical resistors: Fixed carbon resistors, composition or film types rheostats and potentiometers), other fhan heating Other fixed resistors for a power handling capacity not exceeding 20 W 21 "29" Other fixed resistors tor a power handling capacity of 20 W or more 31 Wirewound variable resists, including rheostats and potentiometers, for a power handling capacity not exceeding 20 W Wirewound variable resistors, including rheostats and potentiometers, for a power handling capacity of 20 W or morr Other variable resistors, including rheostats and potentiometers 8532 8532 153T 8532 8532 8532 "853T 8532 8533 8533 8533 im 8533 ex ex 8533 39 40 90 8533 8533 8534 1536" 50 8536 50 "853T "5536" 8536 8541 854 854 854! 50 69 90 10 21 29 Pans Printed circuits Electronic AC switches consisting of optically coupled input and output circuits (Insulated thyristor AC switches) Electronic switches, including temperature protected electronic switches, consisting of a transistoi and a logic chip (chip-on-chip technology) for a voltage not exceeding 1000 volts Electromechanical snap-action switches for a current not exceeding 11 amps Plugs and sockets for co-ax»ai cables and printed circuits Connection and contact elements for wires and cables Diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes; mounted piezo-electric crystals: Diodes, other than photosensitive or light-emitting diodes Transistors, other than photosensitive transistors, with a dissipation rate of less than 1 W Transistors, other than photosensitive transistors, with a dissipation rate of 1 W or more 8541 8541 8541 8541 8541 8542 8542 8542 8542 8542 8542 8542 8542 8542 8543 8543 8544 30 40. 50 60 90 12 13 14 19 30 40 50 90 81 89 41 ex Ci ex 8544 49 ex 8544 51 8544 9009 9009 9009. 9026 9026 9026 9026 9026 9027 9027 70 11 21 90 10 20 80 90 20 30 9027 50 9027 80 ex 9027 90 Page 9 Thyristors, diacs and triacs, other than photosensitive devices Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled" in modules or made up into panels; light emitting diodes Other semiconductor devices Mounted piezo-electric crystals Parts Electronic integrated circuits and microassemblies Cards incorporating an electronic integrated circuit ('smart' cards) Metal oxide semiconductors (MOS technology) Circuits obtained by bipolar technology Other monolithic digital integrated circuits, including circuits obtained by a combination of bipolar and MOS technologies (BIMOS technology) Other monolithic integrated circuits Hybrid integrated circuits Electronic microassemblies Part Proximity cards and tags Electrical machines with translation or dictionary functions Other electric conductors, for a voltage not exceeding 80 V, fitted with connectors, of a kind used for telecommunications Other electric conductors, for a voltage not exceeding 80 V, not fitted with connectors, of a kind used for telecommunications Other electric conductors, for a voltage exceeding 80 V but not exceeding 1000 V, fitted with connectors, of a kind used for telecommunications Optical fibre cables Electrostatic photocopying apparatus, operating by reproducing the original image directly onto the copy (direct process)] Other photocopying apparatus, incorporating an optical system Parts and accessories Instruments and apparatus for measuring or checking the flow, level, pressure or other variables of liquids or gases (for example, flow meters, level gauges, manometers, heat meters), excluding instruments and apparatus of heading No 9014, 9015, 9028 or 9032: Instruments for measuring or checking the flow or level of liquids Instruments and apparatus for measuring or checking pressure Other instruments and apparatus for measuring or checking of heading 9026 Parts and accessories of instruments and apparatus of heading 9026 Chromatographs and electrophoresis instruments Spectrometers, spectrophotometers and spectrographs using optical radiations (UV, visible, IR) Other instruments and apparatus using optical radiations (UV, visible, IR) of heading No 9027 Other instruments and apparatus of heading No 9027 (other than those of heading No 9027 10) Parts and accessories of products of heading 9027, other than for gas or smoke analysis apparatus and microtomes Page 10 9030 740 Instruments and apparatus for measuring and checking, specially designed for telecommunications (for example, cross-talk meters, gain measuring instruments, distorsion factor meters, psopbometers) Page 11 Attachment A, Section 2 Semiconductor manufacturing and testing equipment and parts thereof HS Code Description ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex tx ex ex ex ex ex 7017 10 8419 89 8419 90 8421 19 8421 91 8424 89 8424 89 8424 90 8456 10 8456 91 8450 91 8456 99 8456 99 8464 10 8464 20 8464 90 8466 91 8466 9! 8466 n 8466 93 8466 93 8466 93 8456 93 8466 93 8^77 10 8477 90 Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers Chemical vapor deposition apparatus for semiconductor production Parts of chemical vapor deposition apparatus for semiconductor production Spin dryers for semiconductot wafer processing Parts of spin dryers for semiconductor wafer processing the Deflash machines for cleaning and removing contaminants from metal leads of semiconductor packages prier to the electroplating process Spraying appliances for etching, stripping or cleaning semiconductor wafers Parts of spraying appliances for etching, stripping or cleaning semiconductor wafers Machines for working any material by removal of material, by laser or other lighfor photo beam in the production of semiconducttr wafers Apparatus for stripping or cleaning semiconductor wafers Machines for dry-etching patterns on semiconductor materials Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices Lasercutters for cutting contacting tracks in semiconductor production by laser beam Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips Grinding, polishing and lapping machines for processing of semiconductor wafers Dicing machines for scribing or scoring semiconductor wafers Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips Pans of dicing machines for scribing or scoring semiconductor wafers Parts of grinding, polishing and lapping machines for processing of semiconductor wafers Pans of focised ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam Parts of machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers Parts of apparatus for stripping or cleaning semiconductor wafers Parts of machines for dry-etching patterns on semiconductor materials Encapsulation equipment for assembly of semiconductors Parts of encapsulation equipment Comments For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B 15 Page 12 ex 8479 50 ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8480 71 8514 10 8514 20 8514 30 8514 30 8514 90 8514 90 8536 90 8543 11 8543 30 Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer'boxes and other material for semiconductor devices Apparatus for growing or pulling monocrystal semiconductor boules For Attachment B Apparatus for physical deposition by sputtering on semiconductor wafers Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Encapsulation equipment for assembly of semiconductors Epitaxial deposition machines for semiconductor wafers Machines for bending, folding and straightening semiconductor leads Physical deposition apparatus for for semiconductor production Spinners for coating photographic emulsions on semiconductor wafers Part of apparatus for physical deposition by sputtering on semiconductor wafers Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Parts for spinners for coating photographic emulsions on semiconductor wafers Parts of apparatus for growing or pulling monocrystal semiconductor boules Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat pane! displays Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices Parts of encapsulation equipment for assembly of semiconductors Parts of epitaxial deposition machines for semiconductor wafers Parts of machines for bending, folding and straightening semiconductor leads Parts of physical deposition apparatus for for semiconductor production Injection and compression moulds for the manufacture of semiconductor devices Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductors wafers Apparatus for rapid heating of semiconductor wafers Parts of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers Parts of apparatus for rapid heating of wafers Parts of furnaces and ovens of Headings No 8514 10 to No 8514 30 Wafer probers Ion implanters for doping semiconductor materials Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B 16 ex ex ex ex 8543 90 8543 90 9010 41 to 9010 49 9010 90 9011 10 ex 9011 20 9011 90 9011 90 ex 9012 10 9012 90 9017 20 ex 9017 90 9017 90 9030 82 9030 90 9030 90 9031 41 9031 49 9031 90 ex ex ex ex ex 9031 90 Page 13 Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays Parts of ion implanters for doping semiconductor materials Apparatus for projection, drawing or plating circuit patterns on sensitized semiconductor materials and flat panel displays Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49 For Attachment B Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates Parts of such pattern generating apparatus Instruments and apparatus for measuring or checking semiconductor wafers or devices Parts and accessories of instruments and apparatus for measuring or checking semiconductor wafers or devices Parts of instruments and appliances for measuring or checking semiconductor wafers or devices Optical instruments and appliances for or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices Optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers Parts and accessories of optical instruments and appliances for semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices Parts and accessories of optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers inspecting semiconductor wafers inspecting For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B 17 Page 14 Attachment B Positive list of specific products to be covered by this agreement wherever they are classified in the HS. Where parts are specified, they are to be covered in accordance with HS Notes 2(b) to Section XVI and Chapter 90, respectively. " Computers: automatic data processing machines capable of 1) storing the processing program or programs and at least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance with the requirements of the user; 3) performing arithmetical computations specified by the user; and 4) executing, without human intervention, a processing program which requires them to modify their execution, by logical decision during the processing run. The agreement covers such automatic data processing machines whether or not they are able to receive and process with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed aucio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified under Attachment A or B, are not covered by this agreement. Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof "Flat panel displays (including LCD, Electro Luminescence, Plasma and other technologies) for products falling within this agreement, and parts thereof. Network equipment: Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a nerwork that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units - including adapters, hubs, in-line repeaters, converters, concentrators bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof. Monitors : display units of automatic data processing machines with a cathode ray tube with a dot screen pitch smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally processed audio or video signals without assistance of a central processing unit of a computer as defined in this agreement. The agreement does not, therefore, cover televisions, including high definition televisions. 3 Optical disc storage units, for automatic data processing machines (including CD drives and DVD-drives), whether or not having the capability of writing/recording as well as reading, whether or not in their own housings. Paging alert devices, and parts thereof. Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017. Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements "Active elements" means diodes, transistors, and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542. Projection type fiat panel display units used with automatic data processing machines which can display digital information generated by the central processing unit. 1 Participants will conduct a review of this product description in January 1999 under the consultation provisions of paragraph 3 of the Declaration •i JL C Page 15 Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units. Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP machines and units thereof to process audio signals (sound cards). Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange EC - ITA - Schedule CXL CN97 Label 38 I S 00 ( 'hcmical elements doped loi use in elecltonics. m die form ol dises, ualers or similar lornis. e h e m u al compounds doped lor 3818 00 10 3818 00 90 7020 00 7020 00 05 7020 00 10 7020 00 30 7020 00 80 84 19 use in electronics I )oped silicon Other ( MMcr articles ol glass (Quartz reactor tuhes and holders designed lor insertion into diffusion and oxidation lurnaccs lor production ol semiconductor wafers ( )l fused quart/ or other fused silica Of glass ha\ ing a linear coefficient of expansion not exceeding 5 x 10-6 per KeK in u ithin a temperature range of 0 °C to 300 °C Other M a c h i n e r ,, plant or laboratory equipment, uMother or not electrical!) heated, for the treatment of materials by a process i n v o l v i ng a change of temperature such as heating, c o o k i n g. roasting, d i s t i l l i n g, rectifying, sterilizing, pasleuri/. ing. steaming. d r y i n g, evaporating, vapourizing. condensing or c o o l i n g, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, non-electric : 84 1 9 89 84 19 89 10 84198915 8419 89 20 Other C o o l i ng lowers and similar plant for direct cooling (without a separating wall) by means of recirculated water Apparatus for rapid healing of semiconductor wafers Apparatus for chemical vapour deposition on semiconductor wafers 8419 89 25 Apparatus for physical vapour deposition by electronic beam or 8419 89 30 8419 89 95 8419 90 84 19 90 10 S4I(> 90 20 evaporation on semiconductor wafers Vacuum-vapour plant for the deposition of metal Other Paris Of heat exchange units, for use in c i v il aircraft Of subheading 8419 20 00 Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 free free 6. 9 6. 9 4 5. 2 5. 2 3. 0 3. 5 3. 5 2. 0 free free free free free free free free free free free free free free free free free free free free free c i r o d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj P a ge 1 of 33 CN 9; Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 X1 19 '/1 3, X4 19 90 ,X( SI 2 I X42I 19 X42I 19 10 I or apparatus oi Mihhcadmg XI I 9 X9 |i in X 111>X9 25 2 7 2. 0 t Ither ( cntnliigos including c c n i n l i i g. il dr\ or s filler ing or purifx ing m a c h i n cn and apparatus. Inr liquids or gases ( )ther f or use m en il aircraft Other 8421 19 91 ( o n l r i l u g os ol a kind used in laboratories ( e n l r i l u g os ol a kind used in the maniil. n. luring ol semiconductors w alors Spinners for coating photographic emulsions on semiconductor wafers Other Other Paris Of centrifuges, including centrifugal drvers free free free free 0. 8 free 0. 4 free free l or apparatus of subheading 8421 19 93 and 8421 19 95 2. 5 1. 9 1. 3 0. 6 free 84 21 19 93 8421 19 95 8421 19 97 8421 91 10 8421 91 90 8421 99 00 8424 8424 89 8424 89 20 Other Other Mechanical appliances (whether or not hand-operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines : Other Spraying appliances for etching, stripping or cleaning semiconductor wafers free free free 2. 1 free 1. 4 free 0. 7 free free 8424 89 30 Deflash machines for cleaning and r e m o v i ng contaminants from 2. 8 the metal leads of semiconductor packages prior to the electroplating process 8424 89 80 8424 90 8424 90 10 8424 90 90 8428 Other Parts Of apparatus of heading 8424 89 20 Other Other l i f t i n g, handling, loading or unloading machiner} (for example, lifts, escalators, convenors, teleferics) : 2. 8 ïr^c 2. 1 1. 4 0. 7 free *\3. „. vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 2 of 33 C N 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 XI28 39 X42X 39 10 XI2. 8 39 91 842X 39 93 ( Mlicr I or use m v. i\ il airciall ( >thcr Holler c o m ov ois Automated in. ilen. il handling machines lor transport, handling frci free free tree free free and storage ol s c m u o n d u c l or wafers, waler cassettes, wafer boxes and other material lor semiconductor de\ ices 8428 39 98 Other 8431 Parts suitable lor use soloK or p r m u p a l lv with ihe macliinerv of 843 I. 39 8431 39 10 8431 39 20 8431 39 80 8456 8456 10 8456 10 10 8456 10 90 8456 91 00 8456 99 8456 99 10 8456 99 30 8456 99 90 8462 heading Nos X12< to XI to Other Of r o l l i n g - m i ll machiner) ol subheading 8128 90 3<) Of machiner) ol heading 8428 39 93 Other Machine-tools for w o r k i ng anv material bv removal of material, bv laser or other light or photon beam, ultrasonic, electro- discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes : Operated bv laser or other light or photon beam processes free 0. 8 Iree free Of a kind used in the manufacturing of semiconductor wafers or 4. 7 free devices Other f or dry-etching patterns on semiconductor materials Other Focused ion beam m Ming machines for producing or repairing masks and reticles for patterns on ssmiconductoi devices Apparatus for stripping or cleaning semiconductor wafers free free free free free 3. 5 free free free 2. 4 free f r ;e free 1. 2 free free free free free free free Other Machine-tools ( i n c l u d i ng presses) for w o r k i ng meta! by forging, hammering or die-stamping; machine-tools ( i n c l u d i ng presses) for w o r k i ng metal by bending, folding, straightening, flattening, shearing, punching or notching; presses for w o r k i ng metal or metal carbides, not specified above : Bending, f o l d i n g, straightening or flattening machines ( i n c l u d i ng 8462 21 Numerical I v controlled presses) £C v TN v e n d r e d i. 28. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj Page 3 of 33 CN97 Label Base Rate Final Bound Rate Implementation J u l. 1 9 97 Jan. 1998 Jan. 1999 Jan. 2000 8462 2 I 05 ol a kind used in manufacturing semiconductors leads 3 2 free 2. 4 1. 6 0. F ~ ""free" "" 8462 21 10 8462 21 80 8462 29 8462 29 05 8462 29 10 8462 29 91 8462 29 99 8464 8464 10 8464 10 10 8464 10 90 8464 20 8464 20 05 8464 20 11 8464 20 19 8464 20 80 8464 90 8464 90 10 8464 90 90 8466 8466 91 8466 91 15 8466 91 20 8466 91 95 l or w o r k i ng Mat products ( )thor Other f or bonding, folding ami straightening semiconductor loads 1. 7 frei 1. 3 0. 8 0. 4 free l or w o r k i ng Hat products Other I lydraulic ( )lhor Machine-tools for w o r k i ng stone, ceramics, concrete, asbestos- cement or like mineral materials or lor cold w o r k i ng glass Sawing machines f or sawing m o n o c r i s t al semiconductor boules into slices, or free free free free free free wafers into chips ( )lher ('•rinding or polishing machines l or w o r k i ng semiconductor wafers I or w o r k i ng glass Optical glass Other Other Other free free free Iree free free f or scribing or scoring semiconductor wafers free free free free free free Other Parts and accessories suitable for use solely or principally w i th the machines of heading Nos 8456 to 8465. i n c l u d i ng w o rk or tool holders, self-opening dieheads. d i v i d i ng heads and other special attachments for machine-tools; tool holders for any type of tool for w o r k i ng in the hand : Other f or machines of heading No 8464 f or machines of subheadings 8464 10 10. 8464 20 05 or 8464 90 1. 9 free 0. 9 0. 5 free 10 Of cast iron or cast steel Other ÎC vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 4 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 19Ô9 Jan. 2000 8466 93 X I 6 6 9 H5 -- --- I or machines ol heading Nos 84 >6 to X l 6| I or macliinos and apparatus ol subheadings X l ^ fi III III. X I5(> W| I1) free 1. 4 0. 9 0. 5 free on. X I5r. ')<) in oi X l^r. oo tu 8466 93 20 --- ( )l cast n on or cast steel 8466 93 95 — Other 8466 94 -- f or machines ol heading No Xlr>2 or X I 61 846694 10 — f or machines ol subheading Xlr,2 21 us or X f s2 29 05 19 free 1. 4 0. 9 0. 5 free 8466 94 90 — Other. Automatic lv pewnlers and won. -processing machines 8469 1 1 00 -- Word-processing machines 3. 2 free 2. 4 1. 6 0. 8 free 8470 Calculating machines and pockel-si/e data recording, reproducing and displacing machines with calculating functions; accounting machines, postage-franking machines, ticket- issuing machines and similar machines, incorporating a calculating device; cash registers : 8470 10 - f. lcctronic calculators capable of operation without an external source of electric power and pockel-si/e data recording. reproducing and displaying machines with calculating functions 8470 10 10 -- f l c c t r o n ie calculators capable of operation w i t h o ut an external 8. 4 source of electric power 8470 10 90 — Pockel-si/e data recording, reproducing and displaying machines 5. 0 w i th calculating functions Other electronic calculating machines Incorporating a printing device Other Other calculating machines A c c o u n t i ng machines Cash registers Other A u t o m a t ic data-processing machines and units thereof; magnetic or optical readeis. machines for transcribing data onto data media in coded form and machines for processing such data, not elsewhere specified or included : Analogue or hybrid automatic data-processing machines 8. 4 8. 4 2. 8 2. 8 2. 8 2. 8 8470 2 1 00 8470 29 00 8470 30 00 8470 40 00 8470 50 00 8470 90 00 8471 - -- - - - - 8471 10 8471 10 10 8471 10 90 - - - free free free free free free free free 6. 3 3. 8 6. 3 6. 3 2. 1 2. 1 2. 1 2. 1 4. 2 2. 5 4. 2 4. 2 1. 4 1. 4 1. 4 1. 4 2. 1 1. 3 2. 1 2. 1 0. 7 0. 7 0. 7 0. 7 free free free free free free free free f or use in c i v il aircraft Other free 3. 5 free free free 2. 6 free 1. 8 free 0. 9 • free free ^ * £, vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page J of 33 CN 97 Label Base Rate Final B o u nd Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8471. 30 00 - Portable digital automatic data-processing machines, weighing 3 5 free 2. 6 0. 9 free not more than Id kg. consisting ol at least a central processing unit, a kev board and a displav ( )lhcr d i g ' l al automatic data-processing machines 847 I II -- ( 'omprising in the sane housing at least a central processing unit and an input and o-itput unit, whether or not combined 8471 41 10 --- f or use in civ tl aircraft X471 41 90 — Other 84 71 49 -- Other, presented in the form ol s\ stems 8471 49 10 — f or use in c i v il aircraft X4 7I 49 90 — Other 8471 50 - Digital processing units other than those of subheadings No X47I 4 1 and 84 71 49. w hothcr or not containing in the same housing one or t wo of the follow ing lv pes of unit: storage units, input 8 4 7 1 50 10 8471 50 90 8471 60 -- -- - units, output units f or use in c i v il aircraft Other Input or output units, whether or not coniainmg storage units in 8471 60 10 -- I or use in c i v il aircraft the same h o u s ng Other 8471 60 40 — Printers 8471 60 50 — Keyboards 8 4 7 1 60 90 — Other 8471 70 - Storage units 8 4 7 1 70 10 — f or use in c i v il aircraft 8 4 7 1 70 40 — Central storage units Other Other — Disk storage units 8471 70 51 Optical, including magneto-optical 8471 70 53 84 71 70 59 Other I lard disk drives Other 8471 70 60 — Magnetic tape storage units free 3. 5 free 3 5 free 3. 5 free 2 2 2. free 2 free free- free free free free Irec free free free free free free free free Iree 2. 6 free 2. 6 free 2. 6 free 1. 5 1. 5 !. 5 free 1. 5 1. 2 1. 5 1. 5 free free free I. 8 free l. O I. O l. O free l. O l. O 0. 8 l. O l. O free 0. 9 free 0. 9 free 0. 9 free free free free free free free free free free free free free free free free free free free free free free free free free free vendredi, 28. février 1997 E u r o p e an C o m m i s s i on Delegation in Geneva - aj Page 6 of 33 CN97 Label 8471 70 90 8471 X0 8471 80 Id 8471 8(1 90 8471 90 00 8472 8472 90 8472 90 10 8472 90 30 8472 90 80 847. 3 8473 10 8473 21 8473 21 10 8473 21 90 8473 29 8473 29 10 8473 29 90 8473 30 8473 30 10 8473 30 90 8473 50 8473 50 10 8473 50 90 8477 Other ( Hhcr units ol aiilomatic data-processing machines Peripheral uniis Other ( MMer ( MMer office machines l lor example, McctogiapM or stencil duplicating machines, addressing machines, automatic banknote dispensers, coin-sorting machines, coin- counting or wrapping machines, pencil-sharpening machines, perlorating or stapling machines) Other Coin-sorting, coin-counting or c o i n - w r a p p i ng machines Automatic teller machines Other Paris and accessories (other than covers earn, ing cases and the like) suitable for use solely or principally with machines of heading Nos 8469 to 8472 : Pans and accessories of the machines of heading No 8470 Of the electronic calculating machines of subheading 8470 10. 8470 21 or 84 70 29 f Icclronic assemblies Other Other f leclronic assemblies Other Parts and accessories of the machines of heading No 8471 f. Icctronic assemblies Other Parts and accessories equally suitable for use with machines of two or more of the headings Nos 8469 to 8472 f leclronic assemblies Other Machinery for working rubber or plastics or for the manufacture of products from these materials, not specified or included elsewhere in this chapter : Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 J a n. 2 0 00 free free free free 1. 5 1. 5 1. 5 1. 5 1. 0 l. O l. O l. O free free free free free free free free 3. 1 free- 2. 3 1. 6 0. 8 free 4. 3 2. 5 3. 4 1. 6 3. 3 1. 6 3. 4 1. 6 free free free free free free free- free 3. 2 U9 2. 5 1. 2 2. 5 1. 2 2. 5 1. 2 2. 1 1. 3 1. 7 0. 8 1. 6 0. 8 1. 7 0. 8 1. 1 free 0. 8 free 0. 8 free 0. 8 free free free free free free free free free 8477 10 Injection-mould in u machines ondredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 7 of 33 Base "Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 2. 8 2. 8 free tree 2. 1 1. 4 1. 4 0. 7 "' ""free"'*""' 0J free I ncapsulation equipment for assemblv ol semiconductors ( Mhor Other I ncapsulation equipment lor assemblv ol semiconductors Presses Oilier Parts CN97 Label X477 10 10 8477 10 9(1 X477 59 84 77 59 05 84 77 59 Id 8477 59 90 8477 90 8477 90 01 8477 9. ) 10 8477 90 80 X479 XI79 89 XI79 X9 10 I or machines ol subheadings XIT-1 Id |u and 8477 59 05 2. 8 free 2. 1 1. 4 0. 