Hey, this is Adam Brown CEO of Nanolog Audio
This video is about to walk you through the
entire packaging process for our Nanolog Devices.
These components are the very first commercial
molecular electronics, ever, why that
matters is because we are defying the laws
of physics and achieving things you simply cannot
with traditional silicon based electronics.
This is useful for many things, but one really exciting
area,  something very true to my heart,
is audio where this unique conduction driving these
richer and more organic sound, similar to
vacuum tubes.
But I invite you now to join me, and us, in
the lab, where the magic happens! And I will see you there.
Today we are at the lab packaing our diced wafers and turning them into finished products, for you, the people
Hope you enjoy
First, we remove the dies from the diced wafer
– this is referred to as singulation
Next, we transfer to the probing station for
testing. This step is crucial to ensure that
our customers receive only the highest grade
products possible.
Here you see Ushula, our Master Fabricator,
running a test that measures a current through
the device yielding in this case, a perfect N3 curve.
So next, we will be taking this unfinished, blank, COB panel
and we will be placing a single die between those gold squares
And we will be using this silver conductive epoxy
1:1 ratio ... very easy to remember
It's gonna be good
This conductive epoxy is what allows electricity
to flow through our devices.
Each Nanolog Device is made of a conductor
and a conductor, bridged by a layer of carbon
molecules anywhere from 1 to 10 nanometers
thick.
Only at these nanoscopic ranges can we achieve
the phenomena known as quantum tunneling.
This packaging process is called flip chip,
as the Nanolog Devices must be placed face
down on the Chip-on-board panel. By doing
this, the silver epoxy connects the connective
pads on the singulated die to the finished
package.
This epoxy must then be cured in an oven at
120 degrees Celsius.
This is 20 minutes, huh?
Yup, yeah
And next we will be mixing our epoxy for the
glob top ... 2:1 ratio
Still easy for those scientists
The glob top epoxy is what protects the packaged Nanolog
device.
It’s a 2 part epoxy, and as you can see,
it’s quite thick.
It goes 1:2?
Yup... 10... 15
It requires time to rest before application,
so we mix it while the devices cure in the
oven.
This epoxy needs to be well mixed, and has
a limited pot life, meaning at room temperature
this mixture will become thicker and thicker,
making it harder to deal with.
Once the epoxy is ready, it’s important
to move quickly to ensure there’s no waste
in the process.
With the conductive epoxy cured, we transfer
the devices back to the packaging station.
Here you see a finished panel, with excellent
uniformity, thanks to Ushula’s robotic placement
precision
Next, we must transfer the glob top to our
application device, a syringe – and this
can get messy.
We use a timed air pressure application system,
the Fisnar DC100, that allows us to control
the air pressure as well as program the dispensing
time. This enables us to have a highly uniform
finished product.
The DC100 has been a critical piece of equipment
to bring this packaging process in house to
our laboratory, which allows us to pass on
cost savings to our customers.
And even with the best planning, there can
always be surprises, in this case, we had
to change this syringe tip before getting
started.
This glob top process is the final step in
the packaging journey. After this, the devices
will undergo one last probe check to ensure
that they functioning properly before sending
out to customers.
These devices are destined for the audio world.
The unique conduction from the quantum tunneling
process creates warm and rich harmonics that
bring an organic sound to audio products not
possible with traditional silicon based electronics.
Perfect - Woo!
