Memory devices are typically provided as internal, semiconductor, integrated circuit devices in computers or other electronic devices. There are many different types of memory including random-access memory (RAM), read only memory (ROM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), and flash memory.
Flash memory devices have developed into a popular source of non-volatile memory for a wide range of electronic applications. Flash memory devices typically use a one-transistor memory cell that allows for high memory densities, high reliability, and low power consumption. Changes in threshold voltage of the memory cells, through programming (which is often referred to as writing) of charge storage structures (e.g., floating gates or charge traps) or other physical phenomena (e.g., phase change or polarization), determine the data value of each cell. Common uses for flash memory include personal computers, personal digital assistants (PDAs), digital cameras, digital media players, cellular telephones, solid state drives and removable memory modules, and the uses are growing.
There is a continuing desire to increase memory density, e.g., the number of bits of data that can be stored for a given integrated circuit die area. A variety of approaches can be used, such as reducing the size of individual memory cells, forming memory cells vertically (such as changing the orientation of the memory cells or forming memory cells on multiple planes), or increasing the possible number of data states to which each memory cell can be programmed.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for alternative methods of determining, assigning and/or using memory density, and devices to perform such methods.
USPTO Backgrounds
USPTO Backgrounds