7 free ( )f cast iron or cast steel Other Machines and mechanical appliances h. iv ing i n d i v i d u al functions. not specilicd or included elsewhere in 'his chapter : Other I he f o l l o w i ng goods, for use in c i v il aircral I Ivdropneumalic batteries; Mechanical actuators lor thrust reversers; Toilet units speciallv designed. Air humidifiers and d c h u m i d i l i c r s > S e r v o- mechamsms. non-oloctric; Non-electric starter motors; Pneumatic starters for turbo-jots, turbo-jets, turbo-propellers and other gas turbines: Windscreen wipers, non-electric; Propeller regulators. non-electric Other 8479 89 30 8479 89 60 8479 89 65 8479 89 70 8479 89 75 M o b i le hydraulic powered mine roof supports Central greasing systems Apparatus for g r o w i ng or p u l l i ng monocrystal semiconductor boules Apparatus for epitaxial deposition on semiconductor wafers Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers 8479 89 76 Apparatus for wet etching, developing, stripping or cleaning l i q u id crylal display substrates free free free 2. 8 8479 89 77 Die attach apparatus and tape automated bonders for the assembly 2. 8 8479 89 79 8479 89 95 8479 90 8479 90 10 of semiconductors f ncapsulation equipment for assembly of semiconductors 2 8 Other Parts f or use in civ il aircraft free free free free free- free free free free 2. 1 2. 1 2. 1 free free free 1. 4 1. 4 1. 4 free free free 0. 7 0. 7 0. 7 free free free free free free vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 8 of 33 CN 97 Label ( MMer Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 X 4 7 9 < M l 5d --- Ol m a c h i n es ol M i b l i e a d i n gs M "w X ' M ,\ x T 'J X1) " u. x r »; X9 2X f r ee 2 1 14 07 f r ee 75. x i "w X'» "r> x \~{> x<> '" or x r «i X"> "9 8 179 90 92 8 4 79 90 9X — — Ol cast i r on or cast s i - el O i l i er 8 4 80 ' M o u l d i ng b o x es l or m e t al l o u n d rv. m o u ld b a s e s; m o u l d i ng p a t t e r n s. i. , o u l ds l or m e t al l o i M ci t h an i n g ot m o u l d s ), m e t al c a r b i d. s. g l a s s, m i n e r al m a t e r i a l s, r u b b er oi p l a s t i es 8 4 80 71 -- I n j e c t i on or c o m p r e s s i on lv pes M o u l ds f or r u b b er or p l a s t i es 8 4 80 71 10 --- of a k i nd u s ed m t i n-i n. i n u l. ic l i n i ng ol s e m i c o n d u c t or dev i c es 2 5 free 1. 9 | 3 0 6 f r ee X 1 X0 71 911 — O t h er 8 5 04 I l e c t i i c al t r a n s f o r m e r s, s t a t ic c o n v e r t e rs ( f or e x a m p l e, r e c t i f i e r s) 8 5 04 40 8 5 04 40 Id - -- a nd i n d u c t o rs S t a t ic c o n v e r t e rs f or use in c i v il a i r c r a ft Other Of a kind used with data-processing machines and units thereof: telecommunication apparatus and automatic 8504 40 30 — Power supplv units of a k i nd used with automatic data-processing 2 free machines 8504 40 35 —- Other 8504 40 50 — PolycTvstallinc semiconductors 4. 6 free 8504 40 93 —- 8504 40 94 8504 40 96 8504 40 97 8504 40 99 8504 50 8504 50 10 - - Other Accumulator chargers Other Rectifiers Inverters I laving a power handling capacity not exceeding 7. 5 k VA 1 laving a power handling capacity exceeding 7. 5 k VA Other Other inductors f or use in c i v il aircraft Other 1. 5 3. 4 f fj 2. 3 free fl free free v e n d r e d i. 2 8. f é v n or 1 9 97 European C o m m i s s i on in G e n e va - aj D e l e g a t i on P a ge 9 of 33 CN97 L a b el B a se R a te F i n al B o u nd Implementation 8504 50 30 Of a kind used l'or telecommunication apparatus and power 4. 8 supplies lor automatic data processing machines and un. ls thereof R a te free J u l. 1 9 97 Jan. 1998 Jan. 1999 Jan. 2000 3. 6 2. 4 |. 2 " ""'free 8504 50 80 8514 8514 10 8514 10 05 8514 10 10 8514 10 90 8514 20 8514 2d 05 8514 20 10 8514 20 90 8514 30 8514 30 I I 8514 30 19 8514 3091 8514 30 99 8514 90 8514 90 10 8514 90 90 8515 Other Industrial or laboratory clocltic ( including induction or dielectric) lurnaces and ovens, oilier industrial or labora'orv induction or dielectric Moating c q u i p m e ul Resistance healed lurnaces and ovens l or the manufacture of semiconductor \. \c\ ices on semiconductors 3 free 23 1. 5 0. 8 free wafers Other Bakerv and biscuit ovens Other Induction or dielectric furnaces and ovens f or the manufacture o\' omiconductor devices on semiconductors 3 free 2. 3 0. 8 free wafers Other Induction furnaces and ovens Dielootrie lurnaces and ovens Other furnaces and ovens Infra-red radiation o w ns f or the manufacture of semiconductor d'-vices on semiconductor free free free free free free wafers Other Other f or the manufacture of semiconductor devices oi semiconductor free wafers Other Parts Of apparatus of subheading 8514 10 05. 8514 20 !,5. 8514 30 I I or 85 14 30 91 Other 3 f leclric ( i n c l u d i ng electrically healed gas), laser or other light or photon beam, ultrasonic, electron beam, magnetic pulse or plasma are soldering, b r a / i ng or welding machines and apparatus. vvlK'lher or not capable of cutting; electric machines aud apparatus for hot sprav ing of metals or cermets free free free free free free 2. 3 1. 5 0. 8 free ce v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj P a ge 10 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 H r a / i ng or soldering machines and apparatus 8515 I I dd 8515 19 00 Soldering iioris and guns Other Machines and appaialtis lor resistance welding ol 'metal 8515 21 00 8515 29 8515 29 10 I ullv or p. irilv automatic ( Mhcr f or butt welding 85 I 5 29 90 Other 8515 31 dd 8515 39 8515. 39 13 8515 39 18 M. icMinos and apparatus for arc ( nu hiding plasma arc ) w elding of metals I ullv or parlK automatic Other f or manual w e l d i ng w i th coaled electrodes, complete w i th w e l d i ng or cutting devices, and consigned with Transformers (ienerators or rolarx converters or static converters, rectifiers or 8515 39 90 Other rectifying apparatus 8515 80 8515 80 05 8515 80 II 8515 80 19 8515 80 91 8515 80 99 8515 90 8515 90 10 8515 90 90 8517 ••. *> Vr'-V Other machines and apparatus Wire bonders of a kind used for manufacturing wafers or devices 3. 7 free 2. 8 1. 9 0. 9 free Other f or treating metals f or w e l d i ng Other Other f or resistance w e l d i ng of plastics Other Parts f or machines of subheading 8515 80 05 Other f lectrical apparatus for line telephony or line telegraphy. including line telephone sets w i th cordless handsets and telecommunication apparatus for carrier -current line system- or for digital line systems: videophones : Telephone sets: videophones 3. 7 free 2. 8 1. 9 0. 9 free v e n d r e d i, 2 8. f é v r i er 1 9 97 European Commission Delegation in Geneva - aj Page 11 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 J a n. 2 0 00 8517 11 dd 8517 19 8517 19 Id 8517 19 90 8517 21 00 8517 22 00 8517 30 00 8517 50 H517 50 10 8517 50 9(! 8517 80 8517 80 10 8517 80 90 8517 90 8517 90 II 8517 90 19 8517 90 82 8517 90 88 8518 l i ne telephone sets with cordless handsels ( MMer VideopMoiics Other facsimile machines and teleprinters facsimile machines loleprinters Telephonic or telegraphic switching apparatus Other apparatus, lor carrier-current line sv stems or for digital line sv stems l or carrier-current line s> stems Other Other apparatus l. nlrv -phone sv stems Other Parts Of apparatus for carrier-current line systems of subheading 8517 50 10 electronic assemblies Other Other electronic assemblies Other Microphones and stands therefor; loudspeakers, whether or not mounted in their enclosures: headphones, earphones and combined microphone/speaker sets; audio- frequency electric amplifiers; electric sound amplifier sets : 7. 5 II 7. 5 7. 5 7. 5 7. 5 4. 6 7. 5 7. 5 7. 5 3. 6 3. 6 4. 8 4. 8 8518 10 Microphones and stands therefor 8518 10 10 for use in civil aircraft Other free free free free free free free free free free free free free free 5. 6 10. 5 5. 6 5. 6 5. 6 5. 6 3. 4 5. 6 5. 6 5. 6 2. 7 2. 7 3. 6 3. 6 3. 8 7. 0 3. 8 3. 8 3. 8 3. 8 2. 3 3. 8 3. 8 3. 8 1. 8 1. 8 2. 4 2. 4 1. 9 3. 5 1. 9 '. 9 1. 9 1. 9 1. 1 1. 9 1. 9 1. 9 0. 9 0. 9 1. 2 1. 2 free free free free free free free free free free free free free free 8518 i 0 20 Microphones having a frequency range of 300 11/ to 3. 4 Kl Iz 3. 5 free 2. 6 0. 9 free with a diameter no; exceeding 3 mm. for telecommunications use 8518 10 80 8518 29 851829 10 Other Other f oi use in civil aircraft CO vendredi, 28. février 1987 European Commission Delegation in Geneva - aj Page 12 of 33 CN97 Label Base Rate Final Bound Rate Implementation 8518 29 20 I oiulspeaK ers h. iv ing a l i c q u c ik v ot »(>ll 11/ to \ I Kl 1/ w ith a 3 8 diameter ol not exceeding I" nun and a height not exceeding 3 Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 2. 8 0. 9 free 8518 29 80 8518 30 85IX 30 10 8518 31) 20 «518 30 80 8520 8520 20 dd 8521 8521 10 8521 10 10 8521 10 30 8521 10 80 8521 90 8521 90 10 8521 90 90 8523 8523 11 00 8523 12 00 8523 13 00 8523 20 8523 20 II 8523 20 19 8523 20 90 8573 90 00 m m. lor telecommunications use Other Headphones, earphones and combined microphone speaker sets f or use in civ il aircralt I inc telephone handsels Other Magnetic tape iccordcrs and other sound recording apparatus. whether or not incorporating a sound reproducing device I elephone answciing machines Video recording or reproducing apparatus, whether or not incorporating a video tuner Magnetic tape-tv pe l or use in civ il aircraft Other Of a width not exceeding 1. 3 cm and allowing recording or reproduction at a tape speed not exceeding 50 mm per second Other Other Apparatus as defined in Note 5 f to Chapter 84 Other Prepared unrecorded media for sound recording or similar recording -if other phenomena, other than products of Chapter 37 Magnetic tapes Of a width not exceeding 4 mm Of a width exceeding 4 mm but not exceeding 6. 5 mm Of a width exceeding 6. 5 mm Magnetic discs Rigid With a thin film metallic coaling, having a coerciviiy exceeding 600 Oersted and an external diameter not exceeding 231 mm Other Other Other free- 3. 0 2. 0 l. O free free 3. 9 2. 6 1. 3 free 14 free I0. 5 7. 0 3. 5 free 3. 2 4. 1 4. 1 4. 1 4. 1 4. 1 free free free free free free free 2. 4 3. 1 3. 1 1. 5 3. 1 3. 1 3. 1 1. 6 2. 0 2. 0 l. O 2. 0 2. 0 2. 0 0. 8 l. O l. O free i. O l. O l. O free free free free free free free. - n d r e o i. 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 13 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8521 Records, tapes and other recorded media lor sound or oilier similarlv recorded phenomena, including matrices and masters for I Me production ol. ccords. but excluding products of Chapter 3 7 Dises for laser reading sv stems 8524. 3! 00 8524 32 00 8524. 39 8524 39 10 8524 39 90 8524 10 I or reproducing phenomena oilier than sound or image I I free f or reproducing sound onlv Other for reproducing representations ol instructions, data, sound and 4. 1 free image recorded in a machine readable bmarv l o r m. and capable of b'-ing manipulated or prov ulmg mlcracliv ilv to the user, bv means of an automatic data processing machine Oilier Magnetic tapes :"-ir reproducing p l i e n o m ca other than sound or image 8521 10 10 Meanng data or instructions of a k i rd used in automatic data- 2 free- 8524 40 91 8524 10 99 8524 91 8524 91 10 8524 91 90 8524 99 8524 99 10 processing machines Other O la w i d th exceeding 1 mm but not exceeding 6,5 mm Other Other 1er reproduc ig phenomena other than sound or image- Bearing data or instructions of a kind used in automatic data- processing machi'ies Other Other 3. 6 4 I 2 4. 1 free free free free for reproducing representations of instructions, data, sound and 4. 1 free image recorded in a machine readable binary f o r m, and capable of being manipulated or p r o v i d i ng interactivity to the user, by means of an automatic data processing machine 8524 99 90 Other 8525 I ransmissiou apparatus for radio-telephony, radio-telegraph). radio-broadcasting or television, whether or not incorporating reception appa. atus or sound recording or reproducing apparatus; television cameras: still image video cameras and other video 8525 10 Transmission apparatus camera recorders ; Radio-. el'-grapmc or radio-telephonic apparatus: 3. 1 3. 1 15 2. 7 3 1 1. 5 3. 1 3. 1 2. 0 2. 0 1. 8 2. 0 l. O 2. 0 2. 0 l. O l. O free 0. 9 l. O free 1. 0 1. 0 free free free free free free free free vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 14 of 33 CN97 Label 8525 Id Id lor use in c i v il airciall ( MMer Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 Radio-lelcgrapMic or ladio-telcpMonic apparatus II free 3. 1 2. 0 < Mher I ransiiiission apparatus incorporating reception apparatus Radio-telegraphic m radio-tclcpn. 'inc apparatus, for use m c i v il free free free free 6 5 6. 5 4. 9 free free free 4. 9 4. 9 3. 7 3. 3 2. 5 l. O free 1. 6 1. 6 I. 2 free free free free free 8525 Id 50 8525 11)80 8525 20 8525 20 Id 8525 20 91 8525 20 99 8525 40 aircraft ( Mher I or celiular n e i w o i ks i m o b i le lelepMonesi ( MMer Still image video cameras and oilier video camera recorders Slill image vide») cameras 8525 40 I I 8525 40 19 Digital Oilier 8525 40 91 Onlv able lo record sound ami images taken bv the television ( Mher v ideo camera recorders 8525 40 99 8527 8527 90 8527 90 1C 8527 90 92 8527 90 98 8528 8528 12 8528 12 10 camera Other Reception apparatus for radio-telephony, radio-telegraphy or radio-broadcasting, whether or not combined, in the same housing, w i th sound recording or reproducing apparatus or a clock : 0 : ' i er apparatus f or radio-telephony or radio-telegraphy, for use in c i v il aircraft Other Portable receivers for calling, alerting or paging Other Reception apparatus for television, whether or not incorporating radio-broadcast receivers or sound or video recording or reproducing apprralus; video monitors and video projectors : Reception apparatus for television, whether or not incorporating radio broadcast receivers or sound or video recording or reproducing apparatus Colour 9. 6 free 7. 2 4. 8 2. 4 free Apparatus as defined in Note 5 f lo Chapter 84 14 I0. 5 7. 0 3. 5 free Other CO vendredi, 28. f é v r i er 1 9 97 European Commission Delegation in Geneva - aj Page 15 of 33 C N 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 — I elev ision projection equipment 8528 12 II W i th scanning parameters not exceeding f>25 lines 8528 I 2 I 6 8528 I 2 I 8 8528 I 2 22 8528 12 28 8528 I 2 52 8528 I 2 5 I 8528 12 56 8 5 2 X 12 58 W i th scanning parameters exceeding 625 lines W i th a vertical resolution ol less ihan 700 lines W i th a vertical resolution ol 700 lines or more —. Apparatus incorporating a v ideo recorder or reproducer W i l li a screen w i d th height ratio less ihan 1. 5 Other Other W i th integral tube W i l li a screen w i d th height ratio less than 1. 5. will) a diagonal measurement of the screen Not exceeding 42 cm exceeding 4 2 cm but not exceeding 52 cm f x c e e d i ng 52 cm but not exceeding 72 cm f x c e e d i ng 72 cm Other W i l li scanning parameters not exceeding 625 lines, vviih a diagonal measurement of the screen 8528 12 62 8528 12 66 Not exceeding 75 cm exceeding 75 cm W i th scanning parameters not exceeding 625 lines 8528 12 72 8528 12 76 W i th a vertical resolution of less than 700 lines W i th a vertical resolution of 700 lines or more 8528 12 81 8528 12 89 8528 12 91 8528 12 98 Other W i l li screen W i th a screen width/height ratio less than 1. 5 Other Without screen Video tuners Other 8528 13 - Black and white or other monochrome 8528 13 10 — Apparatus as defined in Note 5 f lo Chapter 84 6. 8 free 5. 1 3. 4 1. 7 free 8528 13 90 — Other 8528 30 - Video projectors vendredi, 28. février 1997 w* 71 European C o m m i s s i on Delegation in Geneva - aj Page 16 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8528. 30 05 -- ol a kind used w ith an. lutonialic data processing machines l-l free I0. 5 7. 0 3 5 free 8528 30 20 — ( olour (Mher 8528 3d 90 --- Hlack and white oi other nionoehioinc 8529 Paris suitable lor use solelv or principally w i th the apparatus of heading N o s X 5 25 lo X>2X 8529 Id - Aerials and aerial relleclois ol all kinds, parts suitable for use therewith 8529 Id 10 -- l or use in civil aircraft ( Mher Aerials 8529 Id 15 — Aerials of a kind used with apparatus for radio-telephony and radio-telegraphic 8529 Id 20 — telescopic and whip-tv pe aerials for portable apparatus or for apparatus for filling in motor vehicles — Outside aerials for radio or lelev ision broadcast receivers 8529 I0 3I 8529 10 39 for reception via satellite Other 8529 10 40 — Inside aerials for radio or lelev ision broadcast receivers, including built-in tv pes 8529 10 50 —- Other 8529 10 70 — Aerial filters and separators 8529 10 80 — 8529 90 8529 90 10 - - Other Other Assemblies and sub-assemblies consisting of two or more parts or pieces fastened or joined together, for apparatus falling within subheadings 8526*10 l(). 8526 91 11. 852691 I9and852692 10. for use in civil aircraft Olher 5 free 3. 8 2. 5 1. 3 free • 8529 90 40 — Parts of apparalusfalling wiihin subheadings 8525 10 50. 8525 20 4. 7 free 3. 5 2. 4 \2 free 99. 8525 40 31. 8525 90 91 or 8527 90 91 Cabinets and cases 8529 90 51 —- Of wood 8529 90 59 -— Of other materials 8529 90 70 — electronic assemblies Other CO vendredi. 28. février 1997 European C o m m i s s i on D e l e g a t i on in G e n e va - aj Page 17 of 33 C N 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8529 90X1 for lelev ision cameras oi subheading 8525 }^ and appa;alus of heading NosX527 and X52X X529 90 89 (Mher 853 I 85. 3 1 20 I leclric soiiiul or visual signalling apparatus (for cxamfTic. bells. sirens, indicator panels, burglar or fire alarms), other ihgn those of heading No 8512 or "53(1 Indicator panels incorporating liquid crv sial devices (I. CD) or light emitting diodes (I I D) X53I 20 10 I or use in civ il aircraft Other 8531 20 30 Incorporating hghl emitting diodes (I I D) 4. 2 free Incorporating liquid crystal dev ices (I. CD) Incorporating active matrix liquid ervslal devices (LCD) 8531 20 51 Colour 853 I 20 59 Hlack and while or other monochrome 8531 20 80 Other 8531 80 Other apparatus 8531 80 10 for use in civ il aircraft Other 4 2 4. 2 4. 2 free free free 3. 2 3. 2 3. 2 3. 2 1. 1 free 2. 1 2. 1 2. 1 l. l I. I l. l free free free 853 1 80 30 flat panel devices of a kind rsed in automatic data processing 3. 1 free 2. 3 1. 6 0. 8 free 8531 80 80 8531 90 8531 90 10 8531 90 30 8531 90 80 8532 8532 10 00 8532 21 00 8532 22 00 8532 23 00 8532 24 00 machines and télécommunications apparatus Other Parts Of apparatus of subheading 853 I 20 Of apparatus of subheading 8531 80 30 Other electrical capacitors, fixed, variable or adjustable (prc-sct) : fixed capacitors designed for use in 50/60 I Iz circuits and having a reactive power handling capacity of not less than 0,5 kvar (power capacitors) Other fixed capacitors Tantalum Aluminium electrolytic Ceramic dielectric, single laver Ceramic dielectric, multilav er 4. 2 4. 2 3. 6 3 5 3. 6 3. 6 free free free free free free free 3. 2 3. 2 2. 7 3. 8 3. 8 2. 7 2. 7 2. 1 2. I 2. 5 2. 5 I. 8 I. 8 l. l l. l 0. 9 1. 3 1. 3 0. 9 0. 9 free free free free free free free vendredi, 28. février 1997 CO European C o m m i s s i on Delegation in Geneva - aj Page 18 of 33 CN97 Label Base Rate Final Bouna Rate Implementation Ju!. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8532 25 dd X532 29 dd 8532. 3d 00 Dielcclric ol paper or plastics Other V a r i a b le or ad instable (pre-set ) c a p a c i t o rs 8532 90 00 Paris 8533 I lcclric. il resistors ( mc hiding rlieostats and potentiometers), oilier 8533 10 00 f i x ed carbon resistors, composition or f i lm ivpcs Ihan heating resistors 853. 3 21 00 8533 29 00 8533 31 00 8533 39 00 8533 40 8533 40 10 8533 40 90 8533 90 00 8534 00 8534 00 II 8534 00 19 8534 00 90 8536 8536 50 8536 50 03 8536 50 05 85. 36 50 07 ( Mher fixed resistors f or a power handling capacitv not exceeding 2d W (Mher Wirewound variable resistors, unhiding rheostats and potentiometers for a power handling capacitv not exceeding 20 W Other Oilier variable resistors, including rlieostats and potentiometers for a power handling capacitv mil exceeding 20 W Other Parts Printed circuits Consisting only of conductor elements and contacts Multiple circuits Other With other passive elements electrical apparatus for switching or protecting electrical circuits, or for making connections to or in electrical circuits (for example, switches, relays, fuses, surge suppressors, plugs, sockets, lamp- holders, junction boxes), fora voltage not exceeding I 000 V : Other switches electronic AC switches consisting of optically coupled input and output circuits (Insulated thv rislor AC switchs) electronic switches, including temperature protected electronic switches, consisting of a transistor and a logic chip (chip-on-chip technology) for a voilage not exceding 1000 volts electromechanical snap-acion switches for a current not exceeding I I amps Other 3 6 \ fi 5 4. 7 3. 7 3. 7 3. 7 3. 7 3. 7. 3. 7 3. 7 3. 7 5. 2 5. 2 5. 2 3. 2 3. 2 3. 2 free- free free- free free free free free- free free Tree free free free free free- free free 2. 7 2. 7 3. 8 3. 5 2. 8 2. 8 2. 8 2. 8 2. 8 2. 8 2. 8 2. 8 3. 9 3. 9 3. 9 2. 4 2. 4 2. 4 1. 8 1. 8 2. 5 2. 4 1. 9 1. 9 1. 9 1. 9 1. 9 1. 9 1. 9 1. 9 2. 6 2. 6 2. 6 1. 6 I. 6 |. 6 0. 9 0. 9 1. 3 1. 2 0. 9 0. 9 0. 9 0. 9 0. 9 0. 9 0. 9 0. 9 1. 3 1. 3 1. 3 0. 8 0. 8 0. 8 free free free free / r ee free free free free free free free free free free free free free **** vendredi, 28. février 1997 GO European C o m m i s s i on Delegation in Geneva - aj Page 19 of 33 CN97 Label 8536 50 I I Push-bullon -. w itches f or a voilage not exceeding 60 V B a se R a te F i n al B o u nd R a te Implementation Jul. 1997 Jan. 1998 Jan. 199C Jan. 2000 8536 50 15 8536 50 19 8536 50 90 8536 69 8536 69 05 8536 69 10 8536 69 30 8536 69 90 8536 90 8536 90 01 8536 90 id 8536 90 20 8536 90 85 8541 Rolarv sw itches Other Other Other Plugs and sockets ior co-axial cables and printed circuits 3. 2 Irec 2. 4 i. f> 0. 8 free Other l or co-axial cables l or printed circuits Other ( Mher apparatus Prefabricated elements for elecirieal circuits Connections and contact elements for wire and cables Wafer probers Other Diodes, transistors and similar semiconductor devices; photosensitive semi- con- doctor devices, including photovoltaic cells whether or in. ; assembled in modules or made up into panels l i g h t - c m i l t hg diodes: mounted pie/. o-electric crystals. 3. 2 Ire : free free- 2. 4 free 1. 6 free 0. 8 free free free 8541 10 Diodes, other t h :n photosensitive or l i g h l - e m i l t i nc diodes 8541 10 10 Wafers net vet cut into chips 854! 1091 8541 10 S9 8541 21 8541 21 10 8541 21 90 8541 29 854! 29 10 854! 29 20 8541 29 30 8541 29 80 8541 30 Other Power rectifier diodes Other Transistors, other than photosensitive transistors W i th a dissipation rate of less ihan I W Wafers nol yet cut into chips Other Other Wafers not yet cut into chips P o v c r M OS Held effective transistors Insulated gate bipolar transistors (IGlVI's) Other Thyrislors. diacs and triacs. oilier than puoloscnsilivc devices free free free free free '•ce f i e- free free 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 1. 8 1. 8 I. 8 1. 8 i. 8 I. 8 1. 8 I 8 1. 8 free free free free free free free free free free free free free free free free free free CO v e n d r e d i, 2 8. f é v r i er 1 9 97 European Commission Delegation in Geneva - i\ Page 20 of 33 CN9"' Label BaseRa:e Final Boupd Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8511. 30 10 85 II 30 90 8541 4(1 - - - W alers not cet cul into chips (MMer l'hotoseiisitice seiniciiiductor de ces. including photovoltaic cells whether or not assembled in modules or made up into panels. Iight-cmittine tinkles I ighl-eniitling dioi'cs 8511 40 I I — I aser diodes X54I 40 19. Other Other 854 I 10 91 --- Solar cells u Mother oi not assembled in modules oi made up into panels 8541 10 93. Photodiodes phototraiisistors. photoihv ristors or pholocouples 8541 40 99 — Other 8 5 4 1 50 8541 50 10 8541 50 90 854160 00 8541 90 00 8542 - -- - - - 8542 12 00 - 8542 !3 -- 8542 13 01 — 8542 13 05 — — 8542 13 11 8542 13 13 8542 13 15 8542 13 17 Other semiconductor devices Wafers not vet cut into chips Other Mounted pie/o-electric cr>stals Parts electronic integrated circuits and microassemblies : Monolithic digital integrated circuits Cards incorporating an electronic integrated circuit («smart» cards) Metal oxide semiconductors (MOS technology) Wafers not yet cut into chips Chips Other Memories Dynamic random-access n emorics (D-RAMs) With a storage capacity not exceeding 4 Mbi'. s With a storage capacitv exceeding 4 Mbils but not exceeding 16 Mbits With a storage capacity exceeding 16 Mbils but not exceeding 6-1 Mbils With a storage capacity exceeding 64 Mbits 7 7 3 2 1. 8 1. 8 7 7 5. 6 4. 1 14 free- free free- free free free free Iree free free free free free free free- free 3. 5 3. 5 3. 5 3. 5 I. 6 0. 9 0. 9 3. 5 3. 5 2. 8 2. 0 7. 0 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 I. 8 I. 8 I. 8 1. 8 0. 8 0. 5 0. 5 I. 8 1. 8 1. 4 l. O 3. 5 1. 8 1. 8 free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free ^ vendredi, 28. février 1997 European Comr. ;ccion Delegation :n Geneva - aj Page 21 of 33 IN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8542 13 22 8542 13 25 Sialic random-access memories ( S - R. \ M s ). including cache random-access memories ( c a c h e - K A M s) W i l li a storage capacitv not exceeding 256 Kbits W i th a storage capacitv exceeding 256 Kbits bul not exceeding I 8512 f > 27 W i l li a storage capacitv exceeding I M b it M b it 8542 13 32 8542 13 35 8542 13 37 - 8542 13 41 8542 13 43 I IV erasable, programmable, read on';, memories (I P K O M s) W i th a storage capacitv not exceeding I M b il W i l li a storage capacitv exceeding I Mbit but not exceeding 4 Mbits W i th a storage capacitv exceeding I M b i ls I lectricallv erasable, programmable, read onlv memories ( f - ' P R O M s ). including I I A S II l i ' P R O Ms H A SH l i ' P R O Ms W i th a storage capacitv not exceeding I M b il W i th a storage capacitv exceeding I M b it bul not exceeding 4 M b i ts 8542 13 45 W i th a storage capacitv exceeding 4 M b i ts but not exceeding 16 8542 13 47 8542 13 49 8542 13 51 Mbils W i th a storage capacitv exceeding 16 M b i ts Other Read onlv memories, non-programmable ( R O M s ); content addressable memories ( C A M s ): first-in/firsl-oui read/write memories ( f I f O s ): last-in/llrsl-oul read/write memories ( I. I I ' O s ): ferroelectric memories 8542 13 53 Other memories 8542 13 55 —- Microprocessors 8542 13 61 8542 I "'. 63 — Microcontrollers and microcomputers W i th a processing capacitv not exceeding 4 bits W i th a processing capacitv exceeding 4 bits but not exceeding 8 bits -* 8542 13 65 W i th a processiiT: capacitv exceeding 8 bits bul not exceeding 16 bils 8542 13 67 W i th a processing capacitv exceeding 16 bits but not exceeding 8542 13 69 W i th a processing capacitv exceeding 32 bits 32 bits free free free free free- free free I'. ee free- free free free 7 free 5. 6 7 7 7 7 free- free free- free free free free free free free free free free free free free free free free free fr>:e free free free free free free free free free 3. 5 free 2. 8 3. 5 3. 5 3. 5 3. 5 free free free free free free free free free free free free I. 8 free 1. 4 1. 8 I 8 1. 8 1. 8 free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free f r ej free *- <*«* v e n d r e d i, 2 8. f é v r i er 1 9 97 European Commission Delegation in Geneva - aj Page 22 of 33 C N ' 97 L a b el 85-12 13 70 Micropcripherais ( 'ilier (Mher 85-12 13 72 I n il c i i s i o in l o g ic c i r c u i ts 8542 13 74 8512 13 76 8512 13 82 8542 13 84 (. ale arravs Standard cells Programmable logic circuils Standard logic circuils (Mher 8512 13 91 Control circuits, interlace circuits, mieilace circuils capable of performing control Minutons 8542 13 99 Other 8542 14 -- -Circuits obtained bv bipolar technology 8542 14 01 — Wafers not vet cut into chips 8542 14 05 — Chips Other — Memories 8542 14 10 8542 14 15 Dynamic random-access memories ( D - R A M s) Static random-access memories ( S - R A M s ), i n c l u d i ng cache random-access memories ( c a c h e - R A M s ): read only memories, non-programmable ( R O M s ): content addressable memories ( C A M :. ): firsl-in/firsl-out read/write memoue. s ( F I F O s ): last- i i / i l r s t - o ul read/write memories (f I f O s ): ferroelectric memories 8542 14 20 electrically erasable, programmable, read only memories 8542 14-22 8542 14 29 ( f - T R O M s ). including F L A SH l - ' P R O Ms UV erasable, programmable, read onlv memories ( f i P R O M s) Other memories 8542 14 30 — Microprocessors — Microcontrollers and niiciocompi:. ers 8542 14 42 8542 14 44 W i th a processing capacitv ,v. , -xceeding 4 bits W i th ;• processing capacitv exceeding 4 bits Other 85-42 I-I 50 Mieroperinherals Other 8542 14 60 f u ll custom loeic circuits B a se P a te Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 7 7 7 5 6 5. 6 7 free free free 7 free 5 6 7 5 6 free free free free free free free free free free free free- free free free free free free free free 2. 8 3. 5 3. 5 3. 5 2. 8 2. 8 3. 5 3. 5 3. 5 3. 5 3. 5 free free free 3. 5 free \8 3. 5 2. 8 3 5 1. 4 1. 8 1. 8 1. 8 1. 4 1. 4 1. 8 1. 8 18 1. 8 1. 8 free free free 1. 8 free 1. 4 1. 8 1. 4 1. 8 free free free free free frcv free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free v e n d r e d i, 2 8. f é v r i er 1 9 97 Jx. ^ European Commission Delegation in Geneva - aj Page 23 of 33 CN97 Label 8542 14 65 8542 14 70 8542 14 75 8542 14 80 (iatearravs Standard cells Programmable logic circuits Standard logic circuits Other 8542 14 91 Control circuits; interface circuits, interface circuits capable of 8542 14 99 Other performing control functions 8542 19 - Oilier, including circuils oblained bv a combination of bipolar 8542 19 01 — Wafers not vet cut into chips and MOS technologies (HIMf >S icchnologv ) 8542 19 05 — Chips Other — Memories 8542 19 15 D> namic random-access memories (D-RAMs) 8542 19 22 8542 19 25 8542 19 27 8542 19 31 8542 19 35 8542 19 41 Sialic random-access memories (S-KAMs). including cache random-access memories (cache-RAMs) Willi a storage capacitv not exceeding 256 Kbits With a storage capacity exceeding 256 Kbits bul not exceeding I Mbil With a storage capacity exc-eding I Mbit UV erasable, programmable, read only memories (FPROMs) electrically erasable, programmable, read only memories (E7PROMs), including FLASH e:P R O Ms Read only memories, non-programmable (ROMs); content addressable memories (CAMs); first-in/first-out read/write memories (f IfOs); lasi-in/firsl-oul read/write memories ( f l f O s ); ferroelectric memories 8542 19 49 Other memories 8542 19 55 -— Microprocessors Microcontrollers and microcomputers 8542 19 62 8542 19 68 With a processing capacity not exceeding 4 bits With a processing capacity exceeding 4 bits Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 J a n. 2 0 00 7 7 5. 6 5 6 free free I'rec free free free 7 free 5. 6 7 5. 6 free free- free free free free free free free free free- free free free free free free- free free free 3. 5 3. 5 2. 8 2. 8 3. 5 3. 5 3. 5 3. 5 3. 5 free free tree free free free 3. 5 free 2. 8 3. 5 2. 8 I 8 1. 8 1. 4 1. 4 1. 8 1. 8 1. 8 1. 8 1. 8 free free free free free free 1. 8 free 1. 4 I. 8 1. 4 free free free free free free free free free free free free free free free free free free free free free free free free free free free free free- free free free free free free free free free free free European C o m m i s s i on Delegation in Geneva - aj Page 24 of 33 8542 19 71 Microperipherals Other Other (••2 vendredi, 28. février 1 9 97 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8542 19 72 8 5 12 19 7-1 8 5 42 19 76 8 5 42 19 82 8542 19 84 8 5 42 19 92 8542 19 98 8542 30 8542 30 10 85-12 30 20 - - - 8542 30 30 — --- 8542 30 50 8542 30 61 — 8542 30 65 8542 30 69 8542 30 70 — 854'. 30 91 — 8542 30 95 8542 30 99 8512 40 8542 40 10 8542-U)30 8542 40 50 8542 40 90 8542 50 00 8542 90 00 - -- - - - - - I ull c u s t om logic circuits (. a l e a r r a vs S t a n d a rd cells P r o g r a m m a b le logic circuils S t a n d a rd logic circuits Other C o n t r ol c i r c u i t s; i n t e r l a ce c i r c u i t s, i n t e r l a ce c i r c u i ts c a p a b le of performing control (mictions Oth-T Other monolithic integrated circuits Wafers not vet cut into chips Chips Other Amplifiers Voltage and current regulators Control circuits Smartpower circuils Other Mixed analogue-digital circuits Other Interface circuits; interface circuits capable of performing control functions Other Smartpower circuils Other Mixed analogue-digital circuits Other Hybrid integrated circuits Microprocessors, microcontrollers and microcomputers Converters Amplifiers Other electronic microassemblies Parts 7 7 7 5. 6 5. 6 7 7 7 7 7 7 7 7 7 4. 1 free- free free- free free free- free free- free free free fr-c free free free free free free free Ire- free free free 3. 5 3. 5 3. 5 2. 8 2. 8 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 2. 0 1. 8 1. 8 1. 8 1. 4 1. 4 !. 8 1. 8 i. 8 1. 8 1. 8 1. 8 1. 8 I 8 l. £ free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free vendredi, 28. février 1997 European C o m m i s s i on Delegation ir Genpva - aj Page 25 of 33 C N 97 Label Base Rate Final B o u nd Rate Implementation Jul. 1997 Jar,. 1998 Jan. 1999 Jan. 2000 8513 I leclrical machines and apparatus, having individual functions. ih. i spec ified or I IK hided eUew Meie in ihis ( Maplcr Particle accelerators 8543 I I 00 85-13 30 Ion unpl. inters lor doping semiconductor niatenals Machines and apparatus lor electroplating, elcclrolv sis or clectropliorcsis 8543 30 10. Apparatus lor wet etching, developing, shipping or cleaning semiconductor u a l e ta 85-1. 3 30 20. Apparatus lor wet etching, developing slopping or cleaning 8513 30 90 Other lujuid crvsial diplav substrates 854 3 81 00 8543 89 8543 89 10 8543 89 15 8543 89 17 8543 89 20 8543 89 51 8543 89 55 8543 89 59 8543 89 70 8543 89 72 8543 89 73 8543 89 77 8543 89 79 ( Mher macliines and apparatus Pro viniit; cards and lags Oilier Plight recorders, for use in c i v il aircraft I leclrical machines vvitli translation or diclionarv functions. Apparatus as defined in not 5 I to Chapter 84. Aerial ampbliers Sunbeds. sunlamps and similar suntanning equipment for lluoresccnt tubes using ultraviolet A rays With a maximum lube length of 100 cm Other Other Apparatus for physical deposition on semiconductors wafers. by sputtering on semiconductor wafers Other encapsulation equipment for assembly of semiconductors Set top boxes, having a communication function, microprocessor based device inorporating a modem for gaining access to the Internet, and having a function of interactive information exchange Multimedia upgrade kits, for automatic data processim' machines and units thereof, put up for retail sale, consisting of. at least. speakers and/or microphones and a printed circuit ass'-mbly that enables the automatic data processing and units thereof to process audio signals (sound cards) I ret iree free tree 5 5 fret- f-ee free free free- free free free- free free free fret- 3. 8 3. 8 3. 8 free 38 3. 8 3. 8 2. 5 2. 5 2. 5 free 2. 5 2. 5 2. 5 free free free free free free 1. 3 free I. 3 I. 3 free fret- free 1. 3 1. 3 1. 3 free free free free free 3. 8 2. 5 1. 3 free vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 26 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8543 89 90 8543 90 8543 90 10 ( Mher Paris Assemblies and subassemblies consisting ol t wo or more paris or pieces Listened or |omed together lor l l i g lu recorders, for use in civ il aircraft 8543 90 20 Ol apparatus of suMeadings X sH II lid. 8M. 3 3d Ml. 85-1. 3 89 70 or 85 H Id 10 Ol apparatus ol subheading Xs | \ KO '2. ,nd X s II 89 7 t ( Mher Insulated ( including enamelled or anoviiscd I w ire. cable (including coaxial cable) and other insulated eleclric conductors, whether or not lilted with connectors, optical libre cables, made- up ol indiv iduallv sheathed fibres, whether or not assembled w i th electric conductors or fitted w i th connectors : Other eleclric conductors, for a voltage not exceeding 80 V f i l l ed w ith connectors 5 5 free free 3. 8 3. 8 Of a kind used for telecommunications 4. 6 free 3. 4 Other Other Of a kind used for telecommunications Other Other electric conductors, for a voltage exceeding 80 volts but not exceeding I 000 volts fitted with connectors Of a kind used for telecommunications Other Optical fibre cables 4. 8 4. 6 6. 3 free free 3. 6 3. 4 4. 7 8543 90 30 8543 90 90 8544 8544 41 8544 41 10 8544 41 90 8544 49 8544 49 20 8544 49 80 8544 51 8544 51 10 8544 51 90 8544 70 00 9006 9006 10 9006 10 10 2. 5 2. 5 2. 3 2. 4 2. 3 3. I 1. 3 1. 3 l. l 1. 2 l. l I. 6 free free free free free free Photographic (other than cinematographic) cameras: photographic flashlight apparatus and flashbulbs other than discharge lamps of'. fading No 8539 : Cameras of a kind used for preparing printing plates or cylinders Pattern generating apparatus of a kind used for producing masks free or reticles from photoresist coated substrates free free free free 9006 10 90 Other 9006 91 00 f or cameras Parts and accessories: Sw' p vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 27 of 33 CN 97 L a b el 9006 99 10 9006 99 90 9009 (Mher of apparatus ol subheading'MIII6 Id Id (Mher Photocopv ing apparatus incorporating an optical sv stein or of the contact tvpe and ihermo-copv ing apparatus: I lectrostatic pholocopv ing apparatus B a se R a te F i n al B o u nd R a te Implementation J u l. 1 9 97 Jan. 1998 Jan. 1999 Jan. 2000 -1 fret- 3. 0 2. 0 l. O free 9009 I I 00 Operating bv reproducing the original image directly onto the 6. 5 9009 21 00 9009 90 9009 90 10 9009 90 90 9010 9010 41 00 9010 42 00 9010 49 00 9010 90 9010 90 10 9010 90 90 9011 901 I 10 901 I 10 10 9011 10 90 901 I 20 copv (direct process) ( Mher photocopv ing apparatus Incorporating an optical s w i em Parts and accessories 6. 5 Of electrostatic photocopv mg apparatus or oilier photocopv ing 6. 5 apparatus incorporating an optical svstein Other. Apparatus and equipment for photographic ( i n c l u d i ng cinematographic) laboratories (including apparatus for the projection of circuit patterns on sensilived semi-conduclor material), not specified or included elsewhere in this chapter. negatoscopes, projection screens Apparatus for the projection or d r a w i ng ol circuit patterns on sensiti/ed semiconductor materials: Direct write-on-wafer apparatus Step and repeat aligners Other Parts and accessories 3. 8 fret- fret- free Of the apparatus of subheadings N° 9010 41 00. 9010 42 00 and 3. 6 free free free fret- free free fret- free 4. 9 4. 9 4. 9 2. 8 free free free 2. 7 3. 3 3. 3 3. 3 1. 9 free free free 1. 8 1. 6 free 1. 6 1. 6 0. 9 free free free 0. 9 free free free free free free free 9010 49 00 Other C o m p o u nd optical microscopes, including those for photomicrography, cine-photomicrography or n i i c r o p r o j c c l i on Stereoscopic microscopes lilted w i th equipment specifically designed for the handling and transport of semiconductor wafers or reticles Other Other microscopes, for photomicrographv. cine-photomicrography or micro-projection 8 fret- 6. 0 4. 0 2. 0 free v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj Page 28 of 33 CN97 Label 901 I 20 10 fitted w i t li equipment spec ificallv designed lor llie handling and transport of semicoiufucloi waters or rendes Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 6. 0 4. 0 2. 0 free 901 1 20 90 901 I 9(1 901 I 90 10 901 I 90 90 9012 ( MMer Parts ami acccssoi ies ( )f apparatus ol subMeadings \ 'Mil I III Id or 9 ( l| I 20 Id 6. 0 4. 0 2. 0 free (MMer Micioscopes other than optical microscopes, d i l l r a c l io microscopes 9012 10 Microscopes other II an optical microscopes and diffraction apparatus 9012 10 10 I leclron beam microscopes luted w i th equipment specifically 4. 5 free 3. 4 2. 3 l. l free designed for the handling and transport of semiconductor wafers 9012 10 90 Other or reticles 9012 90 9012 90 10 9012 90 90 9013 Parts and accessories Of apparatus of subheading N° 9(>12 10 00 4. 5 fret- 3. 4 2. 3 free Other L i q u id crvstal devices not consistuling articles nrov ided foi more specifically in o<''cr headings; lasers, other than laser diode. :; other optical appliances and instruments, not : p e c i l i ed or included elsewhere in this Chapter 9013 80 Other devices, appliances and instruments L i q u id crystal devices A c t i ve matrix liquid crystal devices 9013 80 II Colour 9013 80 19 9013 80 30 9013 80 90 9013 90 9013 90 10 9013 90 90 Black and white or other monochrome Other Other Parts and accessories Other f or liquid crystal devices ( L C D) Other 6. 5 6. 5 6. 5 6. 5 free free free 4. 9 4. 9 4 9 3. 3 3. 3 3. 3 1. 6 1. 6 1. 6 4. 9 3. 3 free free free free v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj P a ge 29 of 33 CN97 Label Base Rate: Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 9017 D r a w i n g, niarki. ig-oul or mathematical calculating instruments ( l'or example, drafting machines, pantographs, protractors. drawing sels, slide rules, disc calculators); instruments lor measuring length, for use in the hand (for example, measuring rods and tapes, micrometers, callipers), not specified or included else- where in Ihis chapter Drafting tables and machines, whether or not automatic Plotters Other Other draw ing. niarkuig-oul or mathematical calculating instruments I )raw ing instruments Plotters D r a w i ng sets Other M ark ing-out instruments 9017 10 9017 10 10 9017 10 90 9017 20 9017 20 05 9017 20 II 9017 20 19 3. 7 free 2. 8 1. 9 0. 9 free 3. 7 free 2. 8 1. 9 0. 9 free 90172031 Pattern generating apparatus ol a k i nd used for producing masks fret- free free free free free 90172039 9017 20 90 9017 90 9017 90 10 9017 90 90 9026 9026 10 9026 10 10 or reticles from photoresist coated substrates Other Mathematical calculating instruments ( i n c l u d i ng slide rules, disc calculators and the like) Parts and accessories for apparatus of subheading 90. 7 20 3 I Other Instruments and apparatus for measuring or checking the How, level, pressure or other variables of liquids or ga. ses (for example. How meters, level gauges, mano- meters, heat meters), excluding instruments and apparatus of heading No 9014, 9015, 9028 or 9032 : f or measuring or checking the llow or level of liquids 3. 7 2. 8 1. 9 0. 9 f*ec f or use in c i v il aircraft free free free 9026 10 51 9026 10 59 * /«S. Other electronic f l ow meters Other Other vendredi, 28. février 1997 4. 8 4. 8 free fret- 3. 6 3. 6 European C o m m i s s i on Delegation in Geneva - aj free 2. 4 2. 4 free 1. 2 1. 2 free free free Page 30 of 33 C N 97 Label 9026 10 91 9026 M)99 9026 20 9026 2d Id f l ow meters ( Mher I or measuring or checking pressure f or use in civ il. urcrall Other 9026 20 3d I leclronic Other 9026 20 51 Appliances for measuring and non-automalicallv regulating Ivre Spiral or metal diaphragm Ivpe pressuie gauges 9026 20 59 9026 20 90 9026 80 9026 80 10 9026 80 91 9026 80 99 9026 90 9026 90 10 9026 90 90 9027 9027 20 9027 20 10 9027 20 90 9027 30 00 pressure Olher Other Olher instruments or apparatus 1 or use in civil aircraft Other electronic Other Parts and accessories for use in civ il aircraft Other Instruments and apparatus for physical or chemical analysis (for example, polarimeters. refractometcrs. spectrometers, gas or smoke analysis apparatus): instruments and apparatus for mcasuring. or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters): microtomes : Chromalographs and electrophoresis instruments Chromatographs electrophoresis instruments Spectrometers, spectrophotometers and spectrographs using optical radiations (UV, visible. IR) 9027 50 00 Other instruments and apparatus using optical radiations (UV. Cl 9027 80 Other instruments and apparatus visible, IR) electronic Base Rate Final B o u nd Rate Implementation Jul. 1997 ^an. 1998 Jan. 1999 Jan. 2000 3 6 3 6 free 4 8 3. 3 3. 3 3. 3 free 4. 8 3. 6 free 3. 3 3. 5 4. 4 3. 5 4. 4 free fret- free fret- free free free rree frec free free fret- free fret- free 2. 7 2. 7 free 3. 6 2. 5 2. 5 2. 5 free 3. 6 2. 7 free 2. 5 2. 6 3. 3 2. 6 3. 3 I 8 1. 8 free 2. 4 1. 6 1. 6 1. 6 free 2. 4 1. 8 free 1. 6 1. 8 2. 2 1. 8 2. 2 0. 9 0. 9 free 1. 2 0. 8 0. 8 0. 8 free I. 2 0. 9 free 0. 8 0. 9 l. l 0. 9 l. l free free free free free free free free free free free free free free free vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 31 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1S*7 Jan. 1998 Jin. 1999 Jan. 2000 4. 4 free 4. 4 J fret- free free fret- free free 3. 3 free 3. 3 3. 0 free 4 tree 3. 0 4. 4 free 3. 3 9027 80 I I pi I meters, i ll meters vul oilier apparatus for measuring conductiv nv 9027 80 15 Apparatus for p e r l o r m i ng measurements \^\ tlie pliv sical properties of semiconductor materials or associated insulating and conducting lavers during llie semiconductor water production process 9027 80 18 9027 80 91 9027 80 95 9027 80 98 9027 90 9027 90 10 9027 90 50 9027 90 80 Oilier Oilier Viscometers, porosuneiers and expansion meters Apparatus for performing measurements ol llie phv sical properties ol semiconductor materials or associated insulating and conducting lavers during tlie semiconductor wafer production process ( MMer M i c r o t o m e s: parts and accessories Microtomes Part and accessories of apparatus of heading N1 9027 20 to 9027 80 Parts and accessories of microtomes or of gas or smake analysis apparatus 9030 Oscilloscopes, spectrum analysers and other instruments and apparatus for measuring or checking electrical quantities, excluding meters of heading No 9028; instruments and apparatus for measuring or detecting alpha, beta, gamma. X-ray, cosmic or other ionizing radiations : 9030 40 Other instruments and apparatus, specially designed for telecommunications (for example, cross-talk meters, gain measuring instruments, distortion factor meters, psophometers) 9030 40 10 9030 40 90 9030 82 00 9030 90 9030 90 10 9030 90 20 çrj 9030 90 80 f or use in c i v il aircraft Other Other instruments and apparatus free 5. 5 f or measuring or checking semiconductor wafers or devices free Parts and accessories f or use in c i v il aircraft f or apparatus of subheading N° 9030 82 00 Other 4. 4 free free fret- free free 4. 1 free 3. 3 2? free 2. 2 2. 0 free 2. 0 2. 2 free 2. 8 free 2. 2 \. '{'"" free l. l l. O free l. O l. l free 1. 4 free l. l free free free free free free free free free free free vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 32 of 23 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 9011 Measuring or checking insiiunienls. appliances and maclimes. not 90. 11 II 00 90. 11 19 90. 31 49 10 spec ificd or nu ludcd clscw here in tins v hapier profile projectors ( Mher optical iiislriimenls and appliances I or inspecting seunconduc tor w alcrs or dev ices or lor inspecting plioioin. isks of relic les used HI u i a i i u l a U n r i ng seniiconductor devices Other f or measuring surl. icc particulate contamination on seniiconductor w alcrs 9031 49 90 ( Mher 11 ét free- fret- free free free irée free free free free free 90. 31 90 90. 11 90 10 90. 11 90 20 90. 11 90 90 Parts and accessories ( )| instruments, appliances and machines ol subheading 9011 80. for use m civ il aircrall f or apparatus of subheadings N" 90. 11 41 00 and 90. 3 I 49 10 4. 6 free 3. 4 2. 3 free Other l* V? w - i\5 vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 33 of 33 EC - ITA - Schedule CXL - Attachment A, Section 2 Description HS 97 Headings Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers 70200005 Chemical vapor deposition apparatus for semiconductor production 84198920 Parts of chemical vapor deposition apparatus for semiconductor production Spin dryers for semiconductor wafer processing Parts of spin dryers for semiconductor wafer processing Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process Spraying appliances for etching, stripping or cleaning semiconductor wafers Parts of spraying appliances for etching, stripping or cleaning semiconductor wafers Machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers Apparatus for stripping or cleaning semiconductor wafers Machines for dry-etching patterns on semiconductor materials Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices 84199030 84211995 84219110 84248930 84248920 84249010 84561010 84569930 84569100 84569910 Lasercutters for cutting contacting tracks in semiconductor production by laser beam 84561010 Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips 84641010 Grinding, polishing and lapping machines for processing of semiconductor wafers Dicing machines for scribing or scoring semiconductor wafers Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips 84642005 84649010 84669115 Parts of dicing machines for scribing or scoring semiconductor wafers 84669115 Parts of grinding, polishing and lapping machines for processing of semiconductor wafers 84669115 Parts of focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices 84669315 Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam Parts of machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers 84669315 84669315 Parts of apparatus for stripping or cleaning semiconductor wafers 84669315 Parts of machines for dry-etching patterns on semiconductor materials 84669315 Encapsulation equipment for assembly of semiconductors 84771010, 84775905 Parts of encapsulation equipment 84779004 •nitredi. 2ft. février 1997 Page 1 of. ? O *J Description Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other mai 9rial for semiconductor devices HS 97 Headings 84283993 Apparatus for growing or pulling monocrystal semiconductor boules 84798965 * * * Apparatus for physical deposition by sputtering on semiconductor wafers 84198925. 85438970 Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays 84798975. 84798976 Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors 84798977. 85158005. 85159010 * , Encapsulation equipment for assembly of semiconductors 84798979. 85438973 Epitaxial deposition machines for semiconductor wafers 84798970 Machines for bending, folding and straightening semiconductor leads 84622105. 84622905 Physical deposition apparatus for semiconductor production 85438972 Spinners for coating photographic emulsions on semiconductor wafers 84211993 Part of apparatus for physical deposition by sputtering on semiconductor wafers Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Parts for spinners for coating photographic emulsions on semiconductor wafers Parts of apparatus for growing or pulling monocrystal semiconductor boules 85439020 34799050 84219110 84799050 Parts of apparatus for wet etching, developing,, stripping or cleaning semiconductor wafers and flat panel displays 8479P050, 85439020 Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices 8431:-92Q Parts of encapsulation equipment for assembly of semiconductors 84799050. 85439030 Parts of epitaxial deposition machines for semiconductor wafers 84799050 Parts of machines for bending, folding and straightening semiconductor leads 84669410 Parts of physical deposition apparatus for semiconductor production 84199030, 85439030 Injection and compression moulds for the manufacture of semiconductor devices 84807110 Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductors wafers 85141005,85143011, 85143091 85142005 Apparatus for rapid heating of semiconductor wafers 84198915, 85143091 Parts of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers 85149010 Parts of apparatus for rapid heating of wafers 84199030, 85149010 Parts of furnaces and ovens of Headings No 8514 10 to No 8514 30 * Wafer probers Ion implanters for doping semiconductor materials 85149010 85369020 85431100 Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays 84798975, 84798976. 85433010. 85433020 * * * * * * * * * * * * * * * * * * * * * * * vendredi. 2H. février 1997 Page 2 of 3 J 4 Description Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and fiat panel displays HS 97 Headings 84799050. 85439020 Parts of ion implantera for doping semiconductor materials 85439020 Apparatus for projection, drawing or plating circuit patterns on sensitized semiconductor materials and flat panel displays 90134100. 90104200. 90104900 Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49 90109010 Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles 90111010 90112010 90119010 90119010 Electron beam microscopes fitted with equipment specifically designed for the handling and transport cf semiconductor wafers or reticles 90121010 Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles 90129010 Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates 90061010, 90172031 Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates 90069910, 90179010 Parts of such pattern generating apparatus Instrument and apparatus f 3r measuring or checking semiconductor wafers or devices Parts and accessories of instruments anJ apparatus for measuring or checking semiconductor wafers or devices Parts of instruments and appliances for meafuring or checking semiconductor wafers or devices Optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices Optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers Parts and accessories of optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices 9t)179010 90308200 90309020 90309020 90314*00 90314910 90319020 Parts and accessories of optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers 90319J20 * * * * * * * * * * * * * * * * * * * * vendredi, 2S. février 1997 Page 3 of 3 EC - ITA - Schedule CXL - Attachment B HS 97 Headings 84711090. 84713000. 84714190. 84714990. 84715090. 85219010. 85281210. 85281310. 85438917 Description Computers: automatic data processing machines capable of 1) storing the processing program or programs and at least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance with the requirements of the user; 3) performing arithmetical computations specified by the user; 4) executing without human intervention, a processing program which requires them to modifly teir execution, by logical decision during the processing run. The agreement covers automatic data processing machines whether or not they are able to receive and process with assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified under Attachement A or B, are not covered by this agreement The agreement covers such automatic data processing machines whether or not they are able to receive and process with the assistance of the central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. However, machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machines, and not referred to under part A or B, are excluded from the product coverage of this agreement. Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof. 85175010, 85178090 Flat panel displays (including LCD, Electro Luminescence, Plasma and other technologies) for products falling within this agreement, and parts thereof. Network equipment: Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units - including adapters, hubs, in4ine repeaters, converters, concentrators, bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof Monitors: display units of automatic data processing machines with a cathode ray tube with a dot screen pitch smaller than 0. 4 mm not capable of receiving and processing television signals or other analogue or digittally processed audio or video signals without assistance of a central processing unit of a computer as defined I this agreement. The agreement does not, therefore, cover televisions, including high definition televisions(l). (1) Participants will conduct a review of this product description in January 1999 under the consultation of paragraph 3 of the Declaration. 85312030,85312051, 85312059, 85312080, 85318030,85319010, 85319030, 90138011, 90138019, 90138030, 90139010 84715090, 84716090, 85175090 84716090 Optical disc storage units for automatic data processing machines (including CD drives and DVD-drives), whether or not having the capability of writing/recording as well as reading, whether or not in their own housings. 84717051 Paging alert devices and parts thereof. 85279092, 85299040 vendredi. 28. février 199 7 Page I of 2 tx 5fi Description HS 97 Headings Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017. 84716090. 84718090. 90171010. 90172005 Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements "Active elements" means diodes, transistors and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542. Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, Zipdrive cartridge storage units. Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones, as well as a printed circuit assembly that enables the ADP machine and units thereof to process audio signals (sound cards). 84732110. 84732910. 84733010. 84735010. 85175090. 85179082. 85299040 84717051. 84717053. 84717059. 84717060. 84717090. 85232011. 85232019. 85232090. 85244091. 85244099. 85249190 85438979 Set top boxes which have communication function a microprocessor- based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange. 85175090, 85438977 vendredi. 28. février 1997 Page 2 of 2 f"M o Proposal for a Council Decision 97/0083 (ACC) concerning the elimination of duties on certain spirituous beverages THE COUNCIL OF THE EUROPEAN UNION Having regard to the Treaty establishing the European Community, and in particular Articles 113, in conjunction with Article 228(2) first sentence, thereof, Having regard to the proposal from the Commission, Whereas the elimination of tariffs by the United States and the European Community is considered to be of overall benefit; HAS DECIDED AS FOLLOWS: Article J The Agreement in the form of a Memorandum of Understanding between the European Community and the United States of America on spirituous beverages is hereby approved on behalf of the Community. The text of the Agreement is attached to this Decision. Article 2* The Council authorises the Commission to submit to the World Trade Organisation the attached modification to the schedule of the European Community so as to bind and eliminate customs duties for the spirituous beverages concerned. Articles The President of the Council is hereby authorised to designate the person empowered to sign the Agreement/Protocol in order to bind the Community. Done at Brussels For the Council The President MEMORANDUM OF UNDERSTANDING ex 2208 Spirits, liqueurs and other spirituous beverages As agreed in Singapore we have engaged in detailed negotiations regarding the elimination of duties on certain spirituous beverages. Subject to the completion of our respective internal procedures, and with the exception of rum (2208. 40) for which the special provisions set out in the Annex apply, the EC and US will eliminate their duties scheduled to be in force on 1 July 1997 for the HS96 headings listed below in 4 equal stages commencing 1 July 1997, followed by further reductions on 1 January 1998, 1 January 1999 and 1 January 2000; HS96 spirits obtained by distilling grape wine or grape marc (grape brandy) 2208. 20 2208. 30 whiskies 2208. 50 2208. 60 2008. 70 gin and geneva vodka liqueurs and cordials ex 2208. 90 other than un-denatured ethyl alcohol of an alcoholic strength by volume of less than 80% volume (covered by 2208. 90. 91 and 2208. 90. 99 by the EC and within 2208. 90. 80 by the US) 59 ANNEX Subject: 2208. 40 - Rum and Taffia A. 0. EC Duties The reductions in duties on Rum with a content of volatile substances other than ethyl and methyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance shall be as set out below: In containers holding 2 litres or less • — —. ^ ^ — ^ — — ^ ^ — — — — _ ^ — - ^ __ In containers holding more than 2 litres Base rate 0. 8 Ecu/%vol/hl + 4. 1 0. 8 Ecu/%vol/hl Ecu/Id 1 July 1997 0. 8Ecu/%vol/hl + 4. 1 Ecu/hi 0. 8 Ecu/%vol/hl 1 July 1998 0. 7Ecu/%vol/h!+3. 8 Ecu/hi 0. 7 Ecu/ %vol/hl 1 July 1999 0. 65 Ecu/ %vol/hl +3. 5 Ecu/hi 0. 65 Ecu/%vol/hl 1 July 2000 0. 6Ecu%vol/hl + 3. 2 Ecu/hi 0. 6 Ecu/%vol/hl The EC duty on rum and taffia, other than that specified in paragraph 1 above, of a value specified in the following table shall be subject to the reduced duty rates below within the tariff quota amounts indicated until duty free treatment is reached on 1 January 2003. The tariff quota amounts cover rum in whatever size of container. CK Duty rate Tariff quota amount In containers holding 2 litres or less Valued over Ecu 7 9 per litre of 100% alcohol 0. 7 Ecu/ %vol/hl +3. 5 Ecu/hi 0. 6Ecu/%vol/hl + 2. 9 Ecu/hi 0. 5 Ecu/%vol/hl + 2. 3 Ecu/hi 0. 4 Ecu/ %vol/hl +1. 8 Ecu/hi 0. 3 Ecu/ %vol/hl +1. 2 Ecu/hi 0. 2 Ecu/ %vol/hl +0. 6 Ecu/hi Free In containers holding more than 2 litres Valued over Ecu 2. 0 per litre of 100% alcohol 0. 7 Ecu/%vol/hl Litre alcohol of 100% 890 000 0. 6 Ecu/%vol/hl 1950 000 0. 5 Ecu/%vol/hl 0. 4 Ecu/%vol/hl 2145 000 2359 500 0. 3 Ecu/%vol/hi 2595 450 0. 2 Ecu/%vol/hl 2854 995 Free unlimited 1 July 1997 1 January 1998 1 January 1999 1 January 2000 1 January 2001 1 January 2002 From 1 January 2003 Rum and taffia below the price breaks indicated above as well as rum and taffia not covered by tariff quota amounts shall be subject to the same duty rates as shown in paragraph 1 above. The European Community shall promptly notify the United States of any changes between 1 January 2000 and 1 January 2003 in the preferential treatment accorded to its imports of rum. The European Community shall, upon request, promptly enter into consultations with the United States with respect to any matter concerning US exports of rum, under paragraph 2 above, to the Community, with a view to reaching a mutually agreed solut;on on any matter raised in the consultations. G B. 5. US Duties The following reduction in duties shall apply to rum and taffia. rum and taffia rum and taffia (a) in containers each not (a) in containers each not holding over 4 liters valued holding over 4 liters valued over $3. 00 per proof liter; not over $3. 00 per proof and liter; and in containers (b) each holding over 4 liters valued holding over 4 liters valued over 69 cents per proof liter not over 69 cents per proof containers each (b) in liter. July 1, 1997 26. 1 cents/proof liter 30. 4 cents/proof liter January 1, 1998 21. 7 cents/proof liter 28. 1 cents/proof liter January 1, 1999 17. 4 cents/proof liter 25. 9 cents/proof liter January 1, 2000 13. 0 cents/proof liter 23. 7 cents/proof liter January 1, 2001 8. 7 cents/proof liter 23. 7 cents/proof liter January 1, 2002 4. 3 cents/proof liter 23. 7 cents/proof liter January 1,2003 0 23. 7 cents/proof liter G 2 CN 97 Label Base Rate Final Bound Rate Jul. 97 Jan. 93 Jan. 99 Jan. 2000 Implementation EC - SPIRITS - Schedule CXL 2208 220? 20 Undenatured ethyl alcohol of an alcoholic strength by volume of less than 80 % vol; spirits, liqueurs and other spirituous beverages - - Spirits obtained by distilling grape wine or grape marc In containers holding 2 litres or less 2208 20 12 — Cognac 2208 20 14 — Armagnac 2208 20 26 Grappa 2208 20 27 Brandy de Jerez 2208 20 29 Other 2208 20 40 In containers holding more than 2 litres Raw distillate 2208 20 62 Other Cognac 2208 20 64 Armagnac 2208 20 86 Grappa c: 2208 20 87 Brandy de Jerez lundi 17 février 1997 1. 12 Ecu/% vol/hl + 7 Ecu/hi 1. 12 Ecu/% vol/hl + 7 Ecu/hi 1. 12 Ecu/% vol/hl + 7 Ecu/hi 1. 12 Ecu/% vul/hl + 7 Ecu/hi 1. 12 Ecu/% vol/hl + 7 Ecu/hi 12 Ecu/% vol/hl 12 Ecu/% vol/hl. 12 Ecu/% vol/hl. 12 Ecu/% vol/hl 1. 12 Ecu/% vol/hl free free free free free free free free free free 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hi 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hi 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hi 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hi 0. 84 Ecu/% vol/hl' + 5. 3 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 28 Ecu/% vol/hl+1. 8 Ecu/hi 0. 28 Ecu/% vol/hl+1. 8 Ecu/hi 0. 28 Ecu/% vol/hl+1. 8 Ecu/hi 0. 28 Ecu/% vol/hl+1. 8 Ecu/hi 0. 28 Ecu/% vol/hl+1. 8 Ecu/hi 0. 84 Ecu/% / vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/%. vol/hl free free free free free free free free free free European Commission Delegation in Geneva - aj Page 1 CN97 Label 2208 20 89 — Other 2208 30 - Whiskies — Bourbon whiskey, in containers holding 2208 30 11 — 2 litres or less 2208 30 19 — More than 2 litres Scotch whisky Malt whisky, in containers holding 2 litres or less 2208 30 32 2208 30 38 — More than 2 litres 2208 30 52 — Blended whisky, in containers holding — 2 litres or less 2208 30 58 — More than 2 litres 2208 30 72 — Other, in containers holding — 2 litres or less 2208 30 78 — More than 2 litres Other, in containers holding 2208 30 82 2 litres or less EC - SPIRITS - Schedule CXL Base Rate Final Bound Rate Jul. 97 Jan. 9g> Jan. 99 Jan. 2000 Implementation 12 Ecu/% vol/hl free 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 2 Ecu/% vol/hl + 1. 5 Ecu/hi 0. 2 Ecu/% vol/hl 0. 28 Ecu/% vol/hl+ 2. 1 Ecu/hi 0. 28 Ecu/% vol/hl 0. 28 Ecu/% vol/hl+ 2. 1 Ecu/hi 0. 28 Ecu/% vol/hl 0 28 Ecu/% vol/hl+ 2. 1 Ecu/hi 0. 28 Ecu/% vol/hl 0. 28 Ecu/% vol/hl+ 2. 1 free free free free free free free free free 0. 15 Ecu/% vol/hl +1. 13 Ecu/hi 0. 15 Ecu/% vol/hl 0. 1 Ecu/% vol/hl + 0. 8 Ecu/hi 0. 1 Ecu/% vol/hl 0. 05 Ecu/% vol/hl + 0. 8 Ecu/hi 0. 05 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 Ecu/hi 0. 14 Ecu/% vol/hl +1. 1 Ecu/hi 0. 07 Ecu/% vol/hl + 0. 5 Ecu/hi 0. 21 Ecu/% vol/hl 0. 14 Ecu/% vol/hl 0. 07 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 Ecu/hi 0. 14 Ecu/% vol/hl+1. 1 Ecu/hi 0. 21 Ecu/% vol/hl 0. 14 Ecu/% vol/hl 0. 07 Ecu/% vol/hl + 0. 5 Ecu/hi 0. 07 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 Ecu/hi 0. 14 Ecu/% vol/hl +1. 1 Ecu/hi 0. 07 Ecu/% vol/hl + 0. 5 Ecu/hi 0. 21 Ecu/% vol/hl 0. 14 Ecu/% vol/hl 0. 07 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 0. 14 Ecu/% vol/hl +1. 1 0. 07 Ecu/% vol/hl + 0. 5 free free free free free free free free free free lundi 17 février 1997 European Commission Delegation in Geneva - aj Page 2 CM 97 Label 2208 30 88 More than 2 litres EC - SPIRITS - Schedule CXL Base Rate Ecu-lil Final Bound Rate Jul. 97 Ecu/hi Implementation Jan. 98 Ecu/hi Jan. 99 Ecu/hi Jan. 2000 0. 28 Ecu/% vol/hl free 0. 21 Ecu/% vol/hl 0. 14 Ecu/% vol/hl 0. 07 Ecu/% vol/hl free 2208 40 2208 40 10. Riun and taffia: - -- — Ex ; Rum with a content of volatile substances other Hum ethyl In containers holding 2 litres or less and methyl alcohol equal to or exceedmg 225 grams per hectolitre of pure alcohol with a 10% tolerance. Ex : Other 2208 40 90 hi containers holding more than 2 litres Ex : Rum with a content of volatile substances other than ethyl and metliyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance. Ex : Other 2208 50 Gin and geneva: 2208 50 11 Gin, in containers holding : 2 litres or less 2208 50 19 « More than 2 litres 2208 50 91 Geneva, in containers holding 2 litres or less 2208 50 99 More than 2 litres 0 8 Hcu/% vol/hl +4. 1 Ecu/hi 0. 8 Ecu/% vol/hl + 4. 1 Ecu/hi 0. 8 ECU/% vol/hl 0. 8 Ecu/% vol/hl 0. 8 Ecu/% vol/hl +4. 1 Ecu/hJ 0. 8 Ecu/% vol/hl 1 3 lxu/% vol/hl + 8. 2 Ecu/lil 1. 3 Ecu/% vol/hl free free 0. 6 Ecu/% vol/hl + 3. 1 Ecu/hi 0. 4 Ecu/% vol/hl + 2. 1 Ecu/hi C. 2 Ecu/% vol/hl + 1. 0 Ecu/hi 0. 6 Ecu/% vol/hl 0. 4 Ecu/% vol/hl 0. 2 Ecu/% vol/hl 1. 0 Ecu/% vol/hl 6. 2 Ecu/hi 0. 7 Ecu/% vol/hl +4. 1 Ecu/hi free 1. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 3 Ecu/% vol/hl +2. 1 Ecu/hi 0. 3 Ecu/% vol/hl free free free free 2208 60 - Vodka -- Of an alcoholic strength r>y volume of 45. 4% vol or less in containers holding: 2208 60 11 — 2 litres or less 1 1 Ecu/% free 0. 8 Ecu/% 0. 6 Ecu/% 0. 3 Ecu/% free as lundi 17 février 1997 European Commission Delegation in Geneva - aj Page 3 CN97 Label Base Rate Final Bound rate Implementation EC - SPIRITS - Schedule CXL 7^7- 2208 40 2208 40 10 - Rum and taffia -- In containers holding 2 litres or less — Ex: Rum with a content of volatile substances other than ethyl and methyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance July 1997 July 1998 July 1999 July 2000 0. 8 Ecu/%vol/hl + 4. 1 Ecu/hi 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hi 0. 8 Ecu/%vol/hl + 4. 1 Ecu/hi 0. 7 Ecu/%vol/hl + 3. 8 Ecu/hi 0. 65 Ecu/%vol/hl + 3. 5 Ecu/hi 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hi — Ex Other: — Valued over Ecu 7. 9 per litre of 100% alcohol* 0. 8 Ecu/%vol/hl -r 4. 1 Ecu/hi Free July 1997 0. 7 Ecu/%vol/hl + 3. 5 Ecu/hi* • Jan 1998 0. 6 Ecu/%vol/hl+. 2. 9 Ecu/hi* Jan 1999 0. 5 Ecu/%vol/hi + 2. 3 Ecu/hi* Jan 2000 0. 4 Ecu/%vol/hl + 1. 8 Ecu/hi* Jan 2001 0. 3 Ecu/%vol/hl + 1. 2 Ecu/hi* Jan 2002 0. 2 Ecu/%vol/hl + 0. 6 Ecu/hi* Jan 2003 Free 2208 40 90 —- Other In containers holding 2 litres or less — Ex: Rum with a content of volatile substances other than ethyl and methyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance 0. 8 Ecu/%vol/hl + 4. 1 Ecu/hi 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hi July 1997 0. 8 Ecu/%vol/hl + 4. 1 Ecu/hi July 1997 July 1998 0. 7 Ecu/%vol/hl + 3. 8 Ecu/hi July 1998 July 1999 0. 65 Ecu/%vol/hl + 3. 5 Ecu/hi July 1999 July 2000 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hi July2000 0. 8 Ecu/%vol/hl 0. 6 Ecu/%vol/hl 0. 8 Ecu/%vol/hl 0. 7 Ecu/%vol/hl* 0. 65 Ecu/%vol/hI 0. 6 Ecu/%vol/hl — Ex Other: — Valued over Ecu 2. 0 per litre 0. 8 Ecu/%voI/hl Free of 100% alcohol* July 1997 0. 7 Ecu/%vol/hl* Jan 1998 0. 6 Ecu/%vol/hl* Jan 1999 0. 5 Ecu/%vol/hl* Jan 2000 0. 4 Ecu/%vol/hl* Jan 2001 0. 3 Ecu/%vol/hl* Jan 2002 0. 2. Ecu/%vol/hI* Jan 2003 Free —- Other 0. 8 Ecu/%vol/hl 0. 6 Ecu/%vol/hl July 1997 0. 8 Ecu/%vol/hl July 1998 0. 7 Ecu/%vo!/hl July 1999 0. 65 Ecu/%vol/hl July 2000 0. 6 Ecu/%vol/hl OS 05 * Note: In the period 1 July 1997 to 31 December 2002 these concessions shall be limited by the tariff quota amounts indicated below within which rum and taffia in whatever size of container can be imported at the duty rates indicated. From 1 January 2003 there will be no tariff quota limitation: Tariff Quota Period 1 Jan 2001 - 31 December 2001 Litres of 100% alcohol Litres of 100% alcohol Litres of 100% alcohol Tariff Quota TariffQupta 2,595,450 2,145,000 1 July 1997 - 31 December 1997 J Jan 1998-31 December 1998 890,000 1,950,000 - 1 Jan 1999 - 31 December 1999 1 Jan 2000 - 31 December 2000 2,359,500 1 Jan 2002 - 31 December 2002 2,854,995 6 foiS EC - SPIRITS - Schedule CXL CN97 Label Base Rate Final Bound Rate 2208 60 19 — More than 2 litres vol/hl +4. 1 Ecu/hi 1 Ecu/% vol/hl 2208 60 91 Of an alcoholic strength by volume of more than 45. 4% vol in containers holding: 2 litres or less 1. 3 Ecu/% vol/hl +8. 2 Ecu/hi 2208 60 99 More than 2 litres 2208 70 2208 70 10 - - Liqueurs and cordials in containers holding: 2 litres or less 2208 70 90 - More than 2 litres 2208 90 - Other - Arrack, in containers holding: 2208 90 11 — 2 litres or less 2208 90 19 — More than 2 litres Plum, pear or cherry spint (excluding liqueurs), in containers holding 2208 90 33 — 2 litres or less 2208 90 38 — More than 2 litres c:. 3 Ecu/% vol/hl 1. 3 Ecu/% vol/hl +8. 2 Ecu/hi. 3 Ecu/% vol/hl 0. 8 Ecu/% vol/hl +4. 1 Ecu/hi 0. 8 Ecu/% vol/hl 0. 91 Ecu/% vol/hl + 3. 5 Ecu/hi 1 Ecu/% vol/hl Other spirits, and other spirituous beverages, in containers holding 2 litres or less lundi 17 février 1997 European Commission Delegation in Geneva - aj free free free free free free free free free Implementation Jul. 97 vol/hl +3. 1 Ecu/hi Jan. 9g vol/hl +2. 1 Ecu/hi 0. 8 Ecu/% vol/hl 0. 6 Ecu/% vol/hl Jan. 99 vol/hl +1. 0 Ecu/hi 0. 3 Ecu/% vol/hl 1. 0 Ecu/% vol/hl +6. 2 Ecu/hi 0. 7 Ecu/% vol/hl +4. 1 Ecu/hi 0. 3 Ecu/% vol/hl +2. 1 Ecu/hi 1. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 3 Ecu/% vol/hl 1. 0 Ecu/% vol/hl +6. 2 Ecu/hi 0. 7 Ecu/% vol/hl +4. 1 Ecu/hi 0. 3 Ecu/%. vol/hl +2. 1 Ecu/hi 1. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 3 Ecu/% vol/hl 0. 6 Ecu/% vol/hl +3. 1 Ecu/hi 0. 4 Ecu/% vol/hl +2. 1 Ecu/hi 0. 2 Ecu/% vol/hl +1. 0 Ecu/hi 0. 6 Ecu/%/ vol/hl ' 0. 4 Ecu/% vol/hl 0. 2 Ecu/% vol/hl 0. 68 Ecu/% vol/hl+ 2. 6 Ecu/hi 0. 46 Ecu/% vol/hl + 1. 8 Ecu/hi 0. 22 Ecu/% vol/hl + 0. 9 Ecu/hi 0. 8 Ecu/% vol/hl 0. 6 Ecu/% vol/hl 0. 3 Ecu/% vol/hl Jan. 2000 free free free free free free free free free Page 4 CN97 Label 2208 90 41 — Ouzo Other • Spirits (excluding liqueurs) - Distilled from fruit — Calvados 2208 90 45 2208 90 48 — Other 2208 90 52 Other -Korn 2208 90 57 Other 2208 90 69 Other spiritual beverages More than 2 litres Spirits (excluding liqueurs) • Distillea from fruit 2208 90 71 2208 90 74 Other 2208 90 78 — Other spiritual bevercges C^ lundi 17 février 1997 EC - SPIRITS - Schedule CXL Final Bound Rate free Base Rate 1. 3 Ecu/% vol/hl +8. 2 Ecu/hi Implementation Jul. 97 1. 0 Ecu/% vol/hl +6. 2 Ecu/hi Jan. 96 0. 7 Ecu/% vol/hl +4. 1 Ecu/hi Jan. 99 0. 3 Ecu/% vol/hl +2. 1 Ecu/hi Jan. 2000 free 1. 12 Ecu/% vol/hl + 7 Ecu/hi 1. 12 Ecu/% vol/hl + 7 Ecu/hi 1. 3 Ecu/% vol/hl +8. 2 Ecu/hi 1. 3 Ecu/% vol/hl +8. 2 Ecu/hi 1. 3 Ecu/% vol/hl +8. 2 Ecu/hi 1. 12 Ecu/% vol/hl 1. 3 Ecu/% vol/hl. 3 Ecu/% vol/hl free free free free free free free free 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hi 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hi 1. 0 Ecu/% vol/hl +6. 2 Ecu/hi 1. 0 Ecu/% vol/hl +6. 2 Ecu/hi 1. 0 Ecu/% vol/hl +6. 2 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 7 Ecu/% vol/hl +4. 1 Ecu/hi 0. 7 Ecu/% vol/hl +4. 1 Ecu/hi 0. 7 Ecu/% vol/hl +4. 1 Ecu/hi 0. 28 Ecu/% vol/hl+1. 8 Ecu/hi 0. 28 Ecu/% vol/hl+1. 8 Ecu/hi 0. 3 Ecu/% vol/hl +2. 1 Ecu/hi 0. 3 Ecu/% vol/hl +2. i Ecu/hi 0. 3 Ecu/% vol/hl +2. 1 Ecu/hi 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 1. 0 Ecu/% vol/hl 1. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 3 Ecu/% vol/hl 0. 3 Ecu/% vol/hl free free free free free free free iree European Commission Delegation in Geneva • aj PageS FINANCIAL STATEMENT Proposal for a Council Decision concerning the elimination of duties on information technology products and certain spirituous beverages. 2 3. 4. 5 6. Budget heading: Chapter 12/ Article 120 Legal basis: Article 113 Description: The proposal is a consequence of the Council Decision to open negotiations with third countries with a view to concluding an Information Technology Agreement and the political undertaking made by Ministers at the Singapore Ministerial Conference of 13 December 1996. It concerns the elimination of duties on Information Technology products and certain spirituous beverages by the year 2000. Type of revenue: Loss of revenue on duties paid on third country imports. Change in level of revenue: The elimination of duties payable on imports of information technology products will be completed in 4 equal yearly stages from 1 July 97 to 1 January 2000. The duty loss (for is calculated as the difference between the agreed Uruguay Round tariff level each year) and the rate agreed to under the ITA (for the same year) applying to a volume of imports as realized in 1995. (see annex attached). In sum the ITA loss in revenue is only the additional revenue loss. The final total figures are the following: 242. 6 MECU, 1. 7. 97 643. 3 MECU 1. 1. 98 1. 1. 89 891. 3 MECU 1. 1. 2000: 1241. 8 MECU Regarding spirits, on the basis of EC 15 imports in 1995, and based on ad valorem equivalents (ave) for all MFN imports in 95, the duty loss will be: 1. 7. 97: 0. 5 MECU, 1. 1. 98: 1. 6MECU 1. 1. 99: 2 MECU LI. 2000: 2. 5 MECU 1. 1. 2001: 1. 9 MECU 1. 1. 2002: 1. 2 MECU 1. 1. 2003 0. 7 MECU The annual average is 1625 Kecu (6. 5 year^) and a total of 10. 5 MECU The value reduction in traditional own resources shall be financed on the basis of additional recourse from PNB resources. 6Î: European Commission ITA DUTY LOSS 1997-2000 Directorate General External Relations HS-97 EU imports 95 (kecu) Total duty loss ITA Duty loss 97 4 steps Duty loss 98 4 steps Duty loss 99 4 steps Duty loss 00 4 steps 3818 00 Total 8469 11 Total 8470 10 Total 8470 21 Total 8470 29 Total 8470 30 Total 8470 40 Total 8470 50 Total 8470 90 Total ' 8 4 71 10 Total 8471 30 Total 8471 41 Total 8471 49 Total 8471 50 Total 8471 60 Total 8471 70 Total 8471 80 Total 8471 90 Total 8472 90 Total 8473 21 Total 8473 29 Total 8473 30 Total 8473 50 Total 8504 40 Total 8504 50 Total 8517 11 Total 8517 19 Total 8517 21 Total 8517 22 Total 8517 30 Total 8517 50 Total 8517 80 Total 8517 90 Total 8518 10 Total 8518 29 Total 8518 30 Total 8520 2ÔTotal " 8523 ' 11 Total "" 8523 12 Total 8523 13 Total 8523 20 Total 8523 90 Total 8524 31 Total 8524 32 Total 8524 39 Total 8524 40 Total 8524 91 Total " 8 5 24 99 Total" 8525 10 Total 8525 20 Total 8525 40 Total 8527 90 Total 8529 10 Total " 8529"~90~~fotaT — —- jÔTotaP' 8531 90 Total 8532 10 Total 8532 21 Total 8532 22 Total 8532 23 Total 8532 24 Total 8532 25 Total 8532 29 Total 170 531 29 929 4 1 0 7 19 5 9 1 14 11 975 2 786 11 834 166 942 32 651 83 905 2 956 157 344 694 2 308 652 538 257 4 769 150 5 495 373 538 415 287 733 22 038 4 654 33 008 3 352 385 3 632 303 250 682 10 903 375 826 1 058 182 859 052 334 _ 152 286 673 096 443 858 1 171 807 4 132 9 796 41 032 126 869 100 846 62 554 ~ 437 6 87 239 018 80 320 89 984 8"9 984 80 986 " 145 407 989 196 " 18 630 24 608 "". _ 388 830, 94 861 34 958 749 579 817 789 822 421 12 931 0 731 340 251 381 50 047 "222 137 24 091 2 7 4 20 26 432 1 616 43 622 8 394 1 701 130 550 7 763 1 518 2 3 17 175 892 20 134 136 826 31 692 19 070 20 234 2 154 1 151 1 146 101 644 159 348 182 332 1 003 949 1 879 228 762 71 731 ' Ï Ï Ï" 12716 57 152 " 37 063 81 855 246 705 _. ^ 11 862 4 "639 5 223 ' " 36 "546 6 707 7514 "7 514 6 7 62 3 878 "5" 603 1 556 2 129 58 145 11 146 6 572 "72"6~39 57 245 7 9 3 0Ï 1 248 6 11492 21 996 3 253 14 439 "7566 Ï 392 1 535 120 3 3 04 650 132 10 41 584 114 175 13 303 1 523 10348 2 397 14 303 15611 1 615 863 88 19 87 12910 13 563 752 65 """7504 13 445 5 584 9 990 4 138 2 685 6 781 "' 19 " 49 "226 "825" 403 34"7 2 407 " 1 Ï28 " " 5 628 359 9 495 1 833 371 28 118 1 669 327 506 38 430 4 399 29 895 6 924 4 767 4 623 538 288 243 23 125 34 748 37 785 ™" 251 ~207 376 ' " ~ 4 8 Ï 4 0' 15 463 24 2 741 12 353 7 990 17 828 '" " 54 157' 451 ~2~537 " T Ô 08 1 726 7 8 78 ""~3 036 1 446 ~~ 442 495 ""495 445 541 3 0 Ï9 103 135 3 178 617 4T9 972 """ "" " 1 458 851 7 341 336 468 12 339 _2~372 7 3 98 „„ g„. " "". _. _. 4 907 4 519 7l " 26' 854" 7 6 34 250 "'7 no" " Ï 20 TÔ7 12 266 " """ 77 257 """272 73 " " "2 495" " "4 776 701 3 110 "337" 300 «I Pnge 1 8 1 85 449 12 383 2 365 479 36 154 2 170 424 662 50 255 5 752 39'093 9 055 0 0 0 0 331 24 183 49 640 55 417 0 273 0 7 7 6 47 Ï9~759" 31 3 503 " 16" 429 " '" "" 10 209 22 094 To 206" 451 " " 3 4 2 5' {"210 7 5 64 7 0 9 42 ------- 2'008 2 2 5Ô 2 0 25 ' V 034 518 466 640 - - — -• "'""'3 5 Ï0 " '7 958 ~3 590 "~ "i 5 5 3 81 24 653j 388 _ __, - - - -- 6 285 957 4 221 458 407 11 085 689 1 8 4 40 3 547 719 56 237 3 339 653 974 73 904 8 460 57 490 13316 0 0 0 0 485 " ' " " 36 250 62 050 75 568 0 403 ~ ""6 "95 576 30 926 48 5 482 24 232 " 15 979 " 35 153 " 103 294 "821" 5 075 ~~2u77 2 189 T 5 3 T 9' ~5 760 28TT 3 149 3 149 2 8 34 7 450 " " ' 725 652 """"""" """"'"886 27 305 ' 7 6 48 """"2797 5 386 24 534 32 871 517 140 4 860 9 3o7 1351 5 998 650 578 European Commission ITA DUTY LOSS 1997-2000 Directorate General External Relations HS-97 EU imports 95 (kecu) Total duty loss ITA Duty loss 97 4 steps Duty loss 98 4 steps Duty loss 99 4 steps Duty loss 00 4 steps 8532 30 Total 8532 90 Total 8533 10 Total 8533 21 Total 8533 29 Total 8533 31 Total 8533 39 Total 8533 40 Total 8533 90 Total 8534 00 Total 8536 50 Total 8536 90 Total 8541 10 Total 8541 21 Total 8541 29 Total 8541 30 Total 8541 40 Total 8541 50 Total 8541 60 Total 8541 90 Total 8542 12 Total 8542 13 Total 8542 14 Total 8542 19 Total 8542 30 Total 85<*2 40 Total • 8542 50 Total 8542 90 Total 8543 81 Total 8543 89 Total 8544 41 Total '" 85'44" 49 Total" " 8544 51 Total 8544 70 Total 9001 10 Total 9009 12 Total 9009 21 Total 9009 90 Total 9026 10 Total 9026"70 Total"""" 9026 80 Total 9026 90 Total "' 9027 20 Total " 9027 30 Total " 9027 50 Total 9027 80 Total 9027 90 Total 9030 40 Total 22 797 6 070 50 255 158 855 26 522 18 333 8 032 101 626 1 7 2 64 593 219 31 476 527 614 214 276 117 862 223 342 27 227 283 283 16 154 328 696 41 665 86 358 3 297 950 2 1 6 7 15 3 518 982 896 423 150 154 174 530 88 672 269 728 13 486 57 694 47 339 7 101 " " 44 147 53 088 399 100 169 827 933 748 74 446 106 025 75 851 106 "653 62 103 "" 170 639" "759 177 324 106" 205 974 82~925 - Grand Total 50 430 563 1 995 534 3 216 10 167 1 697 1 173 514 6504 1 105 62 584 1 700 28 491 35 784 19 683 37 298 4 547 21 013 2 698 30 569 2 854 28 714 191 806 25 841 218 368 149 704 25 076 29 147 148 36 251 794 133 92 40 508 86 3 856 126 2 1 10 1 928 1 061 2 0 10 7 245 1 495 145 2 301 229 1 511 13 183 1 640 14 862 8 068 1 350 1 571 " "" """488 23 601 1 180 4 442 4 l is 547 ------ " 3 6 10 '"""56"872 24 200 131 854 4 006 6 7 14 4 284" " 4*940 3485 g 3oo " ~9 3 9Ï "16 654 " " "12 152 ~8~362 3 018 930 "7753 88 346 284" 43 353 "319 " 3 7 9 2* 7 4 44 7 877 344" ""532 369" "447" "7 Ï7 768 975" 1" 659 " " " " 7 2 37 """"""580" 242 676 433 115 704 2 224 371 257 112 1 423 242 13 051 378 6 331 7 5 00 4 126 7 8 17 953 4 456 565 6 574 625 6 045 39 569 5 361 45 080 31 374 5 255 r 6 109 "7 330" 5 125 256 "923 899 114 1 192 796 I Ï 9 73 "5 095 27 773 869 7 3 78 "930" 1 0 98 " 6 08 7 3 6 51 2 069 3 663 2 678 1 904 643 351 570 158 905 2 859 477 330 145 1 830 311 18 983 473 7 9 14 11 357 6 246 11 837 1 443 6 465 856 8 546 792 9 068 59 918 8 119 68 266 47 510 7 958 9 2501 1 685 6 743 3371 1 269! 1 183! 156! 1 633 956 17 560 7 472J 844 225 1 357 4 289 716 495 217 2 744 466 26 695 724 12 135 1 5 0 00 8'250 15 633 1 906 8 597 1 131 13 148 1 208 12 090 79 137 10 723 90 161 62 750 1 0 5 10 1 2 2 17 2 571 9 980 499 1 904 1 752 234 2 296 1 540 23 946 10 190 40 6 9 27 55 517 1 072J' " "1 718 " 7 6 9 2! 1 146 1297 ----- 2 901 I 2 388 4 290 3 090 2 401 891 396! ~' ~2 715 1 838 2 096 1 552 4 266 3 979 7 043 5 149 3 477 1 241 843 ( L ISSN 0254-1475 COM(97) 96 final DOCUMENTS EN 02 03 15 Catalogue number : CB-CO-97-090-EN-C ISBN 92-78-16671-5 Office for Official Publications of the European Communities L-2985 Luxembourg r-i 6)